CN103817103B - 基板清洗装置及基板清洗方法 - Google Patents

基板清洗装置及基板清洗方法 Download PDF

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Publication number
CN103817103B
CN103817103B CN201310573996.0A CN201310573996A CN103817103B CN 103817103 B CN103817103 B CN 103817103B CN 201310573996 A CN201310573996 A CN 201310573996A CN 103817103 B CN103817103 B CN 103817103B
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CN
China
Prior art keywords
medicinal liquid
pure water
pipeline
supply valve
substrate
Prior art date
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CN201310573996.0A
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English (en)
Chinese (zh)
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CN103817103A (zh
Inventor
丰增富士彦
丸山徹
小松三教
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Publication date
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Publication of CN103817103A publication Critical patent/CN103817103A/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
CN201310573996.0A 2012-11-15 2013-11-15 基板清洗装置及基板清洗方法 Active CN103817103B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-250960 2012-11-15
JP2012250960A JP6212253B2 (ja) 2012-11-15 2012-11-15 基板洗浄装置及び基板洗浄方法

Publications (2)

Publication Number Publication Date
CN103817103A CN103817103A (zh) 2014-05-28
CN103817103B true CN103817103B (zh) 2017-05-10

Family

ID=50752556

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310573996.0A Active CN103817103B (zh) 2012-11-15 2013-11-15 基板清洗装置及基板清洗方法

Country Status (5)

Country Link
US (1) US10373845B2 (enExample)
JP (2) JP6212253B2 (enExample)
KR (1) KR102065957B1 (enExample)
CN (1) CN103817103B (enExample)
TW (2) TWI637793B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6159282B2 (ja) * 2014-03-27 2017-07-05 株式会社荏原製作所 基板処理装置、および基板処理装置の配管洗浄方法
KR102357784B1 (ko) * 2014-06-09 2022-02-04 가부시키가이샤 에바라 세이사꾸쇼 세정 약액 공급장치 및 세정 약액 공급 방법
US10340159B2 (en) 2014-06-09 2019-07-02 Ebara Corporation Cleaning chemical supplying device, cleaning chemical supplying method, and cleaning unit
JP6378555B2 (ja) * 2014-06-26 2018-08-22 株式会社荏原製作所 洗浄ユニット
MY182464A (en) * 2014-10-31 2021-01-25 Ebara Corp Substrate cleaning roll, substrate cleaning apparatus, and substrate cleaning method
CN107799436B (zh) * 2016-08-29 2023-07-07 株式会社荏原制作所 基板处理装置及基板处理方法
JP6971676B2 (ja) * 2016-08-29 2021-11-24 株式会社荏原製作所 基板処理装置および基板処理方法
JP6486986B2 (ja) 2017-04-03 2019-03-20 株式会社荏原製作所 液体供給装置及び液体供給方法
CN107611010A (zh) * 2017-08-31 2018-01-19 长江存储科技有限责任公司 一种晶圆清洗方法
CN109647766A (zh) * 2017-10-12 2019-04-19 中国铁建高新装备股份有限公司 一种自动清洗烘干工具清洗机
US10460926B2 (en) * 2017-11-17 2019-10-29 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for chemical mechanical polishing process
KR102382789B1 (ko) 2020-02-26 2022-04-06 주식회사 이앤에이치 기판 세정 장치 및 기판 세정 방법
CN120497167A (zh) * 2022-06-16 2025-08-15 华海清科股份有限公司 用于晶圆处理的供给通道的清洗方法、装置和系统
KR102844262B1 (ko) * 2024-01-29 2025-08-11 엘에스이 주식회사 기판 세정 장치

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Publication number Priority date Publication date Assignee Title
JPS596162B2 (ja) 1979-08-10 1984-02-09 東レ株式会社 多液混合方法
US5950645A (en) * 1993-10-20 1999-09-14 Verteq, Inc. Semiconductor wafer cleaning system
JPH1070101A (ja) 1996-08-27 1998-03-10 Hitachi Ltd 半導体装置の製造方法ならびに製造装置、洗浄方法ならびに洗浄装置、加工装置、流体混合用配管、および、洗浄用液体供給部材
JP3495208B2 (ja) * 1996-11-05 2004-02-09 大日本スクリーン製造株式会社 基板処理装置
US6240933B1 (en) * 1997-05-09 2001-06-05 Semitool, Inc. Methods for cleaning semiconductor surfaces
JP3529251B2 (ja) 1997-10-13 2004-05-24 大日本スクリーン製造株式会社 基板処理装置
JP3891389B2 (ja) * 2000-05-29 2007-03-14 東京エレクトロン株式会社 液処理方法及び液処理装置
JP4902091B2 (ja) * 2000-12-28 2012-03-21 義治 山本 半導体基板の洗浄装置
TWI261875B (en) * 2002-01-30 2006-09-11 Tokyo Electron Ltd Processing apparatus and substrate processing method
JP2004128251A (ja) * 2002-10-03 2004-04-22 Elpida Memory Inc 塗布機及び塗布方法
JP2004281464A (ja) * 2003-03-12 2004-10-07 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP4494840B2 (ja) * 2003-06-27 2010-06-30 大日本スクリーン製造株式会社 異物除去装置、基板処理装置および基板処理方法
JP2005353717A (ja) * 2004-06-09 2005-12-22 Renesas Technology Corp 半導体装置の製造方法および半導体製造装置
KR100646414B1 (ko) * 2004-10-01 2006-11-15 세메스 주식회사 다수의 약액들을 공급하는 약액 공급 시스템 및 그의 제어방법
KR100639710B1 (ko) * 2005-03-17 2006-10-30 세메스 주식회사 약액 혼합 공급 방법
JP2007311559A (ja) * 2006-05-18 2007-11-29 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
KR100847590B1 (ko) * 2006-06-19 2008-07-21 조현찬 반도체 장비용 약액 공급 장치, 이를 위한 모니터링 제어장치 및 모니터링이 가능한 반도체 장비용 약액 공급 장치
JP2008277576A (ja) * 2007-04-27 2008-11-13 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
US8491726B2 (en) 2007-09-26 2013-07-23 Tokyo Electron Limited Liquid processing apparatus and process liquid supplying method
JP5198187B2 (ja) * 2007-09-26 2013-05-15 東京エレクトロン株式会社 液処理装置および処理液供給方法
JP5424597B2 (ja) * 2008-09-08 2014-02-26 大日本スクリーン製造株式会社 基板処理装置

Also Published As

Publication number Publication date
KR102065957B1 (ko) 2020-01-14
JP6475801B2 (ja) 2019-02-27
KR20140063436A (ko) 2014-05-27
TW201433372A (zh) 2014-09-01
US10373845B2 (en) 2019-08-06
JP2014099530A (ja) 2014-05-29
TWI696502B (zh) 2020-06-21
TWI637793B (zh) 2018-10-11
JP2017216483A (ja) 2017-12-07
CN103817103A (zh) 2014-05-28
US20140216505A1 (en) 2014-08-07
JP6212253B2 (ja) 2017-10-11
TW201900291A (zh) 2019-01-01

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