KR102171030B1 - 임프린트 리소그래피에서 압출물 감소 - Google Patents

임프린트 리소그래피에서 압출물 감소 Download PDF

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KR102171030B1
KR102171030B1 KR1020197030480A KR20197030480A KR102171030B1 KR 102171030 B1 KR102171030 B1 KR 102171030B1 KR 1020197030480 A KR1020197030480 A KR 1020197030480A KR 20197030480 A KR20197030480 A KR 20197030480A KR 102171030 B1 KR102171030 B1 KR 102171030B1
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substrate
polymeric material
mesa
energy
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KR20190120443A (ko
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니야즈 쿠스나트디노브
크리스토퍼 이. 존스
조셉 지. 페레즈
드웨인 엘. 라브레이크
이안 매튜 맥마킨
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캐논 나노테크놀로지즈 인코퍼레이티드
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Assigned to 매직 립, 인코포레이티드 reassignment 매직 립, 인코포레이티드 권리의 전부이전등록 Assignors: 캐논 나노테크놀로지즈 인코퍼레이티드
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/005—Repairing damaged coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H01L21/027—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Micromachines (AREA)
KR1020197030480A 2008-02-08 2009-02-09 임프린트 리소그래피에서 압출물 감소 Active KR102171030B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US2715308P 2008-02-08 2008-02-08
US61/027,153 2008-02-08
US9409208P 2008-09-04 2008-09-04
US61/094,092 2008-09-04
US12/367,079 US8361371B2 (en) 2008-02-08 2009-02-06 Extrusion reduction in imprint lithography
US12/367,079 2009-02-06
PCT/US2009/000803 WO2009099666A1 (en) 2008-02-08 2009-02-09 Extrusion reduction in imprint lithography

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020167011654A Division KR102065400B1 (ko) 2008-02-08 2009-02-09 임프린트 리소그래피에서 압출물 감소

Publications (2)

Publication Number Publication Date
KR20190120443A KR20190120443A (ko) 2019-10-23
KR102171030B1 true KR102171030B1 (ko) 2020-10-28

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ID=40938224

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KR1020197030480A Active KR102171030B1 (ko) 2008-02-08 2009-02-09 임프린트 리소그래피에서 압출물 감소
KR1020167011654A Active KR102065400B1 (ko) 2008-02-08 2009-02-09 임프린트 리소그래피에서 압출물 감소
KR1020107018535A Ceased KR20100123698A (ko) 2008-02-08 2009-02-09 임프린트 리소그래피에서 압출물 감소

Family Applications After (2)

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KR1020107018535A Ceased KR20100123698A (ko) 2008-02-08 2009-02-09 임프린트 리소그래피에서 압출물 감소

Country Status (7)

Country Link
US (2) US8361371B2 (https=)
EP (1) EP2240826A4 (https=)
JP (1) JP5216871B2 (https=)
KR (3) KR102171030B1 (https=)
CN (1) CN101939704B (https=)
TW (1) TWI430015B (https=)
WO (1) WO2009099666A1 (https=)

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US8641958B2 (en) 2014-02-04
KR20160054631A (ko) 2016-05-16
WO2009099666A1 (en) 2009-08-13
EP2240826A4 (en) 2012-08-01
TW200938949A (en) 2009-09-16
KR102065400B1 (ko) 2020-01-13
US8361371B2 (en) 2013-01-29
JP5216871B2 (ja) 2013-06-19
CN101939704B (zh) 2014-03-12
EP2240826A1 (en) 2010-10-20
KR20100123698A (ko) 2010-11-24
JP2011521438A (ja) 2011-07-21
KR20190120443A (ko) 2019-10-23
TWI430015B (zh) 2014-03-11
US20130241109A1 (en) 2013-09-19
CN101939704A (zh) 2011-01-05
US20090200710A1 (en) 2009-08-13

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