KR102200822B1 - 피복 구리 입자 및 그의 제조 방법 - Google Patents
피복 구리 입자 및 그의 제조 방법 Download PDFInfo
- Publication number
- KR102200822B1 KR102200822B1 KR1020177010816A KR20177010816A KR102200822B1 KR 102200822 B1 KR102200822 B1 KR 102200822B1 KR 1020177010816 A KR1020177010816 A KR 1020177010816A KR 20177010816 A KR20177010816 A KR 20177010816A KR 102200822 B1 KR102200822 B1 KR 102200822B1
- Authority
- KR
- South Korea
- Prior art keywords
- copper
- copper particles
- carboxylic acid
- coated copper
- aliphatic carboxylic
- Prior art date
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Images
Classifications
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- B22F1/02—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/10—Copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Powder Metallurgy (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014203242A JP6368925B2 (ja) | 2014-10-01 | 2014-10-01 | 被覆銅粒子及びその製造方法 |
JPJP-P-2014-203242 | 2014-10-01 | ||
PCT/JP2015/076764 WO2016052275A1 (ja) | 2014-10-01 | 2015-09-18 | 被覆銅粒子及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20170067785A KR20170067785A (ko) | 2017-06-16 |
KR102200822B1 true KR102200822B1 (ko) | 2021-01-12 |
Family
ID=55630315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020177010816A KR102200822B1 (ko) | 2014-10-01 | 2015-09-18 | 피복 구리 입자 및 그의 제조 방법 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6368925B2 (ja) |
KR (1) | KR102200822B1 (ja) |
CN (1) | CN107073578B (ja) |
TW (1) | TWI648111B (ja) |
WO (1) | WO2016052275A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7222904B2 (ja) * | 2017-11-13 | 2023-02-15 | 京セラ株式会社 | ペースト組成物、半導体装置及び電気・電子部品 |
JP6892120B2 (ja) * | 2017-11-28 | 2021-06-18 | 協立化学産業株式会社 | 被覆金属粒子、導電性組成物、導電体、接合用積層体、回路形成物及び焼結体の製造方法 |
WO2019106739A1 (ja) * | 2017-11-29 | 2019-06-06 | 国立大学法人北海道大学 | 低温焼結性銅粒子とそれを用いた焼結体の製造方法 |
KR102509366B1 (ko) * | 2018-01-26 | 2023-03-10 | 닛신 엔지니어링 가부시키가이샤 | 은 미립자의 제조 방법 |
CN111819018B (zh) * | 2018-01-26 | 2023-07-28 | 日清工程株式会社 | 微粒子的制造方法及微粒子 |
JP6818359B2 (ja) * | 2018-03-19 | 2021-01-20 | 協立化学産業株式会社 | 導電性ペースト組成物、導電体、導電性ペースト組成物の塗工方法、及び導電体の製造方法 |
US20220402029A1 (en) | 2019-11-18 | 2022-12-22 | Nisshin Engineering Inc. | Fine particle production device and fine particle production method |
JP7380256B2 (ja) * | 2020-01-28 | 2023-11-15 | 三菱マテリアル株式会社 | 接合用シート |
US11980935B2 (en) * | 2020-03-31 | 2024-05-14 | Mitsui Mining & Smelting Co., Ltd. | Copper particles and method for producing same |
JP7121884B1 (ja) | 2021-03-29 | 2022-08-19 | 三菱マテリアル株式会社 | 銅粒子及びその製造方法 |
WO2024143517A1 (ja) * | 2022-12-29 | 2024-07-04 | 邦宏 福本 | 焼結金属材料、焼結用金属微粒子及びそれらの製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008013837A (ja) | 2006-07-10 | 2008-01-24 | Sumitomo Metal Mining Co Ltd | 微小銅粉及びその製造方法 |
JP2013159830A (ja) * | 2012-02-06 | 2013-08-19 | Toyota Central R&D Labs Inc | 表面被覆金属ナノ粒子、およびその製造方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1061579C (zh) * | 1995-03-08 | 2001-02-07 | 上海市合成树脂研究所 | 电磁屏蔽导电涂料用铜粉的制备方法 |
KR100877115B1 (ko) * | 2001-04-27 | 2009-01-07 | 도와 홀딩스 가부시끼가이샤 | 내산화성이 우수한 전기전도 페이스트용 구리 분말 및이의 제법 |
JP3890205B2 (ja) | 2001-05-10 | 2007-03-07 | 三井金属鉱業株式会社 | 銅ペースト用の表面処理銅粉、その表面処理銅粉の製造方法、その表面処理銅粉を用いた銅ペースト及びその銅ペーストを用いたプリント配線板 |
JP4195581B2 (ja) | 2002-05-27 | 2008-12-10 | 三井金属鉱業株式会社 | 銅粉の製造方法及びその方法で得られた銅粉 |
JP4530617B2 (ja) | 2003-01-23 | 2010-08-25 | 三井金属鉱業株式会社 | 銅ペースト用の銅粉の製造方法及びその製造方法により得られる銅ペースト用の銅粉 |
EP1660243A4 (en) * | 2003-07-09 | 2011-11-16 | Fry Metals Inc | ÜBERZUGSMETALLTEILCHEN |
US8083972B2 (en) * | 2005-07-25 | 2011-12-27 | Sumitomo Metal Mining Co., Ltd. | Copper particulate dispersions and method for producing the same |
JP5205717B2 (ja) * | 2006-07-04 | 2013-06-05 | セイコーエプソン株式会社 | ギ酸銅錯体、銅粒子の製造方法および配線基板の製造方法 |
KR100814295B1 (ko) * | 2006-10-10 | 2008-03-18 | 삼성전기주식회사 | 구리 나노입자의 제조방법 및 그에 의해 제조된 구리나노입자 |
CN100556584C (zh) * | 2007-03-26 | 2009-11-04 | 中南大学 | 一种导电浆料用铜粉的表面修饰方法 |
CN101835555B (zh) * | 2007-11-05 | 2012-08-22 | 住友金属矿山株式会社 | 铜微粒和其制造方法及铜微粒分散液 |
JP5426270B2 (ja) * | 2009-08-04 | 2014-02-26 | ハリマ化成株式会社 | 金属銅微粒子の製造方法 |
JP6241908B2 (ja) * | 2011-02-04 | 2017-12-06 | 国立大学法人山形大学 | 被覆金属微粒子とその製造方法 |
JP5342597B2 (ja) * | 2011-04-15 | 2013-11-13 | 福田金属箔粉工業株式会社 | 銅超微粒子分散ペーストおよび導電膜の形成方法 |
JP5848552B2 (ja) | 2011-08-29 | 2016-01-27 | 日立金属株式会社 | 銅微粒子分散液の製造方法、銅微粒子の製造方法、銅微粒子分散液および銅微粒子 |
CN102601355A (zh) * | 2012-03-20 | 2012-07-25 | 昆明理工大学 | 一种提高铜金粉耐腐蚀性的表面改性方法 |
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2014
- 2014-10-01 JP JP2014203242A patent/JP6368925B2/ja active Active
-
2015
- 2015-09-18 WO PCT/JP2015/076764 patent/WO2016052275A1/ja active Application Filing
- 2015-09-18 KR KR1020177010816A patent/KR102200822B1/ko active IP Right Grant
- 2015-09-18 CN CN201580053024.6A patent/CN107073578B/zh active Active
- 2015-09-30 TW TW104132187A patent/TWI648111B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008013837A (ja) | 2006-07-10 | 2008-01-24 | Sumitomo Metal Mining Co Ltd | 微小銅粉及びその製造方法 |
JP2013159830A (ja) * | 2012-02-06 | 2013-08-19 | Toyota Central R&D Labs Inc | 表面被覆金属ナノ粒子、およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN107073578A (zh) | 2017-08-18 |
KR20170067785A (ko) | 2017-06-16 |
WO2016052275A1 (ja) | 2016-04-07 |
CN107073578B (zh) | 2019-01-15 |
JP2016069716A (ja) | 2016-05-09 |
JP6368925B2 (ja) | 2018-08-08 |
TW201617152A (zh) | 2016-05-16 |
TWI648111B (zh) | 2019-01-21 |
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