KR102061400B1 - 호모아다만탄 유도체, 그 제조 방법 및 포토레지스트용 감광성 재료 - Google Patents

호모아다만탄 유도체, 그 제조 방법 및 포토레지스트용 감광성 재료 Download PDF

Info

Publication number
KR102061400B1
KR102061400B1 KR1020177021225A KR20177021225A KR102061400B1 KR 102061400 B1 KR102061400 B1 KR 102061400B1 KR 1020177021225 A KR1020177021225 A KR 1020177021225A KR 20177021225 A KR20177021225 A KR 20177021225A KR 102061400 B1 KR102061400 B1 KR 102061400B1
Authority
KR
South Korea
Prior art keywords
oxo
oxa
homoadamantan
meth
oxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020177021225A
Other languages
English (en)
Korean (ko)
Other versions
KR20170091182A (ko
Inventor
신지 다나카
요시타카 우에노야마
히데토시 오노
나오야 가와노
가츠키 이토
Original Assignee
오사카 유키가가쿠고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오사카 유키가가쿠고교 가부시키가이샤 filed Critical 오사카 유키가가쿠고교 가부시키가이샤
Publication of KR20170091182A publication Critical patent/KR20170091182A/ko
Application granted granted Critical
Publication of KR102061400B1 publication Critical patent/KR102061400B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D313/00Heterocyclic compounds containing rings of more than six members having one oxygen atom as the only ring hetero atom
    • C07D313/02Seven-membered rings
    • C07D313/06Seven-membered rings condensed with carbocyclic rings or ring systems
    • C07D313/10Seven-membered rings condensed with carbocyclic rings or ring systems condensed with two six-membered rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10Esters
    • C08F20/26Esters containing oxygen in addition to the carboxy oxygen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10Esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F224/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a heterocyclic ring containing oxygen
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/165Monolayers, e.g. Langmuir-Blodgett
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • G03F7/32Liquid compositions therefor, e.g. developers
    • G03F7/322Aqueous alkaline compositions
    • H01L21/0273
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Pyrane Compounds (AREA)
KR1020177021225A 2010-04-02 2011-03-16 호모아다만탄 유도체, 그 제조 방법 및 포토레지스트용 감광성 재료 Active KR102061400B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010086352A JP2011219363A (ja) 2010-04-02 2010-04-02 ホモアダマンタン誘導体、その製造方法及びフォトレジスト用感光性材料
JPJP-P-2010-086352 2010-04-02
PCT/JP2011/001532 WO2011125291A1 (ja) 2010-04-02 2011-03-16 ホモアダマンタン誘導体、その製造方法及びフォトレジスト用感光性材料

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020127025834A Division KR20130034016A (ko) 2010-04-02 2011-03-16 호모아다만탄 유도체, 그 제조 방법 및 포토레지스트용 감광성 재료

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020187034121A Division KR20180128100A (ko) 2010-04-02 2011-03-16 호모아다만탄 유도체, 그 제조 방법 및 포토레지스트용 감광성 재료

Publications (2)

Publication Number Publication Date
KR20170091182A KR20170091182A (ko) 2017-08-08
KR102061400B1 true KR102061400B1 (ko) 2019-12-31

Family

ID=44762262

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020177021225A Active KR102061400B1 (ko) 2010-04-02 2011-03-16 호모아다만탄 유도체, 그 제조 방법 및 포토레지스트용 감광성 재료
KR1020127025834A Ceased KR20130034016A (ko) 2010-04-02 2011-03-16 호모아다만탄 유도체, 그 제조 방법 및 포토레지스트용 감광성 재료
KR1020187034121A Ceased KR20180128100A (ko) 2010-04-02 2011-03-16 호모아다만탄 유도체, 그 제조 방법 및 포토레지스트용 감광성 재료

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020127025834A Ceased KR20130034016A (ko) 2010-04-02 2011-03-16 호모아다만탄 유도체, 그 제조 방법 및 포토레지스트용 감광성 재료
KR1020187034121A Ceased KR20180128100A (ko) 2010-04-02 2011-03-16 호모아다만탄 유도체, 그 제조 방법 및 포토레지스트용 감광성 재료

Country Status (5)

Country Link
US (2) US20130022914A1 (https=)
JP (1) JP2011219363A (https=)
KR (3) KR102061400B1 (https=)
CN (2) CN103097371A (https=)
WO (1) WO2011125291A1 (https=)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5608009B2 (ja) 2010-08-12 2014-10-15 大阪有機化学工業株式会社 ホモアダマンタン誘導体、その製造方法及びフォトレジスト組成物
JP6014980B2 (ja) * 2011-02-08 2016-10-26 住友化学株式会社 樹脂、レジスト組成物及びレジストパターンの製造方法
JP2013225094A (ja) * 2011-10-07 2013-10-31 Jsr Corp フォトレジスト組成物及びレジストパターン形成方法
JP6330250B2 (ja) * 2012-03-07 2018-05-30 住友化学株式会社 レジストパターンの製造方法
JP6123383B2 (ja) * 2012-03-23 2017-05-10 住友化学株式会社 樹脂、レジスト組成物及びレジストパターンの製造方法
JP6142602B2 (ja) * 2012-03-23 2017-06-07 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP6123384B2 (ja) * 2012-03-23 2017-05-10 住友化学株式会社 樹脂、レジスト組成物及びレジストパターンの製造方法
JP6315748B2 (ja) * 2012-04-27 2018-04-25 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP6134562B2 (ja) * 2012-04-27 2017-05-24 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP6134563B2 (ja) * 2012-04-27 2017-05-24 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP6195725B2 (ja) * 2012-05-01 2017-09-13 住友化学株式会社 樹脂、レジスト組成物及びレジストパターンの製造方法
JP6174363B2 (ja) * 2012-05-14 2017-08-02 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP6174362B2 (ja) * 2012-05-14 2017-08-02 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP6246492B2 (ja) * 2012-05-15 2017-12-13 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP6246493B2 (ja) * 2012-05-15 2017-12-13 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP6246491B2 (ja) * 2012-05-15 2017-12-13 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP6208974B2 (ja) * 2012-05-15 2017-10-04 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP6246494B2 (ja) * 2012-05-18 2017-12-13 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP6145303B2 (ja) * 2012-05-18 2017-06-07 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP6208976B2 (ja) * 2012-05-18 2017-10-04 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP6246495B2 (ja) * 2012-05-18 2017-12-13 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP6181996B2 (ja) * 2012-07-03 2017-08-16 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP6149511B2 (ja) * 2012-07-12 2017-06-21 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP6276966B2 (ja) * 2012-11-15 2018-02-07 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
JP5978139B2 (ja) * 2013-01-22 2016-08-24 東京応化工業株式会社 レジストパターン形成方法
JP6058141B2 (ja) * 2013-08-05 2017-01-11 アルプス電気株式会社 透光性導電部材およびそのパターニング方法
US9772558B2 (en) 2013-09-24 2017-09-26 International Business Machines Corporation Sulfonic acid ester containing polymers for organic solvent based dual-tone photoresists
CA2950922A1 (en) * 2014-06-27 2015-12-30 Henkel IP & Holding GmbH Alkoxysilane-functionalized hydrocarbon compounds, intermediates thereof and methods of preparation thereof
US10174546B2 (en) * 2015-03-03 2019-01-08 Mechoshade Systems, Llc Shade adjustment notification system and method
JP6864994B2 (ja) 2015-06-26 2021-04-28 住友化学株式会社 レジスト組成物
JP6670694B2 (ja) * 2015-07-14 2020-03-25 住友化学株式会社 レジスト組成物及びレジストパターン製造方法
JP6960308B2 (ja) * 2016-12-01 2021-11-05 住友化学株式会社 レジスト組成物及びレジストパターンの製造方法
US11414373B2 (en) 2017-01-20 2022-08-16 Evonik Operations Gmbh Glycerol (meth)acrylate carboxylic ester having a long shelf life
JP7040280B2 (ja) * 2017-06-13 2022-03-23 住友化学株式会社 化合物、樹脂、レジスト組成物及びレジストパターンの製造方法
JP6780602B2 (ja) 2017-07-31 2020-11-04 信越化学工業株式会社 レジスト組成物及びパターン形成方法
EP3611155A1 (en) 2018-08-16 2020-02-19 Evonik Operations GmbH Preparation of (meth)acrylic acid esters

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009280538A (ja) * 2008-05-23 2009-12-03 Idemitsu Kosan Co Ltd 脂環構造含有化合物、(メタ)アクリル酸エステル類、(メタ)アクリル系重合体並びにそれを含むポジ型レジスト組成物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3763693B2 (ja) * 1998-08-10 2006-04-05 株式会社東芝 感光性組成物及びパターン形成方法
EP1179750B1 (en) * 2000-08-08 2012-07-25 FUJIFILM Corporation Positive photosensitive composition and method for producing a precision integrated circuit element using the same
JP2003005375A (ja) * 2001-06-21 2003-01-08 Fuji Photo Film Co Ltd ポジ型レジスト組成物
WO2005085301A1 (ja) * 2004-03-08 2005-09-15 Mitsubishi Rayon Co., Ltd. レジスト用重合体、レジスト組成物、およびパターン製造方法、並びにレジスト用重合体用原料化合物
WO2005108343A1 (ja) * 2004-05-10 2005-11-17 Idemitsu Kosan Co., Ltd. アダマンタン誘導体、その製造方法及びフォトレジスト用感光材料
WO2005111097A1 (ja) * 2004-05-18 2005-11-24 Idemitsu Kosan Co., Ltd. アダマンタン誘導体、その製造方法及びフォトレジスト用感光材料
US20050282985A1 (en) * 2004-06-17 2005-12-22 Hiroshi Koyama Fluorine-atom-containing polymerizable unsaturated-monomer, fluorine-atom-containing polymeric compound and photoresist resin composition
TWI400571B (zh) * 2006-03-14 2013-07-01 Fujifilm Corp 正型光阻組成物及使用它之圖案形成方法
EP1975705B1 (en) * 2007-03-28 2016-04-27 FUJIFILM Corporation Positive resist composition and pattern-forming method
TWI403846B (zh) * 2008-02-22 2013-08-01 Tokyo Ohka Kogyo Co Ltd 正型光阻組成物,光阻圖型之形成方法及高分子化合物
JP4671065B2 (ja) * 2008-09-05 2011-04-13 信越化学工業株式会社 ダブルパターン形成方法
JP5629454B2 (ja) * 2008-12-12 2014-11-19 富士フイルム株式会社 重合性化合物、ラクトン含有化合物、ラクトン含有化合物の製造方法、及び、該重合性化合物を重合させた高分子化合物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009280538A (ja) * 2008-05-23 2009-12-03 Idemitsu Kosan Co Ltd 脂環構造含有化合物、(メタ)アクリル酸エステル類、(メタ)アクリル系重合体並びにそれを含むポジ型レジスト組成物

Also Published As

Publication number Publication date
CN104877067A (zh) 2015-09-02
CN103097371A (zh) 2013-05-08
JP2011219363A (ja) 2011-11-04
KR20180128100A (ko) 2018-11-30
US20150316847A1 (en) 2015-11-05
WO2011125291A1 (ja) 2011-10-13
KR20170091182A (ko) 2017-08-08
KR20130034016A (ko) 2013-04-04
US20130022914A1 (en) 2013-01-24

Similar Documents

Publication Publication Date Title
KR102061400B1 (ko) 호모아다만탄 유도체, 그 제조 방법 및 포토레지스트용 감광성 재료
KR101795832B1 (ko) 호모아다만탄 유도체, 그 제조 방법 및 포토레지스트 조성물
KR100943786B1 (ko) 5-메틸렌-1,3-디옥솔란-4-온 유도체, 그의 제조방법, 상기유도체를 중합하여 수득되는 중합체, 레지스트 조성물, 및패턴 형성 방법
US20130034813A1 (en) CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION FOR ArF IMMERSION LITHOGRAPHY AND PATTERN FORMING PROCESS
KR20100122908A (ko) 지환 구조 함유 화합물, (메트)아크릴산에스테르류 및 그 제조 방법
KR20090094769A (ko) 화학 증폭형 레지스트 조성물 및 액침 노광용 화학 증폭형 레지스트 조성물
KR100531535B1 (ko) (메트)아크릴산 에스테르, 그 원료 알콜, 이들의 제조방법, 이 (메트)아크릴산 에스테르를 중합하여 수득되는중합체, 화학 증폭형 레지스트 조성물, 및 패턴 형성 방법
JP2025102982A (ja) 重合体、レジスト組成物、パターンが形成された基板の製造方法、並びに(メタ)アクリル酸エステル及びその製造方法
KR20060051697A (ko) 포지티브형 감광성 수지 및 신규 디티올 화합물
WO2009142142A1 (ja) 脂環構造含有化合物、(メタ)アクリル酸エステル類、(メタ)アクリル系重合体並びにそれを含むポジ型レジスト組成物
CN114206954B (zh) 单体、光致抗蚀剂用树脂、光致抗蚀剂用树脂组合物以及图案形成方法
KR102745678B1 (ko) 단량체, 포토레지스트용 수지, 포토레지스트용 수지 조성물 및 패턴 형성 방법
JP6028047B2 (ja) ホモアダマンタン誘導体、その製造方法及びフォトレジスト用感光性材料
JP5879228B2 (ja) アダマンタン誘導体
JP4951199B2 (ja) (メタ)アクリル酸エステルの製造方法
JP2004002769A (ja) 重合体およびその製造方法
KR101000596B1 (ko) 5-메틸렌-1,3-디옥솔란-4-온 유도체, 그의 제조방법, 상기 유도체를 중합하여 수득되는 중합체, 레지스트 조성물, 및 패턴 형성 방법
JP6705286B2 (ja) 重合性単量体の製造方法、リソグラフィー用重合体の製造方法およびレジスト組成物の製造方法
JP2012001494A (ja) アダマンタン誘導体、その製造方法及び半導体用レジスト材料

Legal Events

Date Code Title Description
A107 Divisional application of patent
A201 Request for examination
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

A107 Divisional application of patent
J201 Request for trial against refusal decision
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

J301 Trial decision

Free format text: TRIAL NUMBER: 2018101004781; TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20181123

Effective date: 20190924

PJ1301 Trial decision

St.27 status event code: A-3-3-V10-V15-crt-PJ1301

Decision date: 20190924

Appeal event data comment text: Appeal Kind Category : Appeal against decision to decline refusal, Appeal Ground Text : 2017 7021225

Appeal request date: 20181123

Appellate body name: Patent Examination Board

Decision authority category: Office appeal board

Decision identifier: 2018101004781

PS0901 Examination by remand of revocation

St.27 status event code: A-6-3-E10-E12-rex-PS0901

S901 Examination by remand of revocation
GRNO Decision to grant (after opposition)
PS0701 Decision of registration after remand of revocation

St.27 status event code: A-3-4-F10-F13-rex-PS0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20221116

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 7

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000