JP7095227B2 - 異方性導電フィルム - Google Patents

異方性導電フィルム Download PDF

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Publication number
JP7095227B2
JP7095227B2 JP2017084914A JP2017084914A JP7095227B2 JP 7095227 B2 JP7095227 B2 JP 7095227B2 JP 2017084914 A JP2017084914 A JP 2017084914A JP 2017084914 A JP2017084914 A JP 2017084914A JP 7095227 B2 JP7095227 B2 JP 7095227B2
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Japan
Prior art keywords
anisotropic conductive
conductive particles
conductive film
film
region
Prior art date
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Application number
JP2017084914A
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English (en)
Japanese (ja)
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JP2017204461A (ja
Inventor
恭志 阿久津
怜司 塚尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
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Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority to JP2017084914A priority Critical patent/JP7095227B2/ja
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to CN201780025075.7A priority patent/CN109075471B/zh
Priority to KR1020207024477A priority patent/KR102308962B1/ko
Priority to KR1020237005740A priority patent/KR102621211B1/ko
Priority to PCT/JP2017/016245 priority patent/WO2017191774A1/ja
Priority to KR1020217031177A priority patent/KR102502795B1/ko
Priority to KR1020187021397A priority patent/KR102149964B1/ko
Priority to US16/096,255 priority patent/US10553554B2/en
Priority to TW110132350A priority patent/TWI764821B/zh
Priority to TW106114400A priority patent/TWI740934B/zh
Publication of JP2017204461A publication Critical patent/JP2017204461A/ja
Priority to US16/728,554 priority patent/US10714444B2/en
Priority to JP2022099633A priority patent/JP7788950B2/ja
Application granted granted Critical
Publication of JP7095227B2 publication Critical patent/JP7095227B2/ja
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    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
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    • H01L2224/732—Location after the connecting process
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    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
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    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71

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KR1020237005740A KR102621211B1 (ko) 2016-05-05 2017-04-24 이방성 도전 필름
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KR1020187021397A KR102149964B1 (ko) 2016-05-05 2017-04-24 이방성 도전 필름
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TW110132350A TWI764821B (zh) 2016-05-05 2017-05-01 異向性導電膜
TW106114400A TWI740934B (zh) 2016-05-05 2017-05-01 異向性導電膜
US16/728,554 US10714444B2 (en) 2016-05-05 2019-12-27 Anisotropic conductive film
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WO2017191772A1 (ja) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 フィラー配置フィルム
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CN112823448B (zh) * 2018-10-31 2023-05-23 迪睿合株式会社 连接体的制备方法、各向异性接合薄膜、连接体
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