CN104730860B - 压印装置、异物去除方法及物品制造方法 - Google Patents
压印装置、异物去除方法及物品制造方法 Download PDFInfo
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- CN104730860B CN104730860B CN201410804774.XA CN201410804774A CN104730860B CN 104730860 B CN104730860 B CN 104730860B CN 201410804774 A CN201410804774 A CN 201410804774A CN 104730860 B CN104730860 B CN 104730860B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000005516 engineering process Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 208
- 238000012545 processing Methods 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 8
- 238000003860 storage Methods 0.000 claims description 21
- 238000007664 blowing Methods 0.000 claims description 10
- 238000004378 air conditioning Methods 0.000 claims description 7
- 210000000056 organ Anatomy 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 description 56
- 229920005989 resin Polymers 0.000 description 56
- 239000007789 gas Substances 0.000 description 16
- 238000012423 maintenance Methods 0.000 description 9
- 238000005286 illumination Methods 0.000 description 7
- 238000007726 management method Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000017260 vegetative to reproductive phase transition of meristem Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/002—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/001—Profiled members, e.g. beams, sections
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013264502A JP6313591B2 (ja) | 2013-12-20 | 2013-12-20 | インプリント装置、異物除去方法及び物品の製造方法 |
| JP2013-264502 | 2013-12-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104730860A CN104730860A (zh) | 2015-06-24 |
| CN104730860B true CN104730860B (zh) | 2019-06-28 |
Family
ID=53399078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410804774.XA Active CN104730860B (zh) | 2013-12-20 | 2014-12-19 | 压印装置、异物去除方法及物品制造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10201927B2 (enExample) |
| JP (1) | JP6313591B2 (enExample) |
| KR (2) | KR102047143B1 (enExample) |
| CN (1) | CN104730860B (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6021365B2 (ja) * | 2012-03-12 | 2016-11-09 | キヤノン株式会社 | インプリント装置、それを用いた物品の製造方法 |
| JP6333039B2 (ja) | 2013-05-16 | 2018-05-30 | キヤノン株式会社 | インプリント装置、デバイス製造方法およびインプリント方法 |
| JP6315904B2 (ja) * | 2013-06-28 | 2018-04-25 | キヤノン株式会社 | インプリント方法、インプリント装置及びデバイスの製造方法 |
| JP6525567B2 (ja) * | 2014-12-02 | 2019-06-05 | キヤノン株式会社 | インプリント装置及び物品の製造方法 |
| JP6602033B2 (ja) * | 2015-03-31 | 2019-11-06 | キヤノン株式会社 | インプリント装置、供給量分布の作成方法、インプリント方法、及び物品の製造方法 |
| JP6702672B2 (ja) * | 2015-09-03 | 2020-06-03 | キヤノン株式会社 | インプリント装置、物品の製造方法及び供給装置 |
| US10204780B2 (en) * | 2015-09-08 | 2019-02-12 | Canon Kabushiki Kaisha | Imprint apparatus, and article manufacturing method |
| JP6702753B2 (ja) * | 2016-02-17 | 2020-06-03 | キヤノン株式会社 | リソグラフィ装置、及び物品の製造方法 |
| WO2017145924A1 (ja) * | 2016-02-26 | 2017-08-31 | キヤノン株式会社 | インプリント装置およびその動作方法ならびに物品製造方法 |
| JP6603678B2 (ja) | 2016-02-26 | 2019-11-06 | キヤノン株式会社 | インプリント装置およびその動作方法ならびに物品製造方法 |
| JP2017157641A (ja) * | 2016-02-29 | 2017-09-07 | キヤノン株式会社 | インプリント装置、インプリント方法、および物品の製造方法 |
| WO2017149992A1 (ja) * | 2016-02-29 | 2017-09-08 | キヤノン株式会社 | インプリント装置、インプリント方法および物品製造方法 |
| JP6789772B2 (ja) * | 2016-02-29 | 2020-11-25 | キヤノン株式会社 | インプリント装置、インプリント方法および物品製造方法 |
| JP6833548B2 (ja) * | 2016-06-30 | 2021-02-24 | キヤノン株式会社 | 搬送システム、搬送方法、パターン形成装置、及び物品の製造方法 |
| EP3762778B1 (en) * | 2018-03-06 | 2025-07-09 | Applied Materials, Inc. | Method of building a 3d functional optical material stacking structure |
| JP7118674B2 (ja) | 2018-03-12 | 2022-08-16 | キヤノン株式会社 | 型を用いて基板上の組成物を成形する成形装置、成形方法、および物品の製造方法 |
| JP7093214B2 (ja) * | 2018-04-02 | 2022-06-29 | キヤノン株式会社 | インプリント装置の管理方法、インプリント装置、平坦化層形成装置の管理方法、および、物品製造方法 |
| CN110395045B (zh) * | 2019-07-11 | 2024-10-25 | 广东乐佳印刷有限公司 | 光固化油墨印刷品印制后期处理装置 |
| JP7495814B2 (ja) * | 2020-05-13 | 2024-06-05 | キヤノン株式会社 | インプリント装置、および物品の製造方法 |
| US11262651B2 (en) * | 2020-05-28 | 2022-03-01 | Canon Kabushiki Kaisha | System for detecting accumulated material on a faceplate of a dispenser and method of inspecting the faceplate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013042350A1 (en) * | 2011-09-21 | 2013-03-28 | Canon Kabushiki Kaisha | Imprint apparatus and article manufacturing method using same |
| CN103135341A (zh) * | 2011-11-28 | 2013-06-05 | 佳能株式会社 | 压印装置、使用该压印装置的物品制造方法和压印方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08181096A (ja) | 1994-12-27 | 1996-07-12 | Yokogawa Electric Corp | パーティクルサンプラ |
| JP2002080015A (ja) * | 2000-07-07 | 2002-03-19 | Mitsui Chemicals Inc | 荷造り方法及びその用具 |
| JP4393244B2 (ja) * | 2004-03-29 | 2010-01-06 | キヤノン株式会社 | インプリント装置 |
| US8125610B2 (en) * | 2005-12-02 | 2012-02-28 | ASML Metherlands B.V. | Method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus |
| US7832416B2 (en) * | 2006-10-10 | 2010-11-16 | Hewlett-Packard Development Company, L.P. | Imprint lithography apparatus and methods |
| NL1036306A1 (nl) * | 2007-12-20 | 2009-06-23 | Asml Netherlands Bv | Lithographic apparatus and in-line cleaning apparatus. |
| JP5121549B2 (ja) * | 2008-04-21 | 2013-01-16 | 株式会社東芝 | ナノインプリント方法 |
| JP4660581B2 (ja) * | 2008-09-19 | 2011-03-30 | 株式会社東芝 | パターン形成方法 |
| TW201022017A (en) * | 2008-09-30 | 2010-06-16 | Molecular Imprints Inc | Particle mitigation for imprint lithography |
| JP5295748B2 (ja) | 2008-12-18 | 2013-09-18 | 東京エレクトロン株式会社 | 構成部品の洗浄方法及び記憶媒体 |
| JP2010176080A (ja) | 2009-02-02 | 2010-08-12 | Hitachi High-Technologies Corp | プロキシミティ露光装置、及びプロキシミティ露光装置のチャック清掃方法 |
| US9864279B2 (en) * | 2010-08-05 | 2018-01-09 | Asml Netherlands B.V. | Imprint lithography |
| JP5539113B2 (ja) * | 2010-08-30 | 2014-07-02 | キヤノン株式会社 | インプリント装置及び物品の製造方法 |
| WO2012063948A1 (ja) * | 2010-11-12 | 2012-05-18 | 株式会社日立ハイテクノロジーズ | 金型の微細パターン面清掃方法とそれを用いたインプリント装置 |
| JP5924267B2 (ja) * | 2010-12-14 | 2016-05-25 | 株式会社ニコン | 検査方法、検査装置、露光管理方法、露光システムおよび半導体デバイスの製造方法 |
| JP5647029B2 (ja) * | 2011-02-18 | 2014-12-24 | キヤノン株式会社 | インプリント装置及び物品の製造方法 |
| JP5769451B2 (ja) * | 2011-03-07 | 2015-08-26 | キヤノン株式会社 | インプリント装置および物品の製造方法 |
| JP2012243805A (ja) * | 2011-05-16 | 2012-12-10 | Toshiba Corp | パターン形成方法 |
| JP5863286B2 (ja) * | 2011-06-16 | 2016-02-16 | キヤノン株式会社 | インプリント方法、インプリント装置及び物品の製造方法 |
| JP2013161816A (ja) * | 2012-02-01 | 2013-08-19 | Toshiba Corp | パターン形成方法 |
| JP5982996B2 (ja) * | 2012-04-26 | 2016-08-31 | 大日本印刷株式会社 | 異物除去方法 |
-
2013
- 2013-12-20 JP JP2013264502A patent/JP6313591B2/ja active Active
-
2014
- 2014-12-05 US US14/561,576 patent/US10201927B2/en active Active
- 2014-12-12 KR KR1020140179299A patent/KR102047143B1/ko active Active
- 2014-12-19 CN CN201410804774.XA patent/CN104730860B/zh active Active
-
2018
- 2018-08-28 KR KR1020180101366A patent/KR20180100043A/ko not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013042350A1 (en) * | 2011-09-21 | 2013-03-28 | Canon Kabushiki Kaisha | Imprint apparatus and article manufacturing method using same |
| CN103135341A (zh) * | 2011-11-28 | 2013-06-05 | 佳能株式会社 | 压印装置、使用该压印装置的物品制造方法和压印方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US10201927B2 (en) | 2019-02-12 |
| CN104730860A (zh) | 2015-06-24 |
| KR20180100043A (ko) | 2018-09-06 |
| JP6313591B2 (ja) | 2018-04-18 |
| KR102047143B1 (ko) | 2019-12-02 |
| US20150174816A1 (en) | 2015-06-25 |
| KR20150073847A (ko) | 2015-07-01 |
| JP2015122373A (ja) | 2015-07-02 |
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