KR102233763B1 - 웨이퍼 홀딩 장치 상의 플레이팅 검출 - Google Patents

웨이퍼 홀딩 장치 상의 플레이팅 검출 Download PDF

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KR102233763B1
KR102233763B1 KR1020140017501A KR20140017501A KR102233763B1 KR 102233763 B1 KR102233763 B1 KR 102233763B1 KR 1020140017501 A KR1020140017501 A KR 1020140017501A KR 20140017501 A KR20140017501 A KR 20140017501A KR 102233763 B1 KR102233763 B1 KR 102233763B1
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substrate holder
detection
substrate
cup
metal
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KR20140103082A (ko
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스티븐 티. 메이어
하이잉 푸
토마스 아난드 폰누스와미
브라이언 엘. 부캘루
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램 리써치 코포레이션
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
    • G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
    • G01N27/90—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents
    • G01N27/9046—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents by analysing electrical signals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Food Science & Technology (AREA)
  • Medicinal Chemistry (AREA)
KR1020140017501A 2013-02-15 2014-02-14 웨이퍼 홀딩 장치 상의 플레이팅 검출 Active KR102233763B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361765502P 2013-02-15 2013-02-15
US61/765,502 2013-02-15

Publications (2)

Publication Number Publication Date
KR20140103082A KR20140103082A (ko) 2014-08-25
KR102233763B1 true KR102233763B1 (ko) 2021-03-30

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Country Status (4)

Country Link
US (1) US9746427B2 (enExample)
JP (2) JP6334189B2 (enExample)
KR (1) KR102233763B1 (enExample)
TW (2) TWI708870B (enExample)

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US9228270B2 (en) 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
US9988734B2 (en) 2011-08-15 2018-06-05 Lam Research Corporation Lipseals and contact elements for semiconductor electroplating apparatuses
WO2013148890A1 (en) 2012-03-28 2013-10-03 Novellus Systems, Inc. Methods and apparatuses for cleaning electroplating substrate holders
KR102092416B1 (ko) 2012-03-30 2020-03-24 노벨러스 시스템즈, 인코포레이티드 역전류 디플레이팅을 이용한 전기도금 기판 홀더의 클리닝
US10416092B2 (en) 2013-02-15 2019-09-17 Lam Research Corporation Remote detection of plating on wafer holding apparatus
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TW201905250A (zh) * 2017-06-23 2019-02-01 美商應用材料股份有限公司 抑制金屬沉積之方法
KR102654656B1 (ko) * 2017-06-29 2024-04-05 램 리써치 코포레이션 웨이퍼 홀딩 장치 상의 도금의 리모트 검출
US11781238B2 (en) * 2019-05-20 2023-10-10 Applied Materials, Inc. Systems and methods for plate-up detection
US11920254B2 (en) 2021-08-30 2024-03-05 Taiwan Semiconductor Manufacturing Co., Ltd. Detection of contact formation between a substrate and contact pins in an electroplating system
CN116263515A (zh) * 2021-12-14 2023-06-16 盛美半导体设备(上海)股份有限公司 一种电镀腔漏镀预警方法及系统
CN114689795B (zh) * 2022-03-02 2025-02-14 无锡朋桥信息技术有限公司 一种电镀品质检测自动化装置
WO2025203470A1 (ja) * 2024-03-28 2025-10-02 株式会社荏原製作所 検出装置及び検出方法

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