KR102047143B1 - 임프린트 장치, 이물 제거 방법, 및 물품의 제조 방법 - Google Patents

임프린트 장치, 이물 제거 방법, 및 물품의 제조 방법 Download PDF

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KR102047143B1
KR102047143B1 KR1020140179299A KR20140179299A KR102047143B1 KR 102047143 B1 KR102047143 B1 KR 102047143B1 KR 1020140179299 A KR1020140179299 A KR 1020140179299A KR 20140179299 A KR20140179299 A KR 20140179299A KR 102047143 B1 KR102047143 B1 KR 102047143B1
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substrate
gap
plate
mold
chuck
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KR20150073847A (ko
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마코토 미즈노
신이치 슈도
츠요시 아라이
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캐논 가부시끼가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/001—Profiled members, e.g. beams, sections

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020140179299A 2013-12-20 2014-12-12 임프린트 장치, 이물 제거 방법, 및 물품의 제조 방법 Active KR102047143B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-264502 2013-12-20
JP2013264502A JP6313591B2 (ja) 2013-12-20 2013-12-20 インプリント装置、異物除去方法及び物品の製造方法

Related Child Applications (1)

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KR1020180101366A Division KR20180100043A (ko) 2013-12-20 2018-08-28 임프린트 장치, 이물 제거 방법, 및 물품의 제조 방법

Publications (2)

Publication Number Publication Date
KR20150073847A KR20150073847A (ko) 2015-07-01
KR102047143B1 true KR102047143B1 (ko) 2019-12-02

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KR1020140179299A Active KR102047143B1 (ko) 2013-12-20 2014-12-12 임프린트 장치, 이물 제거 방법, 및 물품의 제조 방법
KR1020180101366A Withdrawn KR20180100043A (ko) 2013-12-20 2018-08-28 임프린트 장치, 이물 제거 방법, 및 물품의 제조 방법

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US (1) US10201927B2 (enExample)
JP (1) JP6313591B2 (enExample)
KR (2) KR102047143B1 (enExample)
CN (1) CN104730860B (enExample)

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JP6021365B2 (ja) * 2012-03-12 2016-11-09 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP6333039B2 (ja) 2013-05-16 2018-05-30 キヤノン株式会社 インプリント装置、デバイス製造方法およびインプリント方法
JP6315904B2 (ja) * 2013-06-28 2018-04-25 キヤノン株式会社 インプリント方法、インプリント装置及びデバイスの製造方法
JP6525567B2 (ja) * 2014-12-02 2019-06-05 キヤノン株式会社 インプリント装置及び物品の製造方法
JP6602033B2 (ja) * 2015-03-31 2019-11-06 キヤノン株式会社 インプリント装置、供給量分布の作成方法、インプリント方法、及び物品の製造方法
JP6702672B2 (ja) * 2015-09-03 2020-06-03 キヤノン株式会社 インプリント装置、物品の製造方法及び供給装置
US10204780B2 (en) * 2015-09-08 2019-02-12 Canon Kabushiki Kaisha Imprint apparatus, and article manufacturing method
JP6702753B2 (ja) * 2016-02-17 2020-06-03 キヤノン株式会社 リソグラフィ装置、及び物品の製造方法
WO2017145924A1 (ja) * 2016-02-26 2017-08-31 キヤノン株式会社 インプリント装置およびその動作方法ならびに物品製造方法
JP6603678B2 (ja) 2016-02-26 2019-11-06 キヤノン株式会社 インプリント装置およびその動作方法ならびに物品製造方法
JP2017157641A (ja) * 2016-02-29 2017-09-07 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
WO2017149992A1 (ja) * 2016-02-29 2017-09-08 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
JP6789772B2 (ja) * 2016-02-29 2020-11-25 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
JP6833548B2 (ja) * 2016-06-30 2021-02-24 キヤノン株式会社 搬送システム、搬送方法、パターン形成装置、及び物品の製造方法
EP3762778B1 (en) * 2018-03-06 2025-07-09 Applied Materials, Inc. Method of building a 3d functional optical material stacking structure
JP7118674B2 (ja) 2018-03-12 2022-08-16 キヤノン株式会社 型を用いて基板上の組成物を成形する成形装置、成形方法、および物品の製造方法
JP7093214B2 (ja) * 2018-04-02 2022-06-29 キヤノン株式会社 インプリント装置の管理方法、インプリント装置、平坦化層形成装置の管理方法、および、物品製造方法
CN110395045B (zh) * 2019-07-11 2024-10-25 广东乐佳印刷有限公司 光固化油墨印刷品印制后期处理装置
JP7495814B2 (ja) * 2020-05-13 2024-06-05 キヤノン株式会社 インプリント装置、および物品の製造方法
US11262651B2 (en) * 2020-05-28 2022-03-01 Canon Kabushiki Kaisha System for detecting accumulated material on a faceplate of a dispenser and method of inspecting the faceplate

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JP2013069732A (ja) * 2011-09-21 2013-04-18 Canon Inc インプリント装置、それを用いた物品の製造方法

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Also Published As

Publication number Publication date
US10201927B2 (en) 2019-02-12
CN104730860B (zh) 2019-06-28
CN104730860A (zh) 2015-06-24
KR20180100043A (ko) 2018-09-06
JP6313591B2 (ja) 2018-04-18
US20150174816A1 (en) 2015-06-25
KR20150073847A (ko) 2015-07-01
JP2015122373A (ja) 2015-07-02

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