TWI720190B - 電子零件的加工方法 - Google Patents

電子零件的加工方法 Download PDF

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Publication number
TWI720190B
TWI720190B TW106114301A TW106114301A TWI720190B TW I720190 B TWI720190 B TW I720190B TW 106114301 A TW106114301 A TW 106114301A TW 106114301 A TW106114301 A TW 106114301A TW I720190 B TWI720190 B TW I720190B
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TW
Taiwan
Prior art keywords
layer
resin film
resin
parts
item
Prior art date
Application number
TW106114301A
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English (en)
Chinese (zh)
Other versions
TW201806768A (zh
Inventor
上野恵子
徳安孝寛
大山恭之
山口雄志
池谷卓二
松永昌大
Original Assignee
日商昭和電工材料股份有限公司
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Publication of TW201806768A publication Critical patent/TW201806768A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW106114301A 2016-05-02 2017-04-28 電子零件的加工方法 TWI720190B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-092662 2016-05-02
JP2016092662 2016-05-02

Publications (2)

Publication Number Publication Date
TW201806768A TW201806768A (zh) 2018-03-01
TWI720190B true TWI720190B (zh) 2021-03-01

Family

ID=60202972

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106114301A TWI720190B (zh) 2016-05-02 2017-04-28 電子零件的加工方法

Country Status (4)

Country Link
JP (2) JP6926070B2 (ja)
KR (1) KR102239644B1 (ja)
TW (1) TWI720190B (ja)
WO (1) WO2017191815A1 (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6927866B2 (ja) * 2017-11-30 2021-09-01 日本カーバイド工業株式会社 保護フィルム用粘着剤組成物及び保護フィルム
JP7147163B2 (ja) * 2017-12-21 2022-10-05 昭和電工マテリアルズ株式会社 仮固定用樹脂フィルム、仮固定用樹脂フィルムシート、及び半導体装置の製造方法
KR20210104065A (ko) * 2018-12-20 2021-08-24 쇼와덴코머티리얼즈가부시끼가이샤 가고정용 수지 조성물, 가고정용 수지 필름 및 가고정용 시트 및 반도체 장치의 제조 방법
JP7221046B2 (ja) * 2018-12-26 2023-02-13 東京応化工業株式会社 接着剤組成物、積層体、積層体の製造方法、及び電子部品の製造方法
US11767453B2 (en) * 2018-12-31 2023-09-26 Samsung Sdi Co., Ltd. Silicone-based adhesive protective film and optical member comprising the same
JP7454922B2 (ja) * 2019-07-11 2024-03-25 信越化学工業株式会社 基板加工用仮接着材料及び積層体の製造方法
CN114600229A (zh) * 2019-10-31 2022-06-07 昭和电工材料株式会社 临时固定用树脂组合物、基板搬送用支承带及电子设备装置的制造方法
JP7409029B2 (ja) * 2019-11-15 2024-01-09 株式会社レゾナック 半導体装置の製造方法、並びにダイシング・ダイボンディング一体型フィルム及びその製造方法
JPWO2021112070A1 (ja) * 2019-12-02 2021-06-10
JP2021129061A (ja) * 2020-02-17 2021-09-02 力成科技股▲分▼有限公司 半導体製造装置および製造方法
JPWO2021220929A1 (ja) 2020-04-30 2021-11-04
JP2023101236A (ja) * 2022-01-07 2023-07-20 株式会社レゾナック 仮固定材形成用樹脂組成物、仮固定材、基板搬送用サポートテープ及び電子機器装置の製造方法
WO2023234155A1 (ja) * 2022-06-02 2023-12-07 日産化学株式会社 光照射剥離用の接着剤組成物、積層体、及び加工された半導体基板の製造方法

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TW201442113A (zh) * 2012-12-14 2014-11-01 Lintec Corp 保護膜形成用膜
JP2015135898A (ja) * 2014-01-17 2015-07-27 日立化成株式会社 研削された基材の製造方法、並びにこれに用いられるフィルム状粘着剤及び積層体

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JP2003147300A (ja) * 2001-11-12 2003-05-21 Lintec Corp ウエハ裏面研削時の表面保護シートおよび半導体チップの製造方法
JP4565804B2 (ja) 2002-06-03 2010-10-20 スリーエム イノベイティブ プロパティズ カンパニー 被研削基材を含む積層体、その製造方法並びに積層体を用いた極薄基材の製造方法及びそのための装置
JP2005019759A (ja) * 2003-06-27 2005-01-20 Mitsui Chemicals Inc 半導体ウェハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウェハ保護方法
JP2010238852A (ja) * 2009-03-31 2010-10-21 Mitsui Chemicals Inc 半導体製造用テープおよび半導体装置の製造方法
JP2011054940A (ja) * 2009-08-07 2011-03-17 Nitto Denko Corp 半導体ウェハ保持保護用粘着シート及び半導体ウェハの裏面研削方法
CN102695765B (zh) * 2009-12-24 2014-08-06 三键有限公司 临时固定组合物
JP2014154704A (ja) * 2013-02-08 2014-08-25 Hitachi Chemical Co Ltd ダイシング・ダイボンディング一体型テープ
JP6256478B2 (ja) * 2013-11-26 2018-01-10 Jsr株式会社 積層体、基材の処理方法、仮固定用組成物および半導体装置
CN105849215B (zh) * 2013-12-26 2019-09-03 日立化成株式会社 临时固定用膜、临时固定用膜片材及半导体装置
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WO2016140248A1 (ja) * 2015-03-04 2016-09-09 リンテック株式会社 フィルム状接着剤複合シート及び半導体装置の製造方法

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
TW201442113A (zh) * 2012-12-14 2014-11-01 Lintec Corp 保護膜形成用膜
JP2015135898A (ja) * 2014-01-17 2015-07-27 日立化成株式会社 研削された基材の製造方法、並びにこれに用いられるフィルム状粘着剤及び積層体

Also Published As

Publication number Publication date
JP6958674B2 (ja) 2021-11-02
WO2017191815A1 (ja) 2017-11-09
JP2020161823A (ja) 2020-10-01
JPWO2017191815A1 (ja) 2018-11-08
KR20180122460A (ko) 2018-11-12
TW201806768A (zh) 2018-03-01
JP6926070B2 (ja) 2021-08-25
KR102239644B1 (ko) 2021-04-12

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