TW201736233A - 基板搬送機器人及基板搬送裝置 - Google Patents

基板搬送機器人及基板搬送裝置 Download PDF

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TW201736233A
TW201736233A TW106106475A TW106106475A TW201736233A TW 201736233 A TW201736233 A TW 201736233A TW 106106475 A TW106106475 A TW 106106475A TW 106106475 A TW106106475 A TW 106106475A TW 201736233 A TW201736233 A TW 201736233A
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lifting
substrate transfer
transfer robot
robot
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Takeshi Shibata
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Kawasaki Heavy Ind Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B25J18/02—Arms extensible
    • B25J18/04—Arms extensible rotatable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/06—Programme-controlled manipulators characterised by multi-articulated arms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/902—Devices for picking-up and depositing articles or materials provided with drive systems incorporating rotary and rectilinear movements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Manufacturing & Machinery (AREA)
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Abstract

本發明之機器人具備：升降驅動機構(1)，其使具有保持基板之末端執行器之機械手臂升降；及覆蓋體器件，其覆蓋升降驅動機構(1)；升降驅動機構(1)具有：固定部(2)，其具有於上下方向延伸之導軌(10)；及升降部(3)，其沿著導軌(10)被升降驅動；機械手臂具有：基部連桿(4)，其連結於升降部(3)；及連桿構件，其連結於基部連桿(4)；覆蓋體器件具有：固定側覆蓋體(20)，其設置於固定部(2)，供升降部(3)於其內部移動；及導軌用覆蓋體(19)，其設置於升降部(3)，覆蓋升降部(3)下降時露出之導軌(10)之上部。本發明可提供一種能夠使基板搬送裝置小型化且未伴隨機械手臂之剛性降低等不良狀況之基板搬送機器人。

Description

基板搬送機器人及基板搬送裝置
本發明係關於一種用以搬送半導體製造用之晶圓等之基板之基板搬送機器人、及具備該機器人之基板搬送裝置。
作為使用基板搬送機器人之裝置之一例，關於半導體製造裝置，於圖1及圖2中顯示其之代表性者。半導體製造裝置101具備：晶圓處理裝置106，其處理半導體晶圓W；前開式晶圓盒(FOUP：Front Opening Unified Pod)102，其係收納晶圓W之容器；及晶圓搬送裝置(基板搬送裝置)，其用以於晶圓處理裝置106與前開式晶圓盒102之間搬送晶圓W。 於前開式晶圓盒102，收納有處理前或處理後之晶圓W，於晶圓處理裝置106中，進行熱處理、雜質導入處理、薄膜形成處理、微影法處理、洗淨處理及平坦化處理等之製程處理。 晶圓處理裝置106具備：處理空間形成部112，其形成處理空間111；處理裝置本體(省略圖示)，其配置於處理空間111之內部，且處理晶圓W；及處理空間調整裝置(省略圖示)，其調整充滿處理空間111之環境氣體。 晶圓搬送裝置107具備：準備空間形成部117，其形成準備空間116；基板搬送機器人31，其配置於準備空間116；對準器119，其配置於準備空間116，且調整晶圓W之方向；及準備空間調整裝置(省略圖示)，其調整充滿準備空間116之環境氣體。 準備空間形成部117形成為長方體箱狀，基板搬送機器人31配置於準備空間116之長邊方向之大致中央部。 基板搬送機器人31自前開式晶圓盒內空間105取出晶圓W，且將晶圓W放入前開式晶圓盒內空間105。此外基板搬送機器人31自處理空間111取出晶圓W，且將晶圓W放入處理空間111。 又，基板搬送機器人31於自前開式晶圓盒102將晶圓W搬送至晶圓處理裝置106時，暫時將自前開式晶圓盒102取出之晶圓W搬送至對準器119，且將各晶圓W之方向設為相同並對晶圓處理裝置106進行晶圓之放入。 基板搬送機器人31係SCARA(Selective Compliance Assembly Robot Arm：選擇順應性裝配機械手臂)型之水平多關節機器人，具備：機械手臂62；基台63，其連結機械手臂62之基端部；及機械手(末端執行器)64，其連結機械手臂62之前端部，且固持晶圓W。機械手臂62具有第1及第2連桿65、66。 又，為了進行用以將前開式晶圓盒102內收納為上下複數段之晶圓W取出並放入晶圓處理裝置106的上下方向之移動，基台63具有：固定部46，其固定於設置面45；及升降部47，其設置為可相對於固定部46於上下方向變位(參照圖2)。於升降部47，可回旋地設置有機械手臂62之基端部。升降部47以形成為圓筒狀，且其軸線於上下方向延伸之方式設置。升降部47之上部成為基台63之上部。藉由升降驅動升降部47，設置於機械手臂62之前端部之機械手64之位置作上下變化。 因包含基台63之基板搬送機器人31配設於潔淨環境即準備空間116內，故為了防止由升降部47之升降時產生之粉塵等所致之升降部準備空間116內之污染，固定部46或升降部47被收納於框體67內，且於貫通框體67之頂板部之升降部47之延伸部設置有機械手臂62。 於上述之晶圓搬送裝置107中，為了容易維持潔淨環境等，較理想為使準備空間之大小，即準備空間形成部117之容積儘可能小。 例如，於專利文獻1中，為了減小準備空間之深度方向(與前開式晶圓盒之並列方向正交之方向)之尺寸，而將基板搬送機器人31配置成靠近於準備空間之深度方向之一側，藉此將收起機械手臂時之至臂前端之長度減小。 然而，於該情形時，仍然無法將準備空間之深度方向之尺寸設為較構成機械手臂之各連桿之長度更小之尺寸。 如此，對於晶圓搬送裝置107所使用之基板搬送機器人31謀求如下之所謂相反之要求：將水平面內之最大到達距離維持為特定之大小，另一方面使收起機械手臂時之至臂前端之長度儘可能短。 對於此種要求，因可能產生新污染源之移動軸(使機器人於前開式晶圓盒之並列方向上行進之軸)之配設欠佳，故考慮藉由增加構成機械手臂之連桿之支數，且減短各連桿之長度來解決。 然而，為了防止基板搬送機器人之動作時之振動，必須充分確保構成機械手臂之各連桿之剛性，結果是若為了充分確保剛性而在維持各連桿之上下方向之高度(厚度)下使連桿之個數增加，則機械手臂整體之上下方向之高度(厚度)會根據連桿個數之增加而增加，使固持晶圓之機械手之最低高度較先前變高。因此，有所謂之機械手無法對收納於前開式晶圓盒內之最下位置之晶圓進行存取的問題。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利第4980127號公報
[發明所欲解決之問題] 本發明係鑒於上述先前技術之問題點而完成者，其提供一種可使基板搬送裝置小型化且未伴隨機械手臂之剛性降低等不良狀況之基板搬送機器人、及具備該機器人之基板搬送裝置。 [解決問題之技術手段] 為了解決上述問題，本發明之第1態樣之基板搬送機器人之特徵在於，具備：機械手臂，其於前端部具有用以保持基板之末端執行器；升降驅動機構，其用以使上述機械手臂升降；及覆蓋體器件，其用以覆蓋上述升降驅動機構；且上述升降驅動機構具有：固定部，其設置有於上下方向延伸之導軌；及升降部，其沿著上述導軌被升降驅動；上述機械手臂具有：基部連桿，其可回旋地連結於上述升降部；及連桿構件，其可回旋地連結於上述基部連桿，且包含上述前端部；上述覆蓋體器件具有：固定側覆蓋體，其設置於上述固定部，供上述升降部於其內部移動；及導軌用覆蓋體，其設置於上述升降部，用以覆蓋上述升降部下降時露出之上述導軌之上部。 本發明之第2態樣係如第1態樣，其特徵在於，構成為於上述升降部下降至最下點時，上述基部連桿之上表面之高度與上述固定部之上表面之高度大致相同或較其更下方。 本發明之第3態樣係如第1或第2之態樣，其特徵在於，構成為於上述升降部下降至最下點時，上述導軌用覆蓋體之上端與上述固定部之上表面之高度大致相同。 本發明之第4態樣如第1至第3中任一者之態樣，其特徵在於，上述連桿構件具有互相可回旋地連結之2個以上之連桿。 為了解決上述課題，本發明之第5態樣之基板搬送裝置之特徵在於，具備第1至第4中任一者之態樣之基板搬送機器人、及於內部設置有上述基板搬送機器人之準備空間形成部。 本發明之第6態樣係如第5態樣，其特徵在於，上述基板搬送機器人具有包含上述升降驅動機構之基台，且上述基台靠近配置於上述準備空間形成部之內部之深度方向之一側。 [發明之效果] 根據本發明，可提供一種能夠使基板搬送裝置小型化且未伴隨機械手臂之剛性降低等不良狀況之基板搬送機器人。
以下，對本發明之一實施形態之基板搬送機器人，參照圖式予以說明。 如圖3至圖5所示，本實施形態之基板搬送機器人具備用以使機械手臂升降之升降驅動機構1，該升降驅動機構1具有：固定部2，其固定於設置面；及升降部3，其可升降地設置於固定部2之側部。於升降部3之上部，可水平回旋地設置有機械手臂之基部連桿4。於機械手臂之前端部，設置有用以保持基板之機械手(末端執行器)(省略圖示)。 升降驅動機構1之固定部2具備外形設為縱向較長之大致長方體形狀之固定側殼體5(參照圖3、圖4、圖8至圖10)。於固定側殼體5之內部，配設有：滾珠螺桿6，其用以使升降部3升降；螺母構件7，其與滾珠螺桿6卡合，藉由滾珠螺桿6之旋轉而升降；馬達8，其旋轉驅動滾珠螺桿6；及動力傳遞機構即滑輪機構9，其用以將馬達8之驅動力傳遞至滾珠螺桿6。 又，於固定部2之連結升降部3之側面之外表面，設置特定間隔而平行地配設有2條於上下方向延伸之導軌10。進而，於固定側殼體5之內部下部，配設有用以將內部之空氣自下方朝外部排出而於內部產生向下氣流之風扇11。 升降部3具備：可動側殼體12(參照圖3、4)，其外形成為縱向較長之大致長方體形狀，且底部開放，頂板面及4個側面以板狀構件連結。於可動側殼體12之與固定部2之連結側之面，配設有連結於固定部2之固定側殼體5內之螺母構件7之支持構件13、與導軌10卡合並上下升降之塊狀之移動體14。另，移動體14係為了移動之穩定性、確實性，而2個串列地配設於導軌10之各者。 因支持構件13貫通與升降部3連結之側之固定側殼體5之側面壁，故於固定側殼體5之上述側面壁，為了使支持構件13能夠升降，而設置有與升降部3之升降行程對應長度之縱向細長的開口15(參照圖3、4)。 於升降部3之可動側殼體12之上表面，可回旋地設置有機械手臂之基部連桿4，於可動側殼體12之內部，配設有：電纜配置區域16，其引繞有通往配設於基部連桿4及其前端之連桿構件(包含1個或2個以上之連桿)之內部之伺服馬達等之電力供給電纜或信號電纜。又，於可動側殼體12內，為了於升降部3升降時之該等電纜類之處理而配設有電纜保護鏈條(Cableveyor)(註冊商標)17。 於本實施形態中，於機械手臂位於最下位置之情形時，如圖3所示，以基部連桿4之上表面與固定側殼體5之上表面成為大致相同高度之方式，設定可動側殼體12之上表面之高度。 因此，如圖13所示，藉由使用具有將先前之基板搬送裝置所使用之2支連桿短化成之第1連桿65A及第2連桿66A之水平回旋型臂機構作為連結於基部連桿4之連桿構件而構成機械手臂62A，可在不使各連桿之剛性降低下，將臂部前端之機械手之高度位置維持為與先前相同。 其結果，於本實施形態之基板搬送機器人中，可在不使各連桿之剛性降低下包含基部連桿4將連桿之支數設為3支，且可於實現與先前之2支連桿之基板搬送機器人相同之機械手最大到達距離時，減短各連桿之長度。 且，如圖13所示將基板搬送機器人之基台63配置成靠近於準備空間形成部116之內部之深度方向之一側，藉此因晶圓搬送裝置之準備空間116之深度方向之尺寸依存於基板搬送機器人之各連桿之長度而設定，故可伴隨各連桿之長度變短而減小準備空間之寬度。即，根據本實施形態之基板搬送機器人，藉由使各連桿之長度較先前者變短，可一面確保特定之手最大到達距離，一面使準備空間之寬度減少。 又，於如上所述之本實施形態中，於機械手臂位於最下位置之情形，可動側殼體12之上表面之高度以基部連桿4之上表面與固定側殼體5之上表面成為大致相同高度之方式設定。 因此，可動側殼體12之上表面位於較固定側殼體5之上表面低大致基部連桿4之高度(厚度)之位置，其結果，於使升降部3下降至最下點時，導軌10之上部露出。若導軌10之上部露出，則有由來自該處之粉塵等污染準備空間之可能性，因而需要某種對策。 因此，於本實施形態中，藉由採用下述之構成，謀求防止以導軌10為污染源之污染。 即，用以覆蓋升降部3下降時露出之導軌10之上部的導軌用覆蓋體19被設置於升降部3之上部。具體而言，導軌用覆蓋體19係作為可動側殼體12之與固定部2之連結面之上方延長部而形成。可動側殼體12及導軌用覆蓋體19構成用以覆蓋升降驅動機構1之覆蓋體器件之一部分。 導軌用覆蓋體19之寬度與可動側殼體12之與固定部2之連結面大致相同，至於高度則以於升降部3下降至最下點之位置時，覆蓋露出之導軌10之上部表面之方式設定。 另，為了防止來自導軌10之粉塵等流入準備空間，較理想為使導軌10與後述之頂板部覆蓋體21之間隙極小化，為此，導軌用覆蓋體19設為與固定側殼體5之上表面之高度大致相同。 又，於固定側殼體5，具備：固定側覆蓋體20，其具有與可動側殼體12中除了與固定側殼體5連結之側部以外之側部之外表面接近的側面及底面，且上部開放。固定側殼體5及固定側覆蓋體20構成用以覆蓋升降驅動機構1之覆蓋體器件之一部分。 構成升降部3之可動側殼體12經由固定側覆蓋體20之開放上部而升降，藉此可出入於固定側覆蓋體20之內部，且可於可動側殼體12位於下降至最下點之位置時，將可動側殼體12之較大致上端部之高度更下方之部分之整體或一部分收納於固定側覆蓋體20之內部。 由於固定側覆蓋體20之側部內面形成為接近於可動側殼體12之側部外表面之形狀，藉而可抑制固定側覆蓋體20之內部之粉塵等經由固定側覆蓋體20之側部內面與可動側殼體12之側部外表面之間隙向外部放出。 另，於固定側覆蓋體20設置有底面之理由在於：因於可動側殼體12上升時，固定側覆蓋體20之內部與導軌10存在之空間連通(例如參照圖6)，故將固定側覆蓋體20之內部形成為密閉空間，藉此來防止粉塵等向外部放出。 又，固定側覆蓋體20之上端構成為於可動側殼體12位於上升至最上點之位置時，較可動側殼體12之下端之高度更上方。藉此，即使可動側殼體12位於上升至最上點之位置時，亦因可動側殼體12之側部之下部收納於固定側覆蓋體20之內部，故可抑制固定側覆蓋體20之內部之粉塵等經由固定側覆蓋體20之側部內面與可動側殼體12之側部外表面之間隙向外部放出。 又，於固定側殼體5之上表面，連結有其前端部於導軌10之上方突出至接近於導軌用覆蓋體19之位置之凸緣狀之頂板部覆蓋體21。進而，於導軌10之側方，連結有其前端部突出至導軌用覆蓋體19之位置或超過其之位置之凸緣狀之側部覆蓋體22。(圖4) 分別於圖6及圖7中顯示使升降部3上升至最上點之位置之與圖3及圖4對應之圖面。又，分別於圖8至圖12中顯示與圖3至圖7對應之外形圖。 如該等之圖所示，導軌10於升降部3下降且位於下方時，被主要由導軌用覆蓋體19、可動側殼體12之前表面(與固定部2之連結部側面)、頂板部覆蓋體21及側部覆蓋體22形成之空間閉鎖，於升降部3上升且位於上方時，被主要由可動側殼體12之前表面(與固定部2之連結部側面)、固定側覆蓋體20、頂板部覆蓋體21及側部覆蓋體22形成之空間閉鎖。 藉此，本實施形態之基板搬送機器人因於升降部3之全升降行程中，未露出可能成為對於潔淨氛圍之污染源之導軌10之表面，故可維持準備空間之潔淨氛圍。 另，於本實施形態中，如圖4所示，可動側殼體12成為包含前表面在內連結板狀構件而成之構造，故電纜保護鏈條17之固定端部18由配設於與固定部2之固定側殼體5連結之固定側覆蓋體20之底部之電纜保護鏈條支持部23支持，且電纜類經由固定側覆蓋體20之下部及可動側殼體12之底部開放端等，而連接電纜保護鏈條固定端部18之端子部與固定側殼體5內之端子盤。 於上述實施形態中，如圖13所示，將基板搬送機器人之基台63配置成靠近於準備空間116之深度方向中之晶圓處理裝置106側，但亦可配置於前開式晶圓盒102側。
1‧‧‧基板搬送機器人之升降驅動機構 2‧‧‧固定部 3‧‧‧升降部 4‧‧‧基部連桿 5‧‧‧固定側殼體(固定部用覆蓋體) 6‧‧‧滾珠螺桿 7‧‧‧螺母構件 8‧‧‧馬達 9‧‧‧滑輪機構 10‧‧‧導軌 11‧‧‧風扇 12‧‧‧可動側殼體 13‧‧‧支持構件 14‧‧‧移動體 15‧‧‧開口 16‧‧‧電纜配置區域 17‧‧‧電纜保護鏈條 18‧‧‧電纜保護鏈條固定端部 19‧‧‧導軌用覆蓋體 20‧‧‧固定側覆蓋體 21‧‧‧頂板部覆蓋體 22‧‧‧側部覆蓋體 23‧‧‧電纜保護鏈條支持部 31‧‧‧基板搬送機器人 45‧‧‧設置面 46‧‧‧固定部 47‧‧‧升降部 62‧‧‧機械手臂 62A‧‧‧機械手臂 63‧‧‧基台 64‧‧‧機械手(末端執行器) 65‧‧‧第1連桿 65A‧‧‧第1連桿 66‧‧‧第2連桿 66A‧‧‧第2連桿 67‧‧‧框體 101‧‧‧半導體製造裝置 102‧‧‧前開式晶圓盒(FOUP) 105‧‧‧前開式晶圓盒內空間 106‧‧‧晶圓處理裝置 107‧‧‧晶圓搬送裝置 111‧‧‧處理空間 112‧‧‧處理空間形成部 116‧‧‧準備空間 117‧‧‧準備空間形成部 119‧‧‧對準器 A-A‧‧‧線 W‧‧‧晶圓 X-X‧‧‧線 Y-Y‧‧‧線
圖1係顯示半導體製造裝置之一例之俯視圖。 圖2係圖1所示之半導體製造裝置之縱剖視圖。 圖3係顯示於本發明之一實施形態之基板搬送機器人中，使升降部下降至最下點之狀態之固定部及升降部之構造之剖視圖。 圖4係圖3之A-A剖視圖。 圖5係圖3之X-X剖視圖。 圖6係顯示於圖3所示之基板搬送機器人中，使升降部上升至最上點之狀態之固定部及升降部之構造之剖視圖。 圖7係圖6之Y-Y剖視圖。 圖8係顯示於圖3所示之基板搬送機器人中，使升降部下降至最下點之狀態之固定部及升降部之外形圖。 圖9係圖8之右側視圖。 圖10係圖8之俯視圖。 圖11係顯示於圖3所示之基板搬送機器人中，使升降部上升至最上點之狀態之固定部及升降部之外形圖。 圖12係圖11之右側視圖。 圖13係顯示具備圖3所示之基板搬送機器人之基板搬送裝置之俯視圖。
1‧‧‧升降驅動機構
2‧‧‧固定部
3‧‧‧升降部
4‧‧‧基部連桿
5‧‧‧固定側殼體
6‧‧‧滾珠螺桿
7‧‧‧螺母構件
8‧‧‧馬達
9‧‧‧滑輪機構
10‧‧‧導軌
11‧‧‧風扇
12‧‧‧可動側殼體
13‧‧‧支持構件
14‧‧‧移動體
15‧‧‧開口
16‧‧‧電纜配置區域
19‧‧‧導軌用覆蓋體
20‧‧‧固定側覆蓋體
21‧‧‧頂板部覆蓋體
A-A‧‧‧線
X-X‧‧‧線

Claims (6)

  1. 一種基板搬送機器人，其特徵在於具備： 機械手臂，其於前端部具有用以保持基板之末端執行器； 升降驅動機構，其用以使上述機械手臂升降；及 覆蓋體器件，其用以覆蓋上述升降驅動機構；且 上述升降驅動機構具有：固定部，其設置有於上下方向延伸之導軌；及升降部，其沿著上述導軌被升降驅動； 上述機械手臂具有：基部連桿，其可回旋地連結於上述升降部；及連桿構件，其可回旋地連結於上述基部連桿，且包含上述前端部； 上述覆蓋體器件具有：固定側覆蓋體，其設置於上述固定部，供上述升降部於其內部移動；及導軌用覆蓋體，其設置於上述升降部，用以覆蓋上述升降部下降時露出之上述導軌之上部。
  2. 如請求項1之基板搬送機器人，其中構成為於上述升降部下降至最下點時，上述基部連桿之上表面之高度與上述固定部之上表面之高度大致相同或較其更下方。
  3. 如請求項1或2之基板搬送機器人，其中構成為於上述升降部下降至最下點時，上述導軌用覆蓋體之上端與上述固定部之上表面之高度大致相同。
  4. 如請求項1或2之基板搬送機器人，其中上述連桿構件具有互相可回旋地連結之2個以上之連桿。
  5. 一種基板搬送裝置，其具備： 如請求項1至4中任一項之基板搬送機器人；及 準備空間形成部，其內部設置有上述基板搬送機器人。
  6. 如請求項5之基板搬送裝置，其中上述基板搬送機器人具有包含上述升降驅動機構之基台；且 上述基台配置成靠近於上述準備空間形成部之內部之深度方向之一側。
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