KR102205661B1 - 기판 반송 로봇 및 기판 반송 장치 - Google Patents

기판 반송 로봇 및 기판 반송 장치 Download PDF

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Publication number
KR102205661B1
KR102205661B1 KR1020187027044A KR20187027044A KR102205661B1 KR 102205661 B1 KR102205661 B1 KR 102205661B1 KR 1020187027044 A KR1020187027044 A KR 1020187027044A KR 20187027044 A KR20187027044 A KR 20187027044A KR 102205661 B1 KR102205661 B1 KR 102205661B1
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South Korea
Prior art keywords
substrate transfer
lifting
guide rail
cover
robot
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KR1020187027044A
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English (en)
Korean (ko)
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KR20180116338A (ko
Inventor
다케시 시바타
Original Assignee
가와사끼 쥬고교 가부시끼 가이샤
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    • H01L21/67742—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B25J18/02—Arms extensible
    • B25J18/04—Arms extensible rotatable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/06—Program-controlled manipulators characterised by multi-articulated arms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/902—Devices for picking-up and depositing articles or materials provided with drive systems incorporating rotary and rectilinear movements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H10P72/00
    • H01L21/67706—
    • H01L21/67712—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
KR1020187027044A 2016-02-26 2017-02-27 기판 반송 로봇 및 기판 반송 장치 Active KR102205661B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016036421A JP6901828B2 (ja) 2016-02-26 2016-02-26 基板搬送ロボットおよび基板搬送装置
JPJP-P-2016-036421 2016-02-26
PCT/JP2017/007362 WO2017146252A1 (ja) 2016-02-26 2017-02-27 基板搬送ロボットおよび基板搬送装置

Publications (2)

Publication Number Publication Date
KR20180116338A KR20180116338A (ko) 2018-10-24
KR102205661B1 true KR102205661B1 (ko) 2021-01-21

Family

ID=59686363

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187027044A Active KR102205661B1 (ko) 2016-02-26 2017-02-27 기판 반송 로봇 및 기판 반송 장치

Country Status (6)

Country Link
US (1) US10867826B2 (https=)
JP (1) JP6901828B2 (https=)
KR (1) KR102205661B1 (https=)
CN (1) CN108698222B (https=)
TW (1) TWI643797B (https=)
WO (1) WO2017146252A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
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DE112016005469T5 (de) * 2015-11-30 2018-08-09 Life Robotics Inc. Linearbewegung-Teleskopmechanismus
JP6725640B2 (ja) * 2016-02-29 2020-07-22 ライフロボティクス株式会社 ロボットアーム機構及び直動伸縮機構
WO2017150315A1 (ja) * 2016-02-29 2017-09-08 ライフロボティクス株式会社 直動伸縮機構及びそれを備えたロボットアーム機構
JP6773768B2 (ja) * 2016-03-29 2020-10-21 ライフロボティクス株式会社 ねじり回転関節機構及びロボットアーム機構
CN108883539B (zh) * 2016-03-29 2021-11-02 生活机器人学股份有限公司 机械臂机构及旋转关节装置
CN111421571A (zh) * 2019-01-09 2020-07-17 苏州吉泰兴机电设备有限公司 一种四轴机器人
CN109703972B (zh) * 2019-02-12 2024-05-14 合肥憬望智能科技有限公司 一种三站合一的自动化晶粒入料装置
US12202124B2 (en) * 2020-09-03 2025-01-21 Kawasaki Jukogyo Kabushiki Kaisha Substrate conveying robot
JP7662388B2 (ja) * 2021-04-09 2025-04-15 川崎重工業株式会社 基板搬送ロボットおよび基板搬送装置
JP7732766B2 (ja) * 2021-04-23 2025-09-02 川崎重工業株式会社 基板搬送ロボットおよび基板搬送装置
CN116352690B (zh) * 2023-06-01 2023-08-22 沈阳芯达科技有限公司 一种基于大气机械手的垂直行程增程机构

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JP2006198760A (ja) * 2005-01-17 2006-08-03 Samsung Electronics Co Ltd ハンドリングロボットの静的そり補正方法及び装置
JP2008264980A (ja) * 2007-04-24 2008-11-06 Kawasaki Heavy Ind Ltd 基板搬送ロボット
JP2013051443A (ja) 2007-11-21 2013-03-14 Yaskawa Electric Corp 搬送ロボット、筐体、半導体製造装置およびソータ装置
JP2015036185A (ja) * 2013-08-09 2015-02-23 日本電産サンキョー株式会社 産業用ロボット

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JP2006005362A (ja) * 2004-06-18 2006-01-05 Samsung Electronics Co Ltd 基板搬送装置
JP2006198760A (ja) * 2005-01-17 2006-08-03 Samsung Electronics Co Ltd ハンドリングロボットの静的そり補正方法及び装置
JP2008264980A (ja) * 2007-04-24 2008-11-06 Kawasaki Heavy Ind Ltd 基板搬送ロボット
JP2013051443A (ja) 2007-11-21 2013-03-14 Yaskawa Electric Corp 搬送ロボット、筐体、半導体製造装置およびソータ装置
JP2015036185A (ja) * 2013-08-09 2015-02-23 日本電産サンキョー株式会社 産業用ロボット

Also Published As

Publication number Publication date
JP2017148925A (ja) 2017-08-31
TW201736233A (zh) 2017-10-16
US20190054613A1 (en) 2019-02-21
TWI643797B (zh) 2018-12-11
CN108698222B (zh) 2021-11-09
US10867826B2 (en) 2020-12-15
JP6901828B2 (ja) 2021-07-14
WO2017146252A1 (ja) 2017-08-31
CN108698222A (zh) 2018-10-23
KR20180116338A (ko) 2018-10-24

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