KR102149964B1 - 이방성 도전 필름 - Google Patents
이방성 도전 필름 Download PDFInfo
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- KR102149964B1 KR102149964B1 KR1020187021397A KR20187021397A KR102149964B1 KR 102149964 B1 KR102149964 B1 KR 102149964B1 KR 1020187021397 A KR1020187021397 A KR 1020187021397A KR 20187021397 A KR20187021397 A KR 20187021397A KR 102149964 B1 KR102149964 B1 KR 102149964B1
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- anisotropic conductive
- conductive film
- standard
- region
- conductive particles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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| JP6151597B2 (ja) * | 2013-07-29 | 2017-06-21 | デクセリアルズ株式会社 | 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法 |
| KR20240025047A (ko) * | 2013-11-19 | 2024-02-26 | 데쿠세리아루즈 가부시키가이샤 | 이방 도전성 필름 및 접속 구조체 |
| JP6645730B2 (ja) * | 2014-01-28 | 2020-02-14 | デクセリアルズ株式会社 | 接続体及び接続体の製造方法 |
| CN104698689B (zh) * | 2015-04-07 | 2017-07-14 | 京东方科技集团股份有限公司 | 一种各向异性导电胶膜、显示装置及其返修方法 |
| TWI691977B (zh) * | 2015-05-27 | 2020-04-21 | 日商迪睿合股份有限公司 | 異向導電性膜及連接構造體 |
| JP2017175093A (ja) * | 2016-03-25 | 2017-09-28 | デクセリアルズ株式会社 | 電子部品、接続体、電子部品の設計方法 |
| JP7095227B2 (ja) * | 2016-05-05 | 2022-07-05 | デクセリアルズ株式会社 | 異方性導電フィルム |
| JP7274811B2 (ja) * | 2016-05-05 | 2023-05-17 | デクセリアルズ株式会社 | 異方性導電フィルム |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010251337A (ja) * | 2010-08-05 | 2010-11-04 | Sony Chemical & Information Device Corp | 異方性導電膜及びその製造方法並びに接続構造体 |
| JP2016066573A (ja) * | 2013-11-19 | 2016-04-28 | デクセリアルズ株式会社 | 異方導電性フィルム及び接続構造体 |
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| JP7788950B2 (ja) | 2025-12-19 |
| TWI764821B (zh) | 2022-05-11 |
| US10553554B2 (en) | 2020-02-04 |
| TW202202584A (zh) | 2022-01-16 |
| KR102621211B1 (ko) | 2024-01-04 |
| CN109075471A (zh) | 2018-12-21 |
| TW201816029A (zh) | 2018-05-01 |
| US20200144214A1 (en) | 2020-05-07 |
| WO2017191774A1 (ja) | 2017-11-09 |
| JP7095227B2 (ja) | 2022-07-05 |
| CN109075471B (zh) | 2021-03-12 |
| JP2017204461A (ja) | 2017-11-16 |
| US10714444B2 (en) | 2020-07-14 |
| KR20210122900A (ko) | 2021-10-12 |
| KR102502795B1 (ko) | 2023-02-23 |
| KR102308962B1 (ko) | 2021-10-06 |
| KR20180098356A (ko) | 2018-09-03 |
| TWI740934B (zh) | 2021-10-01 |
| KR20230030025A (ko) | 2023-03-03 |
| JP2022118147A (ja) | 2022-08-12 |
| KR20200103874A (ko) | 2020-09-02 |
| US20190139927A1 (en) | 2019-05-09 |
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