KR102072200B1 - 리소그래피 머신들의 클러스터를 위한 네트워크 아키텍처 및 프로토콜 - Google Patents

리소그래피 머신들의 클러스터를 위한 네트워크 아키텍처 및 프로토콜 Download PDF

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KR102072200B1
KR102072200B1 KR1020177029925A KR20177029925A KR102072200B1 KR 102072200 B1 KR102072200 B1 KR 102072200B1 KR 1020177029925 A KR1020177029925 A KR 1020177029925A KR 20177029925 A KR20177029925 A KR 20177029925A KR 102072200 B1 KR102072200 B1 KR 102072200B1
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lithographic
subsystems
subsystem
data
lithography
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KR20170120194A (ko
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마르셀 니콜라스 제이콥스 반 커빈크
가이도 데 보어
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에이에스엠엘 네델란즈 비.브이.
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F9/00—Arrangements for program control, e.g. control units
    • G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
    • G06F9/46—Multiprogramming arrangements
    • G06F9/48—Program initiating; Program switching, e.g. by interrupt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F9/00—Arrangements for program control, e.g. control units
    • G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
    • G06F9/46—Multiprogramming arrangements
    • G06F9/48—Program initiating; Program switching, e.g. by interrupt
    • G06F9/4806—Task transfer initiation or dispatching
    • G06F9/4843—Task transfer initiation or dispatching by program, e.g. task dispatcher, supervisor, operating system
    • G06F9/4881—Scheduling strategies for dispatcher, e.g. round robin, multi-level priority queues
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/276—Manufacturing methods by patterning a pre-deposited material
    • H01L2224/2762—Manufacturing methods by patterning a pre-deposited material using masks
    • H01L2224/27622—Photolithography
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/887—Nanoimprint lithography, i.e. nanostamp

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Software Systems (AREA)
  • Analytical Chemistry (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Quality & Reliability (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Electron Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
KR1020177029925A 2011-04-22 2012-04-23 리소그래피 머신들의 클러스터를 위한 네트워크 아키텍처 및 프로토콜 Active KR102072200B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161478117P 2011-04-22 2011-04-22
US61/478,117 2011-04-22
US201161533673P 2011-09-12 2011-09-12
US61/533,673 2011-09-12
PCT/EP2012/057366 WO2012143548A2 (en) 2011-04-22 2012-04-23 Network architecture and protocol for cluster of lithography machines

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020137030924A Division KR101791252B1 (ko) 2011-04-22 2012-04-23 리소그래피 머신들의 클러스터를 위한 네트워크 아키텍처 및 프로토콜

Publications (2)

Publication Number Publication Date
KR20170120194A KR20170120194A (ko) 2017-10-30
KR102072200B1 true KR102072200B1 (ko) 2020-01-31

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KR1020177029925A Active KR102072200B1 (ko) 2011-04-22 2012-04-23 리소그래피 머신들의 클러스터를 위한 네트워크 아키텍처 및 프로토콜
KR1020137030924A Active KR101791252B1 (ko) 2011-04-22 2012-04-23 리소그래피 머신들의 클러스터를 위한 네트워크 아키텍처 및 프로토콜

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US (3) US9086912B2 (enExample)
EP (2) EP2699966B1 (enExample)
JP (3) JP6042410B2 (enExample)
KR (2) KR102072200B1 (enExample)
CN (2) CN103649836B (enExample)
RU (1) RU2573398C2 (enExample)
TW (2) TWI526789B (enExample)
WO (2) WO2012143548A2 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2681624B1 (en) * 2010-12-14 2016-07-20 Mapper Lithography IP B.V. Lithography system and method of processing substrates in such a lithography system
US8893059B2 (en) 2012-02-06 2014-11-18 Kla-Tencor Corporation Pattern data system for high-performance maskless electron beam lithography
JP2014204012A (ja) * 2013-04-05 2014-10-27 キヤノン株式会社 描画装置、及び物品の製造方法
CN103389625A (zh) * 2013-07-11 2013-11-13 浙江大学 一种应用于浸没式光刻机中浸液液体传送系统的通讯方法
JP6312379B2 (ja) * 2013-07-19 2018-04-18 キヤノン株式会社 リソグラフィ装置、リソグラフィ方法、リソグラフィシステム、プログラム、物品の製造方法
JP2015204401A (ja) * 2014-04-15 2015-11-16 キヤノン株式会社 リソグラフィ装置、および物品の製造方法
US9927725B2 (en) 2015-02-16 2018-03-27 Canon Kabushiki Kaisha Lithography apparatus, lithography method, program, lithography system, and article manufacturing method
JP6198805B2 (ja) * 2015-02-16 2017-09-20 キヤノン株式会社 リソグラフィ装置、リソグラフィ方法、プログラム、リソグラフィシステムおよび物品製造方法
KR102185748B1 (ko) * 2016-07-19 2020-12-03 에이에스엠엘 네델란즈 비.브이. 직접 기록 마스크리스 리소그래피용 장치
US10522472B2 (en) 2016-09-08 2019-12-31 Asml Netherlands B.V. Secure chips with serial numbers
NL2019502B1 (en) 2016-09-08 2018-08-31 Mapper Lithography Ip Bv Method and system for fabricating unique chips using a charged particle multi-beamlet lithography system
US20180068047A1 (en) * 2016-09-08 2018-03-08 Mapper Lithography Ip B.V. Method and system for fabricating unique chips using a charged particle multi-beamlet lithography system
US10418324B2 (en) 2016-10-27 2019-09-17 Asml Netherlands B.V. Fabricating unique chips using a charged particle multi-beamlet lithography system
CN106647181B (zh) * 2016-12-19 2018-03-09 电子科技大学 一种用于dmd无掩膜光刻机的高速图像曝光方法
EP3514640B1 (de) 2018-01-18 2023-05-17 Gebr. Saacke GmbH & Co.KG Vorrichtung und verfahren zur bereitstellung von maschinendaten
EP4206831A1 (de) * 2021-12-29 2023-07-05 Siemens Aktiengesellschaft Verfahren und system zur bereitstellung von zeitkritischen steuerungsanwendungen
CN115297183B (zh) * 2022-07-29 2023-11-03 天翼云科技有限公司 一种数据处理方法、装置、电子设备和存储介质

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070203873A1 (en) * 2006-02-14 2007-08-30 Asml Netherlands B.V. Software upgrades in a lithographic apparatus

Family Cites Families (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3157308A (en) 1961-09-05 1964-11-17 Clark Mfg Co J L Canister type container and method of making the same
US3159408A (en) 1961-10-05 1964-12-01 Grace W R & Co Chuck
US4524308A (en) 1984-06-01 1985-06-18 Sony Corporation Circuits for accomplishing electron beam convergence in color cathode ray tubes
JP3336436B2 (ja) 1991-04-02 2002-10-21 株式会社ニコン リソグラフィシステム、情報収集装置、露光装置、及び半導体デバイス製造方法
AU6449994A (en) 1993-04-30 1994-11-21 Board Of Regents, The University Of Texas System Megavoltage scanning imager and method for its use
JP3654597B2 (ja) 1993-07-15 2005-06-02 株式会社ルネサステクノロジ 製造システムおよび製造方法
EP0766405A1 (en) 1995-09-29 1997-04-02 STMicroelectronics S.r.l. Successive approximation register without redundancy
US5778386A (en) * 1996-05-28 1998-07-07 Taiwan Semiconductor Manufacturing Company Ltd. Global view storage management system for semiconductor manufacturing plants
JP3087696B2 (ja) * 1997-07-25 2000-09-11 日本電気株式会社 分散メモリ型マルチプロセッサ・システム制御方法およびコンピュータ読み取り可能な記録媒体
KR19990062942A (ko) * 1997-12-10 1999-07-26 히로시 오우라 전하 입자 빔 노출 장치
US6011952A (en) * 1998-01-20 2000-01-04 Viasat, Inc. Self-interference cancellation for relayed communication networks
US6610150B1 (en) 1999-04-02 2003-08-26 Asml Us, Inc. Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system
IL151166A0 (en) 2000-02-16 2003-04-10 Cymer Inc Process monitoring system for lithography lasers
US6714830B2 (en) * 2000-02-28 2004-03-30 Canon Kabushiki Kaisha Push-type scheduling for semiconductor fabrication
WO2001084382A1 (en) * 2000-05-04 2001-11-08 Kla-Tencor, Inc. Methods and systems for lithography process control
US7149792B1 (en) * 2000-11-20 2006-12-12 Axeda Corporation Device registration mechanism
JP2002252161A (ja) 2001-02-23 2002-09-06 Hitachi Ltd 半導体製造システム
JP4713773B2 (ja) * 2001-07-09 2011-06-29 株式会社アドバンテスト 電子ビーム露光装置及び電子ビーム露光方法
US7280883B2 (en) * 2001-09-06 2007-10-09 Dainippon Screen Mfg. Co., Ltd. Substrate processing system managing apparatus information of substrate processing apparatus
JP2003288496A (ja) * 2002-03-27 2003-10-10 Toshiba Corp 描画支援システム、描画支援方法、マスク製造支援システム、及びマスク製造支援方法
JP4078150B2 (ja) 2002-08-22 2008-04-23 株式会社日立ハイテクノロジーズ 半導体製造装置
KR100523839B1 (ko) 2002-10-07 2005-10-27 한국전자통신연구원 건식 리소그라피 방법 및 이를 이용한 게이트 패턴 형성방법
KR101060557B1 (ko) 2002-10-25 2011-08-31 마퍼 리쏘그라피 아이피 비.브이. 리소그라피 시스템
KR101077098B1 (ko) 2002-10-30 2011-10-26 마퍼 리쏘그라피 아이피 비.브이. 전자 빔 노출 시스템
KR101068607B1 (ko) 2003-03-10 2011-09-30 마퍼 리쏘그라피 아이피 비.브이. 복수 개의 빔렛 발생 장치
JP4949843B2 (ja) 2003-05-28 2012-06-13 マッパー・リソグラフィー・アイピー・ビー．ブイ． 荷電粒子ビームレット露光システム
WO2005010618A2 (en) 2003-07-30 2005-02-03 Mapper Lithography Ip B.V. Modulator circuitry
US7094613B2 (en) 2003-10-21 2006-08-22 Applied Materials, Inc. Method for controlling accuracy and repeatability of an etch process
JP2005174959A (ja) * 2003-12-05 2005-06-30 Nikon Corp リソグラフィシステム、プログラム及び情報記録媒体、支援装置、並びに露光方法
US7728880B2 (en) 2004-06-25 2010-06-01 Qualcomm Incorporated Automatic white balance method and apparatus
JP2006113705A (ja) * 2004-10-13 2006-04-27 Nikon Corp 情報処理システム及びプログラム
DE102004055149B4 (de) * 2004-11-16 2007-07-19 Leica Microsystems Lithography Gmbh Vorrichtung und Verfahren zum Abbilden eines Mehrfach-Partikelstrahls auf ein Substrat
CN100361113C (zh) * 2005-02-05 2008-01-09 上海微电子装备有限公司 步进扫描投影光刻机的高速同步广播总线系统
JP2006338232A (ja) * 2005-06-01 2006-12-14 Murata Mach Ltd 通信システム
US20070010905A1 (en) * 2005-07-07 2007-01-11 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for monitoring processing tool
US7709815B2 (en) 2005-09-16 2010-05-04 Mapper Lithography Ip B.V. Lithography system and projection method
US8055727B2 (en) * 2005-09-22 2011-11-08 Fisher-Rosemount Systems, Inc. Use of a really simple syndication communication format in a process control system
US8090875B2 (en) 2005-10-28 2012-01-03 Nikon Corporation Device and method for connecting device manufacturing processing apparatuses, program, device manufacturing processing system, exposure apparatus and method, and measurement and inspection apparatus and method
WO2007049704A1 (ja) * 2005-10-28 2007-05-03 Nikon Corporation デバイス製造処理装置間の接続装置及び接続方法、プログラム、デバイス製造処理システム、露光装置及び露光方法、並びに測定検査装置及び測定検査方法
US8134681B2 (en) * 2006-02-17 2012-03-13 Nikon Corporation Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium
TW200745771A (en) * 2006-02-17 2007-12-16 Nikon Corp Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium
JP4682107B2 (ja) 2006-08-28 2011-05-11 株式会社リコー 画像形成装置、情報処理方法及び情報処理プログラム
US7801635B2 (en) * 2007-01-30 2010-09-21 Tokyo Electron Limited Real-time parameter tuning for etch processes
US8636458B2 (en) * 2007-06-06 2014-01-28 Asml Netherlands B.V. Integrated post-exposure bake track
JP4992750B2 (ja) * 2008-02-14 2012-08-08 日本電気株式会社 中継装置
US8089056B2 (en) 2008-02-26 2012-01-03 Mapper Lithography Ip B.V. Projection lens arrangement
WO2009106397A1 (en) 2008-02-26 2009-09-03 Mapper Lithography Ip B.V. Projection lens arrangement
US8445869B2 (en) 2008-04-15 2013-05-21 Mapper Lithography Ip B.V. Projection lens arrangement
US8258484B2 (en) 2008-04-15 2012-09-04 Mapper Lithography Ip B.V. Beamlet blanker arrangement
WO2009141428A1 (en) 2008-05-23 2009-11-26 Mapper Lithography Ip B.V. Imaging system
JP5743886B2 (ja) 2008-06-04 2015-07-01 マッパー・リソグラフィー・アイピー・ビー．ブイ． ターゲットを露光するための方法およびシステム
JP2010067759A (ja) * 2008-09-10 2010-03-25 Canon Inc 露光装置
TWI479530B (zh) 2008-10-01 2015-04-01 Mapper Lithography Ip Bv 靜電透鏡結構、靜電透鏡陣列、帶電粒子的子束微影系統以及製造絕緣結構的方法
JP2010093125A (ja) * 2008-10-09 2010-04-22 Toray Eng Co Ltd 基板処理システムおよび基板処理方法
TW201040680A (en) * 2008-12-15 2010-11-16 Tokyo Electron Ltd System for processing of substrate, method of processing of substrate, and storage medium that stores program
JP4615071B2 (ja) 2008-12-29 2011-01-19 キヤノンアネルバ株式会社 基板処理システム及び基板処理装置
NL2004392A (en) 2009-04-15 2010-10-18 Asml Netherlands Bv Lithographic apparatus, control system, multi-core processor, and a method to start tasks on a multi-core processor.
CN102460633B (zh) * 2009-05-20 2014-12-17 迈普尔平版印刷Ip有限公司 用于光刻系统的图案数据转换器
CN104810232B (zh) 2009-05-20 2017-12-29 迈普尔平版印刷Ip有限公司 两次扫描
JP2011054679A (ja) * 2009-08-31 2011-03-17 Hitachi Kokusai Electric Inc 基板処理装置
JP5392190B2 (ja) * 2010-06-01 2014-01-22 東京エレクトロン株式会社 基板処理システム及び基板処理方法
US8822106B2 (en) * 2012-04-13 2014-09-02 Taiwan Semiconductor Manufacturing Company, Ltd. Grid refinement method
JP6352529B2 (ja) 2015-04-03 2018-07-04 株式会社日立ハイテクノロジーズ 光量検出装置、それを用いた免疫分析装置および荷電粒子線装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070203873A1 (en) * 2006-02-14 2007-08-30 Asml Netherlands B.V. Software upgrades in a lithographic apparatus

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