KR102065957B1 - 기판 세정 장치 및 기판 세정 방법 - Google Patents

기판 세정 장치 및 기판 세정 방법 Download PDF

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Publication number
KR102065957B1
KR102065957B1 KR1020130136805A KR20130136805A KR102065957B1 KR 102065957 B1 KR102065957 B1 KR 102065957B1 KR 1020130136805 A KR1020130136805 A KR 1020130136805A KR 20130136805 A KR20130136805 A KR 20130136805A KR 102065957 B1 KR102065957 B1 KR 102065957B1
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supply line
substrate
pure water
cleaning
chemical liquid
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Korean (ko)
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KR20140063436A (ko
Inventor
후지히코 도요마스
도루 마루야마
미츠노리 고마츠
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가부시키가이샤 에바라 세이사꾸쇼
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
KR1020130136805A 2012-11-15 2013-11-12 기판 세정 장치 및 기판 세정 방법 Active KR102065957B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-250960 2012-11-15
JP2012250960A JP6212253B2 (ja) 2012-11-15 2012-11-15 基板洗浄装置及び基板洗浄方法

Publications (2)

Publication Number Publication Date
KR20140063436A KR20140063436A (ko) 2014-05-27
KR102065957B1 true KR102065957B1 (ko) 2020-01-14

Family

ID=50752556

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130136805A Active KR102065957B1 (ko) 2012-11-15 2013-11-12 기판 세정 장치 및 기판 세정 방법

Country Status (5)

Country Link
US (1) US10373845B2 (enExample)
JP (2) JP6212253B2 (enExample)
KR (1) KR102065957B1 (enExample)
CN (1) CN103817103B (enExample)
TW (2) TWI637793B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210108570A (ko) 2020-02-26 2021-09-03 주식회사 이앤에이치 기판 세정 장치 및 기판 세정 방법

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JP6159282B2 (ja) * 2014-03-27 2017-07-05 株式会社荏原製作所 基板処理装置、および基板処理装置の配管洗浄方法
JP6378555B2 (ja) * 2014-06-26 2018-08-22 株式会社荏原製作所 洗浄ユニット
US10340159B2 (en) 2014-06-09 2019-07-02 Ebara Corporation Cleaning chemical supplying device, cleaning chemical supplying method, and cleaning unit
KR102357784B1 (ko) * 2014-06-09 2022-02-04 가부시키가이샤 에바라 세이사꾸쇼 세정 약액 공급장치 및 세정 약액 공급 방법
WO2016067563A1 (ja) * 2014-10-31 2016-05-06 株式会社荏原製作所 基板洗浄ロール、基板洗浄装置、及び基板洗浄方法
JP6971676B2 (ja) * 2016-08-29 2021-11-24 株式会社荏原製作所 基板処理装置および基板処理方法
US10500691B2 (en) * 2016-08-29 2019-12-10 Ebara Corporation Substrate processing apparatus and substrate processing method
JP6486986B2 (ja) 2017-04-03 2019-03-20 株式会社荏原製作所 液体供給装置及び液体供給方法
CN107611010A (zh) * 2017-08-31 2018-01-19 长江存储科技有限责任公司 一种晶圆清洗方法
CN109647766A (zh) * 2017-10-12 2019-04-19 中国铁建高新装备股份有限公司 一种自动清洗烘干工具清洗机
US10460926B2 (en) * 2017-11-17 2019-10-29 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for chemical mechanical polishing process
CN120600663A (zh) * 2022-06-16 2025-09-05 华海清科股份有限公司 用于晶圆处理的供给通道的清洗方法、装置和系统
KR102844262B1 (ko) * 2024-01-29 2025-08-11 엘에스이 주식회사 기판 세정 장치

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JP2001338903A (ja) 2000-05-29 2001-12-07 Tokyo Electron Ltd 液処理方法及び液処理装置
JP2008277576A (ja) 2007-04-27 2008-11-13 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
US20090078287A1 (en) 2007-09-26 2009-03-26 Tokyo Electron Limited Liquid processing apparatus and process liquid supplying method
JP2009098128A (ja) 2007-09-26 2009-05-07 Tokyo Electron Ltd 液処理装置および処理液供給方法

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JPS596162B2 (ja) 1979-08-10 1984-02-09 東レ株式会社 多液混合方法
US5950645A (en) * 1993-10-20 1999-09-14 Verteq, Inc. Semiconductor wafer cleaning system
JPH1070101A (ja) 1996-08-27 1998-03-10 Hitachi Ltd 半導体装置の製造方法ならびに製造装置、洗浄方法ならびに洗浄装置、加工装置、流体混合用配管、および、洗浄用液体供給部材
JP3495208B2 (ja) * 1996-11-05 2004-02-09 大日本スクリーン製造株式会社 基板処理装置
US6240933B1 (en) * 1997-05-09 2001-06-05 Semitool, Inc. Methods for cleaning semiconductor surfaces
JP3529251B2 (ja) 1997-10-13 2004-05-24 大日本スクリーン製造株式会社 基板処理装置
US7216656B2 (en) * 2000-12-28 2007-05-15 Yoshiharu Yamamoto Semiconductor substrate cleansing apparatus
TWI261875B (en) * 2002-01-30 2006-09-11 Tokyo Electron Ltd Processing apparatus and substrate processing method
JP2004128251A (ja) * 2002-10-03 2004-04-22 Elpida Memory Inc 塗布機及び塗布方法
JP2004281464A (ja) * 2003-03-12 2004-10-07 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP4494840B2 (ja) * 2003-06-27 2010-06-30 大日本スクリーン製造株式会社 異物除去装置、基板処理装置および基板処理方法
JP2005353717A (ja) * 2004-06-09 2005-12-22 Renesas Technology Corp 半導体装置の製造方法および半導体製造装置
KR100646414B1 (ko) * 2004-10-01 2006-11-15 세메스 주식회사 다수의 약액들을 공급하는 약액 공급 시스템 및 그의 제어방법
KR100639710B1 (ko) * 2005-03-17 2006-10-30 세메스 주식회사 약액 혼합 공급 방법
JP2007311559A (ja) * 2006-05-18 2007-11-29 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
KR100847590B1 (ko) * 2006-06-19 2008-07-21 조현찬 반도체 장비용 약액 공급 장치, 이를 위한 모니터링 제어장치 및 모니터링이 가능한 반도체 장비용 약액 공급 장치
JP5424597B2 (ja) * 2008-09-08 2014-02-26 大日本スクリーン製造株式会社 基板処理装置

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Publication number Priority date Publication date Assignee Title
JP2001338903A (ja) 2000-05-29 2001-12-07 Tokyo Electron Ltd 液処理方法及び液処理装置
JP2008277576A (ja) 2007-04-27 2008-11-13 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
US20090078287A1 (en) 2007-09-26 2009-03-26 Tokyo Electron Limited Liquid processing apparatus and process liquid supplying method
JP2009098128A (ja) 2007-09-26 2009-05-07 Tokyo Electron Ltd 液処理装置および処理液供給方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210108570A (ko) 2020-02-26 2021-09-03 주식회사 이앤에이치 기판 세정 장치 및 기판 세정 방법

Also Published As

Publication number Publication date
TWI696502B (zh) 2020-06-21
TWI637793B (zh) 2018-10-11
JP2014099530A (ja) 2014-05-29
TW201433372A (zh) 2014-09-01
JP2017216483A (ja) 2017-12-07
US20140216505A1 (en) 2014-08-07
KR20140063436A (ko) 2014-05-27
US10373845B2 (en) 2019-08-06
CN103817103A (zh) 2014-05-28
CN103817103B (zh) 2017-05-10
TW201900291A (zh) 2019-01-01
JP6212253B2 (ja) 2017-10-11
JP6475801B2 (ja) 2019-02-27

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