KR102061400B1 - 호모아다만탄 유도체, 그 제조 방법 및 포토레지스트용 감광성 재료 - Google Patents
호모아다만탄 유도체, 그 제조 방법 및 포토레지스트용 감광성 재료 Download PDFInfo
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- KR102061400B1 KR102061400B1 KR1020177021225A KR20177021225A KR102061400B1 KR 102061400 B1 KR102061400 B1 KR 102061400B1 KR 1020177021225 A KR1020177021225 A KR 1020177021225A KR 20177021225 A KR20177021225 A KR 20177021225A KR 102061400 B1 KR102061400 B1 KR 102061400B1
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- KNRAKLWKYQFAPQ-UHFFFAOYSA-N CC(C(OCC(OOC(CC1CC23)(C4)CC12C4OC3=O)=O)=O)=C Chemical compound CC(C(OCC(OOC(CC1CC23)(C4)CC12C4OC3=O)=O)=O)=C KNRAKLWKYQFAPQ-UHFFFAOYSA-N 0.000 description 1
- PNZXEMACUVIIPX-UHFFFAOYSA-N O=C(CCl)OC1(CC2(C3)C4CC2C1)CC3OC4=O Chemical compound O=C(CCl)OC1(CC2(C3)C4CC2C1)CC3OC4=O PNZXEMACUVIIPX-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D313/00—Heterocyclic compounds containing rings of more than six members having one oxygen atom as the only ring hetero atom
- C07D313/02—Seven-membered rings
- C07D313/06—Seven-membered rings condensed with carbocyclic rings or ring systems
- C07D313/10—Seven-membered rings condensed with carbocyclic rings or ring systems condensed with two six-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F224/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a heterocyclic ring containing oxygen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/165—Monolayers, e.g. Langmuir-Blodgett
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/322—Aqueous alkaline compositions
-
- H01L21/0273—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
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- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Materials For Photolithography (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Pyrane Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010086352A JP2011219363A (ja) | 2010-04-02 | 2010-04-02 | ホモアダマンタン誘導体、その製造方法及びフォトレジスト用感光性材料 |
| JPJP-P-2010-086352 | 2010-04-02 | ||
| PCT/JP2011/001532 WO2011125291A1 (ja) | 2010-04-02 | 2011-03-16 | ホモアダマンタン誘導体、その製造方法及びフォトレジスト用感光性材料 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020127025834A Division KR20130034016A (ko) | 2010-04-02 | 2011-03-16 | 호모아다만탄 유도체, 그 제조 방법 및 포토레지스트용 감광성 재료 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187034121A Division KR20180128100A (ko) | 2010-04-02 | 2011-03-16 | 호모아다만탄 유도체, 그 제조 방법 및 포토레지스트용 감광성 재료 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20170091182A KR20170091182A (ko) | 2017-08-08 |
| KR102061400B1 true KR102061400B1 (ko) | 2019-12-31 |
Family
ID=44762262
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020177021225A Active KR102061400B1 (ko) | 2010-04-02 | 2011-03-16 | 호모아다만탄 유도체, 그 제조 방법 및 포토레지스트용 감광성 재료 |
| KR1020127025834A Ceased KR20130034016A (ko) | 2010-04-02 | 2011-03-16 | 호모아다만탄 유도체, 그 제조 방법 및 포토레지스트용 감광성 재료 |
| KR1020187034121A Ceased KR20180128100A (ko) | 2010-04-02 | 2011-03-16 | 호모아다만탄 유도체, 그 제조 방법 및 포토레지스트용 감광성 재료 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020127025834A Ceased KR20130034016A (ko) | 2010-04-02 | 2011-03-16 | 호모아다만탄 유도체, 그 제조 방법 및 포토레지스트용 감광성 재료 |
| KR1020187034121A Ceased KR20180128100A (ko) | 2010-04-02 | 2011-03-16 | 호모아다만탄 유도체, 그 제조 방법 및 포토레지스트용 감광성 재료 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US20130022914A1 (https=) |
| JP (1) | JP2011219363A (https=) |
| KR (3) | KR102061400B1 (https=) |
| CN (2) | CN103097371A (https=) |
| WO (1) | WO2011125291A1 (https=) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5608009B2 (ja) | 2010-08-12 | 2014-10-15 | 大阪有機化学工業株式会社 | ホモアダマンタン誘導体、その製造方法及びフォトレジスト組成物 |
| JP6014980B2 (ja) * | 2011-02-08 | 2016-10-26 | 住友化学株式会社 | 樹脂、レジスト組成物及びレジストパターンの製造方法 |
| JP2013225094A (ja) * | 2011-10-07 | 2013-10-31 | Jsr Corp | フォトレジスト組成物及びレジストパターン形成方法 |
| JP6330250B2 (ja) * | 2012-03-07 | 2018-05-30 | 住友化学株式会社 | レジストパターンの製造方法 |
| JP6123383B2 (ja) * | 2012-03-23 | 2017-05-10 | 住友化学株式会社 | 樹脂、レジスト組成物及びレジストパターンの製造方法 |
| JP6142602B2 (ja) * | 2012-03-23 | 2017-06-07 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP6123384B2 (ja) * | 2012-03-23 | 2017-05-10 | 住友化学株式会社 | 樹脂、レジスト組成物及びレジストパターンの製造方法 |
| JP6315748B2 (ja) * | 2012-04-27 | 2018-04-25 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP6134562B2 (ja) * | 2012-04-27 | 2017-05-24 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP6134563B2 (ja) * | 2012-04-27 | 2017-05-24 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP6195725B2 (ja) * | 2012-05-01 | 2017-09-13 | 住友化学株式会社 | 樹脂、レジスト組成物及びレジストパターンの製造方法 |
| JP6174363B2 (ja) * | 2012-05-14 | 2017-08-02 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP6174362B2 (ja) * | 2012-05-14 | 2017-08-02 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP6246492B2 (ja) * | 2012-05-15 | 2017-12-13 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP6246493B2 (ja) * | 2012-05-15 | 2017-12-13 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP6246491B2 (ja) * | 2012-05-15 | 2017-12-13 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP6208974B2 (ja) * | 2012-05-15 | 2017-10-04 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP6246494B2 (ja) * | 2012-05-18 | 2017-12-13 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP6145303B2 (ja) * | 2012-05-18 | 2017-06-07 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP6208976B2 (ja) * | 2012-05-18 | 2017-10-04 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP6246495B2 (ja) * | 2012-05-18 | 2017-12-13 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP6181996B2 (ja) * | 2012-07-03 | 2017-08-16 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP6149511B2 (ja) * | 2012-07-12 | 2017-06-21 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP6276966B2 (ja) * | 2012-11-15 | 2018-02-07 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| JP5978139B2 (ja) * | 2013-01-22 | 2016-08-24 | 東京応化工業株式会社 | レジストパターン形成方法 |
| JP6058141B2 (ja) * | 2013-08-05 | 2017-01-11 | アルプス電気株式会社 | 透光性導電部材およびそのパターニング方法 |
| US9772558B2 (en) | 2013-09-24 | 2017-09-26 | International Business Machines Corporation | Sulfonic acid ester containing polymers for organic solvent based dual-tone photoresists |
| CA2950922A1 (en) * | 2014-06-27 | 2015-12-30 | Henkel IP & Holding GmbH | Alkoxysilane-functionalized hydrocarbon compounds, intermediates thereof and methods of preparation thereof |
| US10174546B2 (en) * | 2015-03-03 | 2019-01-08 | Mechoshade Systems, Llc | Shade adjustment notification system and method |
| JP6864994B2 (ja) | 2015-06-26 | 2021-04-28 | 住友化学株式会社 | レジスト組成物 |
| JP6670694B2 (ja) * | 2015-07-14 | 2020-03-25 | 住友化学株式会社 | レジスト組成物及びレジストパターン製造方法 |
| JP6960308B2 (ja) * | 2016-12-01 | 2021-11-05 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
| US11414373B2 (en) | 2017-01-20 | 2022-08-16 | Evonik Operations Gmbh | Glycerol (meth)acrylate carboxylic ester having a long shelf life |
| JP7040280B2 (ja) * | 2017-06-13 | 2022-03-23 | 住友化学株式会社 | 化合物、樹脂、レジスト組成物及びレジストパターンの製造方法 |
| JP6780602B2 (ja) | 2017-07-31 | 2020-11-04 | 信越化学工業株式会社 | レジスト組成物及びパターン形成方法 |
| EP3611155A1 (en) | 2018-08-16 | 2020-02-19 | Evonik Operations GmbH | Preparation of (meth)acrylic acid esters |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009280538A (ja) * | 2008-05-23 | 2009-12-03 | Idemitsu Kosan Co Ltd | 脂環構造含有化合物、(メタ)アクリル酸エステル類、(メタ)アクリル系重合体並びにそれを含むポジ型レジスト組成物 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3763693B2 (ja) * | 1998-08-10 | 2006-04-05 | 株式会社東芝 | 感光性組成物及びパターン形成方法 |
| EP1179750B1 (en) * | 2000-08-08 | 2012-07-25 | FUJIFILM Corporation | Positive photosensitive composition and method for producing a precision integrated circuit element using the same |
| JP2003005375A (ja) * | 2001-06-21 | 2003-01-08 | Fuji Photo Film Co Ltd | ポジ型レジスト組成物 |
| WO2005085301A1 (ja) * | 2004-03-08 | 2005-09-15 | Mitsubishi Rayon Co., Ltd. | レジスト用重合体、レジスト組成物、およびパターン製造方法、並びにレジスト用重合体用原料化合物 |
| WO2005108343A1 (ja) * | 2004-05-10 | 2005-11-17 | Idemitsu Kosan Co., Ltd. | アダマンタン誘導体、その製造方法及びフォトレジスト用感光材料 |
| WO2005111097A1 (ja) * | 2004-05-18 | 2005-11-24 | Idemitsu Kosan Co., Ltd. | アダマンタン誘導体、その製造方法及びフォトレジスト用感光材料 |
| US20050282985A1 (en) * | 2004-06-17 | 2005-12-22 | Hiroshi Koyama | Fluorine-atom-containing polymerizable unsaturated-monomer, fluorine-atom-containing polymeric compound and photoresist resin composition |
| TWI400571B (zh) * | 2006-03-14 | 2013-07-01 | Fujifilm Corp | 正型光阻組成物及使用它之圖案形成方法 |
| EP1975705B1 (en) * | 2007-03-28 | 2016-04-27 | FUJIFILM Corporation | Positive resist composition and pattern-forming method |
| TWI403846B (zh) * | 2008-02-22 | 2013-08-01 | Tokyo Ohka Kogyo Co Ltd | 正型光阻組成物,光阻圖型之形成方法及高分子化合物 |
| JP4671065B2 (ja) * | 2008-09-05 | 2011-04-13 | 信越化学工業株式会社 | ダブルパターン形成方法 |
| JP5629454B2 (ja) * | 2008-12-12 | 2014-11-19 | 富士フイルム株式会社 | 重合性化合物、ラクトン含有化合物、ラクトン含有化合物の製造方法、及び、該重合性化合物を重合させた高分子化合物 |
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2010
- 2010-04-02 JP JP2010086352A patent/JP2011219363A/ja active Pending
-
2011
- 2011-03-16 KR KR1020177021225A patent/KR102061400B1/ko active Active
- 2011-03-16 KR KR1020127025834A patent/KR20130034016A/ko not_active Ceased
- 2011-03-16 KR KR1020187034121A patent/KR20180128100A/ko not_active Ceased
- 2011-03-16 CN CN2011800166482A patent/CN103097371A/zh active Pending
- 2011-03-16 CN CN201510231284.XA patent/CN104877067A/zh active Pending
- 2011-03-16 WO PCT/JP2011/001532 patent/WO2011125291A1/ja not_active Ceased
- 2011-03-16 US US13/638,979 patent/US20130022914A1/en not_active Abandoned
-
2015
- 2015-07-14 US US14/798,990 patent/US20150316847A1/en not_active Abandoned
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009280538A (ja) * | 2008-05-23 | 2009-12-03 | Idemitsu Kosan Co Ltd | 脂環構造含有化合物、(メタ)アクリル酸エステル類、(メタ)アクリル系重合体並びにそれを含むポジ型レジスト組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104877067A (zh) | 2015-09-02 |
| CN103097371A (zh) | 2013-05-08 |
| JP2011219363A (ja) | 2011-11-04 |
| KR20180128100A (ko) | 2018-11-30 |
| US20150316847A1 (en) | 2015-11-05 |
| WO2011125291A1 (ja) | 2011-10-13 |
| KR20170091182A (ko) | 2017-08-08 |
| KR20130034016A (ko) | 2013-04-04 |
| US20130022914A1 (en) | 2013-01-24 |
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