TWI673155B - 吐出裝置、吐出方法、樹脂成形裝置和樹脂成形品的製造方法 - Google Patents

吐出裝置、吐出方法、樹脂成形裝置和樹脂成形品的製造方法 Download PDF

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Publication number
TWI673155B
TWI673155B TW107102271A TW107102271A TWI673155B TW I673155 B TWI673155 B TW I673155B TW 107102271 A TW107102271 A TW 107102271A TW 107102271 A TW107102271 A TW 107102271A TW I673155 B TWI673155 B TW I673155B
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TW
Taiwan
Prior art keywords
resin
tube
discharge
amount
holder
Prior art date
Application number
TW107102271A
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English (en)
Chinese (zh)
Other versions
TW201827195A (zh
Inventor
花坂周邦
後藤智行
岩田康弘
水間敬太
Original Assignee
日商Ｔｏｗａ股份有限公司
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Application filed by 日商Ｔｏｗａ股份有限公司 filed Critical 日商Ｔｏｗａ股份有限公司
Publication of TW201827195A publication Critical patent/TW201827195A/zh
Application granted granted Critical
Publication of TWI673155B publication Critical patent/TWI673155B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3433—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3433—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds
    • B29C2043/3438—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds moving during dispensing over the moulds, e.g. laying up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
TW107102271A 2017-01-24 2018-01-23 吐出裝置、吐出方法、樹脂成形裝置和樹脂成形品的製造方法 TWI673155B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-009893 2017-01-24
JP2017009893A JP6672191B2 (ja) 2017-01-24 2017-01-24 吐出装置、吐出方法、樹脂成形装置及び樹脂成形品の製造方法

Publications (2)

Publication Number Publication Date
TW201827195A TW201827195A (zh) 2018-08-01
TWI673155B true TWI673155B (zh) 2019-10-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW107102271A TWI673155B (zh) 2017-01-24 2018-01-23 吐出裝置、吐出方法、樹脂成形裝置和樹脂成形品的製造方法

Country Status (4)

Country Link
JP (1) JP6672191B2 (ja)
KR (1) KR102054292B1 (ja)
CN (1) CN108340528B (ja)
TW (1) TWI673155B (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202116535A (zh) 2019-08-23 2021-05-01 日商長瀨化成股份有限公司 密封結構體之製造方法
JP7417495B2 (ja) * 2020-08-28 2024-01-18 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
CN112140571B (zh) * 2020-09-08 2022-04-15 重庆工商大学 一种用于dome片加工兼回弹力度检测功能的生产设备
JP7394732B2 (ja) * 2020-10-19 2023-12-08 Ｔｏｗａ株式会社 樹脂供給方法、樹脂成形品の製造方法及び樹脂成形装置
CN112549414A (zh) * 2020-10-30 2021-03-26 昆山市健侑科技有限公司 分段空心硬管表面包覆聚合物发泡层的连续挤出包覆工艺方法
CN113102184A (zh) * 2021-05-26 2021-07-13 中国电子科技集团公司第二十四研究所 一种接触式自封闭温控型点胶装置
JP7135192B1 (ja) * 2021-09-30 2022-09-12 Ｔｏｗａ株式会社 樹脂供給装置、樹脂成形装置、及び、樹脂成形品の製造方法
CN114100926B (zh) * 2021-10-09 2022-09-13 深圳市柳溪科技发展有限公司 一种抗冲击离合器弹簧片生产用喷涂装置
CN114522855B (zh) * 2021-12-20 2023-09-08 厦门竣铭科技有限公司 一种锂电池的高效型点胶机
KR102670561B1 (ko) * 2023-09-27 2024-05-31 삼진전자(주) 액상수지 다점토출 및 성형으로 능동적 제어하는 방법 ,시스템

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5564466A (en) * 1994-11-30 1996-10-15 Piolax, Inc. Negative pressure cut valve
US5635221A (en) * 1994-04-09 1997-06-03 Lg Electronics Inc. Injection molding apparatus for resin using gas injection
WO2002013255A1 (fr) * 2000-08-04 2002-02-14 Nagase & Co., Ltd. Buse de distributeur d' etancheification d'un dispositif semi-conducteur, et appareil destine audit dispositif et dote de ladite buse
JP2012126075A (ja) * 2010-12-17 2012-07-05 Apic Yamada Corp 液状樹脂供給装置及び樹脂モールド装置
TW201536511A (zh) * 2014-03-31 2015-10-01 Towa Corp 樹脂成形裝置及樹脂成形方法

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JPH08318195A (ja) * 1995-05-25 1996-12-03 Matsushita Electric Ind Co Ltd ボンドの塗布装置および塗布方法
JP2000114288A (ja) * 1998-10-06 2000-04-21 Hitachi Ltd ポッティング方法および装置ならびにそれを用いた半導体装置の製造方法
JP3677736B2 (ja) 2001-01-30 2005-08-03 日精樹脂工業株式会社 圧縮成形機における材料供給装置
JP3984824B2 (ja) 2001-11-30 2007-10-03 アピックヤマダ株式会社 液材吐出装置及び樹脂封止装置
JP5103090B2 (ja) * 2006-08-10 2012-12-19 治雄 峯岸 ゲル状流体の充填容器とその搾り出し装置
JP2009119424A (ja) * 2007-11-19 2009-06-04 Miura Co Ltd 液体吐出装置
JP5261261B2 (ja) 2009-03-31 2013-08-14 Ｔｏｗａ株式会社 圧縮樹脂封止成形に用いられる液状樹脂材料供給方法及び装置
CN201969662U (zh) * 2010-12-01 2011-09-14 伟志光电（深圳）有限公司 一种新型结构的白光led点胶机
JP6218666B2 (ja) * 2014-04-25 2017-10-25 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP5814421B2 (ja) 2014-04-30 2015-11-17 アピックヤマダ株式会社 液状樹脂供給装置および樹脂成形装置
CN204912197U (zh) * 2015-07-21 2015-12-30 昆山杰士德精密工业有限公司 自动清胶机构
CN204911974U (zh) * 2015-08-14 2015-12-30 深圳市富康实业有限公司 清除点胶针针头残胶的擦胶结构

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5635221A (en) * 1994-04-09 1997-06-03 Lg Electronics Inc. Injection molding apparatus for resin using gas injection
US5564466A (en) * 1994-11-30 1996-10-15 Piolax, Inc. Negative pressure cut valve
WO2002013255A1 (fr) * 2000-08-04 2002-02-14 Nagase & Co., Ltd. Buse de distributeur d' etancheification d'un dispositif semi-conducteur, et appareil destine audit dispositif et dote de ladite buse
JP2012126075A (ja) * 2010-12-17 2012-07-05 Apic Yamada Corp 液状樹脂供給装置及び樹脂モールド装置
TW201536511A (zh) * 2014-03-31 2015-10-01 Towa Corp 樹脂成形裝置及樹脂成形方法

Also Published As

Publication number Publication date
KR20180087161A (ko) 2018-08-01
TW201827195A (zh) 2018-08-01
JP2018118189A (ja) 2018-08-02
JP6672191B2 (ja) 2020-03-25
KR102054292B1 (ko) 2019-12-10
CN108340528B (zh) 2020-06-30
CN108340528A (zh) 2018-07-31

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