KR102185913B1 - 연마 장치 - Google Patents
연마 장치 Download PDFInfo
- Publication number
- KR102185913B1 KR102185913B1 KR1020190001827A KR20190001827A KR102185913B1 KR 102185913 B1 KR102185913 B1 KR 102185913B1 KR 1020190001827 A KR1020190001827 A KR 1020190001827A KR 20190001827 A KR20190001827 A KR 20190001827A KR 102185913 B1 KR102185913 B1 KR 102185913B1
- Authority
- KR
- South Korea
- Prior art keywords
- polishing
- unit
- rail
- gripper
- polished
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180010832 | 2018-01-29 | ||
KR20180010832 | 2018-01-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20190092264A KR20190092264A (ko) | 2019-08-07 |
KR102185913B1 true KR102185913B1 (ko) | 2020-12-03 |
Family
ID=67483980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020190001827A KR102185913B1 (ko) | 2018-01-29 | 2019-01-07 | 연마 장치 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6678261B2 (zh) |
KR (1) | KR102185913B1 (zh) |
CN (1) | CN110103132B (zh) |
TW (1) | TWI694895B (zh) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006110642A (ja) * | 2004-10-12 | 2006-04-27 | Shiraitekku:Kk | 研磨装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59110544A (ja) * | 1982-12-17 | 1984-06-26 | Matsushita Electric Ind Co Ltd | 面取り加工装置 |
JP3340151B2 (ja) * | 1992-05-21 | 2002-11-05 | 不二越機械工業株式会社 | ウエハー載置装置 |
JP3501896B2 (ja) * | 1996-03-21 | 2004-03-02 | トーヨーエイテック株式会社 | ウェハ製造装置 |
JP3850066B2 (ja) * | 1996-04-18 | 2006-11-29 | ヤマハ発動機株式会社 | 電動車両の駆動力制御装置 |
TW467795B (en) * | 1999-03-15 | 2001-12-11 | Mitsubishi Materials Corp | Wafer transporting device, wafer polishing device and method for making wafers |
JP2002075935A (ja) * | 2000-08-30 | 2002-03-15 | Nikon Corp | 研磨装置 |
JP2004022886A (ja) * | 2002-06-18 | 2004-01-22 | Nikon Corp | 研磨部材、この研磨部材を用いた研磨装置、この研磨装置を用いた半導体デバイス製造方法及びこの半導体デバイス製造方法により製造された半導体デバイス |
JP2005085828A (ja) * | 2003-09-05 | 2005-03-31 | Sumitomo Mitsubishi Silicon Corp | 研磨装置における位置決め機構付きウェーハ搬送装置 |
CN102117736B (zh) * | 2006-02-22 | 2013-06-05 | 株式会社荏原制作所 | 基板处理装置、基板搬运装置、基板把持装置以及药液处理装置 |
TW200808493A (en) * | 2006-08-07 | 2008-02-16 | Shiraitekku Kk | Polishing device |
KR101188540B1 (ko) * | 2010-04-30 | 2012-10-05 | 주식회사 케이씨텍 | 화학 기계식 연마시스템 및 이의 기판 이송 시스템 |
CN102366914B (zh) * | 2011-07-15 | 2013-09-04 | 夏锡华 | 自动循环双夹具饰品磨抛机 |
KR101516475B1 (ko) * | 2013-06-03 | 2015-05-04 | 주식회사 휘닉스 디지탈테크 | 글래스 연삭 장치 |
JP2015207622A (ja) * | 2014-04-18 | 2015-11-19 | 株式会社ディスコ | 搬送機構 |
CN105460155A (zh) * | 2014-08-20 | 2016-04-06 | 光阳工业股份有限公司 | 电动车乘车检知装置及方法 |
DE102014217758A1 (de) * | 2014-09-05 | 2016-03-10 | Bayerische Motoren Werke Aktiengesellschaft | Antriebshilfe sowie Verfahren zum Bereitstellen eines unterstützenden Drehmoments |
CN204895746U (zh) * | 2015-08-12 | 2015-12-23 | 杭州锣卜科技有限公司 | 一种电动平衡车的脚踏感应控制系统 |
CN105563262B (zh) * | 2015-12-31 | 2018-07-10 | 维达力实业(深圳)有限公司 | 一种薄玻璃磨削加工装置 |
TWI598190B (zh) * | 2016-09-21 | 2017-09-11 | Ying Chieh Chiu | 全自動玻璃拋光機 |
JP2018157381A (ja) * | 2017-03-17 | 2018-10-04 | 日本電産株式会社 | 電動車両のモータの制御装置、電気ロック機構、および電動車両 |
CN207157415U (zh) * | 2017-07-07 | 2018-03-30 | 北京神州力康生态科技有限公司 | 一种电动自行车智能助力控制系统 |
CN109018112A (zh) * | 2018-08-24 | 2018-12-18 | 芜湖职业技术学院 | 电动车自动脚踏 |
CN109850055A (zh) * | 2019-01-07 | 2019-06-07 | 北京致行慕远科技有限公司 | 电机控制信号的处理方法、装置、电动车及存储介质 |
-
2019
- 2019-01-07 KR KR1020190001827A patent/KR102185913B1/ko active IP Right Grant
- 2019-01-29 JP JP2019013126A patent/JP6678261B2/ja active Active
- 2019-01-29 TW TW108103390A patent/TWI694895B/zh active
- 2019-01-29 CN CN201910085943.1A patent/CN110103132B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006110642A (ja) * | 2004-10-12 | 2006-04-27 | Shiraitekku:Kk | 研磨装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI694895B (zh) | 2020-06-01 |
JP6678261B2 (ja) | 2020-04-08 |
TW201932243A (zh) | 2019-08-16 |
JP2019130661A (ja) | 2019-08-08 |
CN110103132B (zh) | 2021-04-30 |
CN110103132A (zh) | 2019-08-09 |
KR20190092264A (ko) | 2019-08-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101800169B1 (ko) | 패널 상하 반전 장치 및 그 방법 | |
JP5189370B2 (ja) | 基板交換装置及び基板処理装置並びに基板検査装置 | |
WO2022126878A1 (zh) | 曲面屏幕裂纹检测设备 | |
KR101864900B1 (ko) | 박리 장치, 박리 시스템, 박리 방법 및 컴퓨터 판독 가능한 기억 매체 | |
JP2009208080A (ja) | ワーク搬送装置 | |
KR20170016291A (ko) | 접합 장치, 접합 시스템, 접합 방법 및 컴퓨터 기억 매체 | |
JP2008159784A (ja) | ステージ装置 | |
KR101509660B1 (ko) | 고정밀도 전자동 라미네이팅 장치 | |
JP6717908B2 (ja) | 基板の搬送装置、搬送方法、及びフォトリソグラフィ設備 | |
KR102185913B1 (ko) | 연마 장치 | |
KR101058185B1 (ko) | 평면디스플레이용 면취기 및 그 면취 가공방법 | |
TW200425381A (en) | LCD panel auto gripping apparatus and method for use in a panel carrier for an automatic probe unit | |
KR101291313B1 (ko) | 패널 부착장치 | |
JP4854337B2 (ja) | 板材の加工装置とそれを備えた加工設備 | |
JP2006026787A (ja) | ガラス基板の研削方法 | |
KR101016400B1 (ko) | 평면디스플레이용 면취기 | |
TWM610917U (zh) | 劃片裝置 | |
KR100939682B1 (ko) | 평면디스플레이용 면취기 | |
KR20090059399A (ko) | 작업물 공급 및 정렬 장치 | |
WO2018003577A1 (ja) | アライメント装置 | |
KR20180035660A (ko) | 기판 배열 장치 및 기판 배열 방법 | |
KR101542865B1 (ko) | 평판 디스플레이 패널용 가본딩장치 | |
KR101303315B1 (ko) | 반도체자재용 절삭장치 및 반도체자재의 절삭방법 | |
KR101642869B1 (ko) | 도포 장치, 이를 이용한 도포 방법 및 상기 도포 장치를 포함하는 도포 설비 | |
US20130149839A1 (en) | Apparatus for bonding substrates to each other |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right |