KR102054292B1 - 토출 장치, 토출 방법, 수지 성형 장치 및 수지 성형품의 제조 방법 - Google Patents
토출 장치, 토출 방법, 수지 성형 장치 및 수지 성형품의 제조 방법 Download PDFInfo
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- KR102054292B1 KR102054292B1 KR1020180007004A KR20180007004A KR102054292B1 KR 102054292 B1 KR102054292 B1 KR 102054292B1 KR 1020180007004 A KR1020180007004 A KR 1020180007004A KR 20180007004 A KR20180007004 A KR 20180007004A KR 102054292 B1 KR102054292 B1 KR 102054292B1
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- Prior art keywords
- resin
- clamper
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- 239000011347 resin Substances 0.000 title claims abstract description 532
- 229920005989 resin Polymers 0.000 title claims abstract description 532
- 238000007599 discharging Methods 0.000 title claims abstract description 41
- 238000000465 moulding Methods 0.000 title claims description 79
- 238000000034 method Methods 0.000 title claims description 67
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 230000007246 mechanism Effects 0.000 claims abstract description 93
- 239000012530 fluid Substances 0.000 claims abstract description 61
- 238000003860 storage Methods 0.000 claims abstract description 59
- 230000033001 locomotion Effects 0.000 claims abstract description 53
- 230000009969 flowable effect Effects 0.000 claims abstract description 21
- 238000001125 extrusion Methods 0.000 claims abstract description 18
- 230000008569 process Effects 0.000 claims description 32
- 238000007493 shaping process Methods 0.000 claims description 21
- 230000004044 response Effects 0.000 claims description 2
- 239000007788 liquid Substances 0.000 abstract description 212
- 239000000758 substrate Substances 0.000 description 65
- 235000012431 wafers Nutrition 0.000 description 40
- 238000007789 sealing Methods 0.000 description 30
- 239000004065 semiconductor Substances 0.000 description 24
- 238000000605 extraction Methods 0.000 description 12
- 238000007665 sagging Methods 0.000 description 7
- 238000002474 experimental method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
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- 230000008859 change Effects 0.000 description 3
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- 238000001179 sorption measurement Methods 0.000 description 3
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- 230000004308 accommodation Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
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- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea group Chemical group NC(=O)N XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
- B29C2043/3433—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
- B29C2043/3433—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds
- B29C2043/3438—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds moving during dispensing over the moulds, e.g. laying up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Coating Apparatus (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2017-009893 | 2017-01-24 | ||
JP2017009893A JP6672191B2 (ja) | 2017-01-24 | 2017-01-24 | 吐出装置、吐出方法、樹脂成形装置及び樹脂成形品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20180087161A KR20180087161A (ko) | 2018-08-01 |
KR102054292B1 true KR102054292B1 (ko) | 2019-12-10 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020180007004A KR102054292B1 (ko) | 2017-01-24 | 2018-01-19 | 토출 장치, 토출 방법, 수지 성형 장치 및 수지 성형품의 제조 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6672191B2 (ja) |
KR (1) | KR102054292B1 (ja) |
CN (1) | CN108340528B (ja) |
TW (1) | TWI673155B (ja) |
Families Citing this family (10)
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---|---|---|---|---|
TW202116535A (zh) | 2019-08-23 | 2021-05-01 | 日商長瀨化成股份有限公司 | 密封結構體之製造方法 |
JP7417495B2 (ja) | 2020-08-28 | 2024-01-18 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
CN112140571B (zh) * | 2020-09-08 | 2022-04-15 | 重庆工商大学 | 一种用于dome片加工兼回弹力度检测功能的生产设备 |
JP7394732B2 (ja) * | 2020-10-19 | 2023-12-08 | Towa株式会社 | 樹脂供給方法、樹脂成形品の製造方法及び樹脂成形装置 |
CN112549414A (zh) * | 2020-10-30 | 2021-03-26 | 昆山市健侑科技有限公司 | 分段空心硬管表面包覆聚合物发泡层的连续挤出包覆工艺方法 |
CN113102184A (zh) * | 2021-05-26 | 2021-07-13 | 中国电子科技集团公司第二十四研究所 | 一种接触式自封闭温控型点胶装置 |
JP7135192B1 (ja) | 2021-09-30 | 2022-09-12 | Towa株式会社 | 樹脂供給装置、樹脂成形装置、及び、樹脂成形品の製造方法 |
CN114100926B (zh) * | 2021-10-09 | 2022-09-13 | 深圳市柳溪科技发展有限公司 | 一种抗冲击离合器弹簧片生产用喷涂装置 |
CN114522855B (zh) * | 2021-12-20 | 2023-09-08 | 厦门竣铭科技有限公司 | 一种锂电池的高效型点胶机 |
KR102670561B1 (ko) * | 2023-09-27 | 2024-05-31 | 삼진전자(주) | 액상수지 다점토출 및 성형으로 능동적 제어하는 방법 ,시스템 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3677736B2 (ja) | 2001-01-30 | 2005-08-03 | 日精樹脂工業株式会社 | 圧縮成形機における材料供給装置 |
JP2010238844A (ja) | 2009-03-31 | 2010-10-21 | Towa Corp | 圧縮樹脂封止成形に用いられる液状樹脂材料供給方法及び装置 |
JP5814421B2 (ja) | 2014-04-30 | 2015-11-17 | アピックヤマダ株式会社 | 液状樹脂供給装置および樹脂成形装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR970011562B1 (ko) * | 1994-04-09 | 1997-07-12 | 엘지전자 주식회사 | 가스 주입을 이용한 이종 수지물의 사출성형 장치 및 방법 |
JP3091947B2 (ja) * | 1994-11-30 | 2000-09-25 | 株式会社パイオラックス | 負圧カットバルブの構造 |
JPH08318195A (ja) * | 1995-05-25 | 1996-12-03 | Matsushita Electric Ind Co Ltd | ボンドの塗布装置および塗布方法 |
JP2004207257A (ja) * | 2000-08-04 | 2004-07-22 | Nagase & Co Ltd | 半導体デバイス封止用ディスペンサノズルおよびそれを用いた半導体デバイス封止装置 |
JP3984824B2 (ja) | 2001-11-30 | 2007-10-03 | アピックヤマダ株式会社 | 液材吐出装置及び樹脂封止装置 |
CN201969662U (zh) * | 2010-12-01 | 2011-09-14 | 伟志光电(深圳)有限公司 | 一种新型结构的白光led点胶机 |
JP5655237B2 (ja) * | 2010-12-17 | 2015-01-21 | アピックヤマダ株式会社 | 液状樹脂供給装置及び樹脂モールド装置 |
JP6169516B2 (ja) * | 2014-03-31 | 2017-07-26 | Towa株式会社 | 樹脂成形装置及び樹脂成形方法 |
JP6218666B2 (ja) * | 2014-04-25 | 2017-10-25 | Towa株式会社 | 樹脂成形装置及び樹脂成形方法 |
CN204912197U (zh) * | 2015-07-21 | 2015-12-30 | 昆山杰士德精密工业有限公司 | 自动清胶机构 |
CN204911974U (zh) * | 2015-08-14 | 2015-12-30 | 深圳市富康实业有限公司 | 清除点胶针针头残胶的擦胶结构 |
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2017
- 2017-01-24 JP JP2017009893A patent/JP6672191B2/ja active Active
-
2018
- 2018-01-19 KR KR1020180007004A patent/KR102054292B1/ko active IP Right Grant
- 2018-01-23 CN CN201810066096.XA patent/CN108340528B/zh active Active
- 2018-01-23 TW TW107102271A patent/TWI673155B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3677736B2 (ja) | 2001-01-30 | 2005-08-03 | 日精樹脂工業株式会社 | 圧縮成形機における材料供給装置 |
JP2010238844A (ja) | 2009-03-31 | 2010-10-21 | Towa Corp | 圧縮樹脂封止成形に用いられる液状樹脂材料供給方法及び装置 |
JP5814421B2 (ja) | 2014-04-30 | 2015-11-17 | アピックヤマダ株式会社 | 液状樹脂供給装置および樹脂成形装置 |
Also Published As
Publication number | Publication date |
---|---|
CN108340528B (zh) | 2020-06-30 |
JP2018118189A (ja) | 2018-08-02 |
JP6672191B2 (ja) | 2020-03-25 |
CN108340528A (zh) | 2018-07-31 |
TWI673155B (zh) | 2019-10-01 |
KR20180087161A (ko) | 2018-08-01 |
TW201827195A (zh) | 2018-08-01 |
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