KR102193964B1 - 프로브 카드용 가이드판 - Google Patents

프로브 카드용 가이드판 Download PDF

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Publication number
KR102193964B1
KR102193964B1 KR1020140026622A KR20140026622A KR102193964B1 KR 102193964 B1 KR102193964 B1 KR 102193964B1 KR 1020140026622 A KR1020140026622 A KR 1020140026622A KR 20140026622 A KR20140026622 A KR 20140026622A KR 102193964 B1 KR102193964 B1 KR 102193964B1
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South Korea
Prior art keywords
hole
probe
silicon substrate
guide plate
oxide film
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Korean (ko)
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KR20140114288A (ko
Inventor
텟페이 키무라
아키노리 시라이시
코스케 후지하라
Original Assignee
일본전자재료(주)
신코 덴키 코교 가부시키가이샤
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Publication of KR20140114288A publication Critical patent/KR20140114288A/ko
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020140026622A 2013-03-18 2014-03-06 프로브 카드용 가이드판 Active KR102193964B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013054498A JP6235785B2 (ja) 2013-03-18 2013-03-18 プローブカード用ガイド板およびプローブカード用ガイド板の製造方法
JPJP-P-2013-054498 2013-03-18

Publications (2)

Publication Number Publication Date
KR20140114288A KR20140114288A (ko) 2014-09-26
KR102193964B1 true KR102193964B1 (ko) 2020-12-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140026622A Active KR102193964B1 (ko) 2013-03-18 2014-03-06 프로브 카드용 가이드판

Country Status (5)

Country Link
US (1) US9459287B2 (enExample)
JP (1) JP6235785B2 (enExample)
KR (1) KR102193964B1 (enExample)
CN (1) CN104062476B (enExample)
TW (1) TWI623752B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240050065A (ko) 2022-10-11 2024-04-18 (주)포인트엔지니어링 가이드 플레이트 및 이를 포함하는 검사 장치

Families Citing this family (18)

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JP6033130B2 (ja) 2013-03-13 2016-11-30 新光電気工業株式会社 プローブガイド板及びその製造方法
TWI541515B (zh) * 2014-06-27 2016-07-11 旺矽科技股份有限公司 探針卡的定位件與探針卡的探針頭
EP3227692A2 (en) * 2014-12-04 2017-10-11 Technoprobe S.p.A Testing head comprising vertical probes
MY180767A (en) * 2014-12-17 2020-12-08 Jf Microtechnology Sdn Bhd Contact assembly in a testing apparatus for integrated circuits
JP6890921B2 (ja) 2015-10-21 2021-06-18 株式会社日本マイクロニクス プローブカード及び接触検査装置
JP6706076B2 (ja) 2016-01-14 2020-06-03 新光電気工業株式会社 プローブガイド板及びその製造方法とプローブ装置
JP6706079B2 (ja) 2016-01-18 2020-06-03 新光電気工業株式会社 プローブガイド板及びプローブ装置とそれらの製造方法
JP6654061B2 (ja) * 2016-02-23 2020-02-26 日本電子材料株式会社 プローブガイド、プローブカード及びプローブガイドの製造方法
JP6727988B2 (ja) * 2016-08-31 2020-07-22 日本電子材料株式会社 プローブカードの製造方法
JP6814024B2 (ja) * 2016-11-08 2021-01-13 日本電子材料株式会社 プローブカード用ガイド板
JP6872960B2 (ja) * 2017-04-21 2021-05-19 株式会社日本マイクロニクス 電気的接続装置
DE102017209441A1 (de) * 2017-06-02 2018-12-06 Feinmetall Gmbh Elektrische Kontaktieranordnung zur Berührungskontaktierung
CN109507456A (zh) * 2017-09-15 2019-03-22 中华精测科技股份有限公司 探针装置及其导板
KR102072451B1 (ko) * 2018-07-27 2020-02-04 주식회사 에스디에이 프로브카드 헤드블록
KR102865650B1 (ko) * 2020-01-31 2025-09-29 (주)포인트엔지니어링 프로브 헤드 및 이를 포함하는 프로브 카드
WO2022153536A1 (ja) * 2021-01-18 2022-07-21 日本電信電話株式会社 プローブカードおよびその製造方法
CN116265954A (zh) * 2021-12-17 2023-06-20 思达尔科技(武汉)有限公司 具弹性结构的探针测试装置
KR102673349B1 (ko) * 2022-02-25 2024-06-07 (주)티에스이 저마찰형 프로브 헤드

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US6114240A (en) 1997-12-18 2000-09-05 Micron Technology, Inc. Method for fabricating semiconductor components using focused laser beam
US20070257685A1 (en) 2006-05-08 2007-11-08 Tokyo Electron Ltd. Probe and probe card
JP2012093127A (ja) * 2010-10-25 2012-05-17 Advanced Systems Japan Inc バーチカルプローブヘッド

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JPS5584324U (enExample) * 1978-12-06 1980-06-10
US6252415B1 (en) * 1999-09-14 2001-06-26 Advantest Corp. Pin block structure for mounting contact pins
JP2002296297A (ja) 2001-03-29 2002-10-09 Isao Kimoto 接触子組立体
JP3530518B2 (ja) 2002-01-24 2004-05-24 日本電子材料株式会社 プローブカード
KR20040089244A (ko) 2003-04-11 2004-10-21 주식회사 유림하이테크산업 프로브 카드의 니들 어셈블리
US7316063B2 (en) * 2004-01-12 2008-01-08 Micron Technology, Inc. Methods of fabricating substrates including at least one conductive via
JP4955935B2 (ja) * 2004-05-25 2012-06-20 キヤノン株式会社 貫通孔形成方法および半導体装置の製造方法
JP4246132B2 (ja) * 2004-10-04 2009-04-02 シャープ株式会社 半導体装置およびその製造方法
WO2006106666A1 (ja) 2005-03-31 2006-10-12 Tokyo Electron Limited シリコン酸化膜の製造方法、その制御プログラム、記憶媒体及びプラズマ処理装置
JP4274566B2 (ja) * 2005-04-25 2009-06-10 エルピーダメモリ株式会社 半導体装置の製造方法
JP2007171140A (ja) * 2005-12-26 2007-07-05 Apex Inc プローブカード、インターポーザおよびインターポーザの製造方法
JP2007171139A (ja) 2005-12-26 2007-07-05 Apex Inc プローブ保持構造およびバネ型プローブ
US7902643B2 (en) * 2006-08-31 2011-03-08 Micron Technology, Inc. Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
US7666768B2 (en) * 2006-09-29 2010-02-23 Intel Corporation Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance
KR20080109556A (ko) * 2007-06-13 2008-12-17 (주)엠투엔 프로브 기판 조립체
JP5536322B2 (ja) * 2007-10-09 2014-07-02 新光電気工業株式会社 基板の製造方法
JP5276895B2 (ja) * 2008-05-19 2013-08-28 新光電気工業株式会社 プローブカード及びその製造方法
CN101644724B (zh) * 2008-08-04 2012-08-08 旺矽科技股份有限公司 探针测试装置
US8541884B2 (en) * 2011-07-06 2013-09-24 Research Triangle Institute Through-substrate via having a strip-shaped through-hole signal conductor
JP5847663B2 (ja) 2012-08-01 2016-01-27 日本電子材料株式会社 プローブカード用ガイド板の製造方法
JP6033130B2 (ja) * 2013-03-13 2016-11-30 新光電気工業株式会社 プローブガイド板及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6114240A (en) 1997-12-18 2000-09-05 Micron Technology, Inc. Method for fabricating semiconductor components using focused laser beam
US20070257685A1 (en) 2006-05-08 2007-11-08 Tokyo Electron Ltd. Probe and probe card
JP2012093127A (ja) * 2010-10-25 2012-05-17 Advanced Systems Japan Inc バーチカルプローブヘッド

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240050065A (ko) 2022-10-11 2024-04-18 (주)포인트엔지니어링 가이드 플레이트 및 이를 포함하는 검사 장치

Also Published As

Publication number Publication date
TWI623752B (zh) 2018-05-11
JP2014181910A (ja) 2014-09-29
US20140266275A1 (en) 2014-09-18
TW201439545A (zh) 2014-10-16
CN104062476A (zh) 2014-09-24
US9459287B2 (en) 2016-10-04
JP6235785B2 (ja) 2017-11-22
CN104062476B (zh) 2018-06-12
KR20140114288A (ko) 2014-09-26

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