WO2012063948A1 - 金型の微細パターン面清掃方法とそれを用いたインプリント装置 - Google Patents
金型の微細パターン面清掃方法とそれを用いたインプリント装置 Download PDFInfo
- Publication number
- WO2012063948A1 WO2012063948A1 PCT/JP2011/076111 JP2011076111W WO2012063948A1 WO 2012063948 A1 WO2012063948 A1 WO 2012063948A1 JP 2011076111 W JP2011076111 W JP 2011076111W WO 2012063948 A1 WO2012063948 A1 WO 2012063948A1
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- WIPO (PCT)
- Prior art keywords
- mold
- fine pattern
- substrate
- photocurable resin
- imprint apparatus
- Prior art date
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00841—Cleaning during or after manufacture
- B81C1/00857—Cleaning during or after manufacture after manufacture, e.g. back-end of the line process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0075—Manufacture of substrate-free structures
- B81C99/009—Manufacturing the stamps or the moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
Definitions
- the present invention relates to an imprint apparatus for transferring and forming a fine pattern on the surface of a transfer object, and in particular, a mold fine pattern surface cleaning method suitable for such an imprint apparatus and a mold by using the cleaning method.
- the present invention relates to an imprint apparatus capable of automatically and reliably cleaning a fine pattern surface.
- the conventional photolithographic method using an exposure process can finely process a large area at a time, but since it does not have resolution below the wavelength of light, it is fine below the wavelength of its own light (for example, 100 nm or less). Not suitable for creating structures.
- processing techniques for fine structures below the wavelength of light an exposure technique using an electron beam, an exposure technique using an X-ray, an exposure technique using an ion beam, and the like already exist.
- the pattern formation by the electron beam drawing apparatus is different from the batch exposure method using a light source such as i-line or excimer laser, and the more patterns to be drawn with the electron beam, the longer the drawing (exposure) time is.
- Nanoimprint lithography technology uses a processing technology for fine structures below the wavelength of light, such as electron beam exposure technology, and presses a mold on which a predetermined fine structure pattern is formed against a resist-coated transfer substrate while pressing the mold. This is a technique for transferring a fine structure pattern to a resist layer of a transfer substrate.
- thermoplastic resin for example, PMMA
- Tg glass transition temperature
- This method is called a thermal transfer method.
- This thermal transfer system has an advantage that a general-purpose resin can be used in a wide range as long as it is a thermoplastic resin.
- transfer is performed with a curable resin that is cured when exposed to light such as ultraviolet rays. This method is called an optical transfer method.
- the photoimplant spore nanoimprint processing method requires the use of a special photo-curing resin, but the advantage of reducing the dimensional error of the finished product due to the thermal expansion of the transfer printing plate and printed material compared to the thermal transfer method. There is.
- the equipment does not require a heating mechanism or additional devices such as temperature rise, temperature control, and cooling, and the nanoimprint equipment as a whole is also designed with consideration for thermal distortion countermeasures such as heat insulation. There are advantages such as no longer needed.
- FIG. 7 is a schematic diagram showing the steps of the fine structure transfer method by the optical transfer type nanoimprint technique which is a conventional technique.
- a transfer object having a resist 120 coated on the upper surface of the substrate 100 is prepared, and a stamper 33 having a fine pattern 34 formed on the side in contact with the resist 120 is transferred. It is made to face the substrate 100 which is a body.
- the stamper 33 is pressed against the resist coating surface of the transfer target 100.
- ultraviolet (UV) light is irradiated from the upper surface of the stamper 33, and the resist 120 is cured.
- UV ultraviolet
- the stamper 33 is peeled off from the transfer target 100. After a while, a resist pattern layer 120 is formed on the surface of the substrate 100 which is a transfer target.
- the pattern layer 130 is a reverse image of the fine pattern 34 of the stamper 33.
- the present invention has been made in view of the above-described problems in the prior art, and the object thereof is to remove foreign substances adhering to the fine uneven pattern of the mold without removing the mold from the support. It is another object of the present invention to provide a method for cleaning a fine pattern surface of a mold, and an imprint apparatus using the method.
- a method for removing foreign matter adhering to the surface of a fine pattern of a mold having an uneven fine pattern on at least one surface thereof A photo-curing resin is applied to the surface of the transfer object to which the mold is pressed to form a photo-curing resin layer, and the mold is pressed against the photo-curing resin applied to the surface of the transfer object, A mold that, after curing the photocurable resin, separates the cured photocurable resin from the mold, thereby removing foreign substances adhering to the surface of the fine pattern by taking the cured photocurable resin into the mold.
- a photo-curing resin formed on the surface of the transfer object is formed with a thickness that removes foreign matter adhering to the surface of the fine pattern, and the mold is Transcription To the photocurable resin layer formed on the surface, the mold micropattern surface cleaning method of pressing at a pressure of removing foreign matter adhered to the surface of the fine pattern.
- the photocurable resin layer formed on the surface of the transfer object has a thickness in the range of 10 ⁇ m to 500 ⁇ m,
- the viscosity of the photocurable resin applied to the surface of the transfer target is preferably in the range of 500 cP to 6000 cP.
- the pressure on the photocurable resin layer of the mold is preferably in the range of 1 kPa to 10 kPa.
- a substrate which is a transfer object, is stored inside, and the substrate supply unit that supplies the substrate and the substrate supply unit supply the substrate.
- a photocurable resin film-forming unit that applies a photocurable resin to the surface of the substrate in a film shape, and a mold is pressed against the photocurable resin that is applied in a film shape by the photocurable resin film-forming unit.
- the fine pattern forming unit that forms the fine pattern on the surface of the substrate by forming and curing the fine pattern, the substrate supply unit, the photocurable resin film forming unit, and the operation in the fine pattern forming unit
- the fine pattern forming unit further presses and peels the mold and the mold against the photocurable resin film forming surface of the substrate.
- an imprint apparatus that executes the above-described fine pattern surface cleaning method for a mold at a predetermined timing.
- control unit includes a unit for changing a pressing force of the pressing / peeling unit, or the control unit further includes: It is preferable that a means for changing the thickness of the photocurable resin applied in the photocurable resin film forming section is provided. Or it is preferable that the said control part is further provided with the means for changing the viscosity of the said photocurable resin apply
- the control unit performs a fine pattern surface cleaning method of the mold according to the number of operations of forming a fine pattern on the substrate surface performed by the imprint apparatus. It is preferable to execute the fine pattern surface cleaning method of the mold at a timing corresponding to the execution time of the fine pattern forming operation on the substrate surface performed by the imprint apparatus.
- the fine pattern forming unit further includes means for detecting adhesion of foreign matter on the mold surface
- the control unit includes It is preferable to execute the fine pattern surface cleaning method of the mold at the timing of the detection output from the foreign matter detection means, or the substrate supply means section together with the substrate inside the mold cleaning substrate And the substrate and the mold cleaning substrate are selectively supplied, and the control unit is configured to supply a fine pattern surface of the mold at a timing when the mold cleaning substrate is supplied. It is preferable to carry out the cleaning method.
- FIG. 1 is a schematic configuration diagram illustrating an overall configuration of an imprint apparatus according to an embodiment of the present invention. It is a side view which shows the detailed structure of the transcription
- an imprint apparatus for transferring and forming a fine pattern on the surface of a transfer object according to an embodiment of the present invention, and a method for cleaning a fine pattern surface of a mold for that purpose refer to the attached drawings. However, it explains in detail.
- FIG. 1 is a schematic configuration diagram showing the overall configuration of an optical transfer type imprint apparatus as an example of an apparatus according to an embodiment of the present invention.
- reference numeral 10 denotes a substrate which is a transfer target.
- 100 shows a substrate loading section for loading 100 into the apparatus described below.
- the substrate 100 that is the transfer target a disk-shaped substrate is shown as an example, and a large number of substrates 100 are stored in the substrate carry-in portion 10.
- a general robot arm 11 having a vacuum suction mechanism at its tip is provided, so that substrates are sequentially carried in and supplied one by one.
- Reference numeral 20 in the drawing is for applying and forming a photocurable resin described below on the surface of the substrate 100 carried in by the carry-in unit 10 to form a film, that is, forming a photocurable resin film. Shows the part.
- the photo-curing resin film forming unit 20 has a liquid metering dispenser (dispenser) 21 for dropping a photo-curing resin described below on the surface of the loaded substrate 100 in this example.
- a so-called turntable 22 is provided in which the substrate 100 is mounted on the upper surface thereof and rotated at a predetermined rotation speed by the electric motor 23 or the like.
- reference numeral 30 in the drawing denotes a substrate 100 in which a photocurable resin film is formed on the surface of the photocurable resin film forming unit 20, and a stamper (a fine surface is formed on the surface).
- a stamper a fine surface is formed on the surface.
- the substrate carry-in unit 10 and the photocurable resin film forming unit 20 described above can be configured by apparatuses that are already generally known and put into practical use.
- a general coating apparatus is used for the latter. Since it can be employed, detailed description thereof is omitted here.
- the curable resin film-forming part 20 should just be what forms a photocurable resin in the film form on the surface of the board
- FIG. 2 shows a detailed structure of the transfer (imprint) portion 30.
- a pedestal 32 is disposed on the upper surface of a base 31 in the transfer unit 30, and a substrate 100 having a photocurable resin 110 coated on the surface thereof is formed on the upper surface of the pedestal 32.
- a light-transmitting mold (stamper) 33 made of glass or the like is disposed so as to face the substrate 100 to which the photocurable resin 110 is applied.
- a concave and convex fine structure (pattern) 34 is formed on the lower surface of the mold 33.
- the mold 33 is held by a member (transparent holding portion) 35 made of a light transmissive material, and the holding member 35 is held by a pair of lifting arms 36.
- a UV light source 37 for example, a light emitting diode (LED)
- LED light emitting diode
- FIG. 3 shows a control unit 40 for controlling and / or driving the operation of each unit constituting the above-described imprint apparatus.
- an external interface (I / F) unit 41 for inputting signals from the above-described units, an operation processing unit (CPU that monitors the operation of each unit by predetermined calculation processing, and executes necessary control ) 42, a memory 43 which is a storage device for holding various arithmetic processing programs and data necessary for the arithmetic processing by the arithmetic processing unit, and a control signal to each unit based on the arithmetic result by the arithmetic processing unit
- a drive unit for outputting that is, a carry-in operation drive unit 44, a resin film formation operation drive unit 45, and a transfer operation drive unit 46 are provided.
- control unit 40 described above controls and drives the operation of each unit of the imprint apparatus in the mold cleaning operation described in detail below.
- the carry-in operation drive unit 44 controls / drives the adsorption and movement of the substrate by the robot arm 11 in the carry-in operation drive unit 44
- the resin film formation operation drive unit 45 performs photocurable resin film formation.
- the operation of the liquid fixed amount dispenser (dispenser) 21 in the unit 20, for example, selection and dropping amount of liquid to be dropped, and further the rotational speed of the rotary table 22 are appropriately controlled and driven.
- the transfer operation drive unit 46 performs each operation of the transfer (imprint) unit 30 together with an operation necessary for a general nanoprinting operation and an operation necessary for a mold cleaning operation described below. Control and drive.
- the elevating arm 36 is lowered, and the concave / convex fine pattern 34 of the light-transmitting mold 33 is brought into contact with the photocurable resin layer 110 applied on the upper surface of the substrate 100.
- UV light from the UV light source 37 is applied. Is irradiated to the photocurable resin layer 110 through the transparent holding portion 35 to cure the photocurable resin layer 110.
- the lifting arm 26 is raised, and the mold 33 is peeled off from the substrate 100.
- the foreign matter present in the concave and convex fine pattern 34 of the light-transmitting mold 33 is taken into the cured photocurable resin layer 16 and peeled off.
- the state returns to a clean state in which no foreign matter is present in the uneven fine pattern 34.
- FIG. 4 is a partially enlarged cross-sectional view for illustrating a specific embodiment of the mold fine pattern surface cleaning method according to the present invention.
- fine foreign matter FMa enters the concave portion of the concave-convex fine pattern 34 formed on the lower surface of the mold 33, and on the other hand, the convex portion has a size that does not enter the concave portion.
- the foreign substance FMb having The photocurable resin layer 110 is applied to the upper surface of the substrate 100 with a thickness exceeding the size of the above-described foreign matter, in particular, the foreign matter FMb.
- the mold 33 is brought into contact with the photocurable resin layer 110, and the mold 33 is pressed against the photocurable resin layer 16 as necessary.
- the minute foreign matter FMa present in the concave portion of the fine pattern 34 and the large foreign matter FMb present in the convex portion are both present. It penetrates into the photocurable resin layer 110.
- UV light is irradiated from the upper surface of the mold 33 for a predetermined time, and the photocurable resin layer 110 is cured.
- the photocurable resin layer 16 is cured by the irradiation of UV light, and various foreign substances FMa and FMb having different sizes are taken into the cured photocurable resin layer.
- the mold 33 is raised and peeled off from the substrate 100. Thereby, the foreign matters FMa and FMb are removed from the fine pattern 34, and the mold cleaning operation is completed.
- the object to be transferred on which the fine pattern is transferred / formed that is, the substrate 100 is used for the above-described mold cleaning operation.
- a mold cleaning work substrate 100 ′ that is used exclusively for the mold cleaning method.
- the cleaning work substrate 100 ′ can be made of, for example, silicon, plastic (for example, acrylic resin), glass, metal (for example, aluminum), or the like.
- the mold cleaning work substrate 100 ′ has an outer shape substantially the same as that of the substrate 100, but the thickness is not particularly limited. That is, any mechanical strength that is necessary and sufficient for performing the above-described cleaning operation may be used.
- the substrate 100 used for the cleaning operation can no longer be used as a product, but it is not always necessary to use the mold cleaning substrate 100 '.
- the photocurable resin layer 110 used in the mold cleaning method of the present invention for example, unsaturated polyester, acrylate, or acrylic resins are used.
- Such photocurable resins are generally commercially available from various chemical companies, and furthermore, these resins can contain a photopolymerization initiator.
- the resin liquid is supplied from the liquid metering dispenser 21 to the substantially central portion.
- the resin liquid is generally spread from the central portion of the substrate toward the peripheral portion by dropping and then pressing the spin or mold 33 against the substrate surface.
- low-speed spin coating, roll coating, blade coating, and the like can also be used.
- the thickness of the resin layer formed by spreading from the central part of the substrate 100 or 100 ′ toward the peripheral part is particularly preferably in the range of 10 ⁇ m to 500 ⁇ m.
- the thickness of the spread resin layer is less than 10 ⁇ m, large foreign matters having a size exceeding 10 ⁇ m cannot be taken into the cured resin layer.
- the thickness of the spread resin layer exceeds 500 ⁇ m, the resin itself flows out, which makes it difficult to maintain a uniform thickness, and also the UV of the photocurable resin layer 110. Curing takes too much time and work efficiency decreases.
- the resist layer formed on the upper surface of the substrate 100 is applied by a high-speed spin coating method and has a thickness of about 50 nm to 100 nm.
- the feature is that the photocurable resin layer 110 is formed with a thickness of 100 times or more.
- the viscosity of the photocurable resin used in the mold cleaning method of the present invention is preferably in the range of 500 cP to 6000 cP. This is because when the viscosity is less than 500 cP, the fluidity of the photocurable resin is too high, and it becomes difficult to keep the photocurable resin layer 110 on the surface of the substrate 100 or the cleaning substrate 100 ′. Furthermore, the membrane pressure becomes thinner with time, and it becomes difficult to maintain a resin layer having a desired thickness. On the other hand, when the viscosity exceeds 6000 cP, the fluidity of the photocurable resin is too low, so it takes time to spread the substrate surface with the mold, and the photocurable resin layer 110 has a fine pattern of the mold. There is a possibility of not being able to enter the recess.
- the pressing force when pressing the mold 33 against the substrate 100 or the cleaning work substrate 100 ′ is preferably in the range of 1 kPa to 10 kPa.
- This pressing force is preferably changed according to the viscosity of the photocurable resin layer 110 used in the mold cleaning method.
- a low pressing force is used for materials with low viscosity
- a high pressing force is used for materials with high viscosity. This pressing force is necessary for allowing the photocurable resin layer 110 to penetrate into the fine pattern and is also important for spreading the photocurable resin layer 110.
- the photocurable resin layer 110 may not sufficiently enter the fine pattern, and the photocurable resin layer 110 may not be sufficiently spread. It is possible to become.
- the pressing force exceeds 10 kPa, the pressing force is too high and there is a possibility that the fine pattern of the mold is damaged.
- the mold 33 is described as being made of a light transmissive material such as transparent resin or glass.
- the present invention is not limited to this, for example, The UV light for curing may be irradiated from the side direction.
- Example 1 An example in which the mold cleaning method of the present invention is implemented using the above-described imprint apparatus will be described below.
- a fine pattern 34 having a depth of 50 nm and a convex portion having a width of 60 nm and a concave portion having a width of 60 nm is formed on the surface of the light-transmitting glass mold 33. Foreign matter was previously attached to the convex surface of the pattern 34.
- An unsaturated polyester photocurable resin having a viscosity of 4500 cP was dropped from a liquid quantitative dispenser 21 onto the upper surface of a silicon cleaning work substrate 100 ′ having a diameter ( ⁇ ) of 4 inches and a thickness of 0.5 mm. .
- the mold 33 having the foreign matter is pressed against the unsaturated polyester photocurable resin layer 110 at a pressure of 10 kPa, thereby pressing the unsaturated polyester photocurable resin formed on the surface of the substrate 100.
- a resin layer having a thickness of 50 ⁇ m was formed.
- the UV light source was irradiated with UV light for 2 seconds to cure the unsaturated polyester photocurable resin. Thereafter, the mold was peeled off from the cleaning work substrate 100 '.
- FIGS. 5 (A) and 5 (B) The results are shown in FIGS. 5 (A) and 5 (B).
- FIG. 5A is an optical micrograph of the mold surface before cleaning
- FIG. 5B is an optical micrograph of the mold surface after cleaning.
- FIG. 5 (A) foreign matter adhering in advance to the surface of the mold is observed, but in FIG. 5 (B), the foreign matter is removed from the surface of the mold cleaned by the method of the present invention. It can be confirmed that is reliably removed.
- the mold cleaning method of the present invention was carried out using the same apparatus as described above.
- a fine pattern 34 having a depth of 50 nm and a convex portion having a width of 60 nm and a concave portion having a width of 60 nm is formed.
- foreign matters were previously attached.
- An unsaturated polyester-based photocurable resin having a viscosity of 4500 cP was dropped from a liquid metering dispenser (dispenser) on the upper surface of a cleaning substrate 100 ′ made of silicon having a diameter ( ⁇ ) of 4 inches and a thickness of 0.5 mm. .
- a liquid metering dispenser dispenser
- the unsaturated polyester photocurable resin on the surface of the substrate is spread and a resin having a thickness of 300 ⁇ m A layer was formed.
- UV light was irradiated from a UV light source for 2 seconds to cure the unsaturated polyester photocurable resin. Thereafter, the mold was peeled off from the cleaning work substrate 100 '.
- the determination as to whether or not to perform the mold cleaning operation in the above-described imprint apparatus is performed in the process of the normal imprint operation on the transfer object, for example, in the inspection process, on the pattern layer of the transfer object obtained
- It is conceivable to inspect whether or not there is a defect on the surface for example, inspect and inspect the surface of the substrate with a CCD camera (not shown)
- the cause is that the concave / convex pattern of the mold is damaged, or that foreign matters exist in the concave / convex pattern.
- the uneven pattern of the mold is damaged, which is the cause of the defect, the mold itself must be replaced. However, foreign matter may be attached to the uneven pattern. If it is a cause of the occurrence of a defect, the cleaning method of the present invention is applied.
- N work number
- Nref 1000 in this example
- Step S63 when the number of operations (N) reaches the set value Nref (“YES” in the figure), the mold cleaning operation is performed (step S63), and then the number of operations N is reset to “0”. (Step S64), a series of processing ends. On the other hand, if the number of operations (N) has not reached the set value Nref (“NO” in the figure), a normal imprint operation is performed (step S65), and then the number of operations N is incremented (N ⁇ N + 1). Then (step S66), a series of processing is completed.
- the above operation is executed by the arithmetic processing unit (CPU) 42 constituting the control unit 30 shown in FIG. In the above description, whether or not the mold cleaning operation is necessary may be determined based on the execution time of the fine pattern forming operation instead of the number of operations (N).
- the above-described mold cleaning work may be performed based on an instruction from an operator such as a switch (not shown).
- a photo-curing resin layer 110 is formed by dropping a photo-curing resin on the upper surface of the substrate 100 or the cleaning work substrate 100 ′ with a liquid dispensing device (dispenser) 21, Then, the transfer unit 30 detects the thickness of the layer formed on the substrate that has been carried in, thereby performing a normal imprint operation or performing the above-described mold cleaning operation (so-called cleaning mode). Or just judge.
- the mold cleaning method of the present invention and the imprint apparatus employing the mold cleaning method have been described in detail with reference to preferred embodiments.
- the present invention is limited only to the embodiments disclosed above.
- the mold cleaning method and imprint apparatus of the present invention can be used for, for example, a double-sided imprint apparatus in addition to the above-described single-sided imprint apparatus.
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Abstract
Description
Claims (12)
- 少なくともその一方の面に凹凸状の微細パターンを有する金型の当該微細パターンの表面に付着した異物を除去する方法であって、
前記金型が押圧される被転写体の表面に光硬化樹脂を塗布して光硬化樹脂層を形成し、
前記金型を、前記被転写体表面に塗布した前記光硬化樹脂に対して押圧し、
前記光硬化樹脂を硬化させた後に、当該硬化した光硬化樹脂を前記金型から分離することにより、前記微細パターンの表面に付着した異物を前記硬化した光硬化樹脂に取り込むことによって除去する金型の微細パターン面清掃方法において、
前記被転写体の表面上に形成される光硬化樹脂を、当該微細パターンの表面に付着した異物を除去する厚さで形成すると共に、
前記金型を、前記被転写体表面に形成した前記光硬化樹脂層に対し、当該微細パターンの表面に付着した異物を除去する圧力で押圧することを特徴とする金型の微細パターン面清掃方法。 - 前記請求項1に記載した金型の微細パターン面清掃方法において、前記被転写体表面に形成する前記光硬化樹脂層を、10μm~500μmの範囲の厚さとすることを特徴とする金型の微細パターン面清掃方法。
- 前記請求項2に記載した金型の微細パターン面清掃方法において、前記被転写体表面に塗布する前記光硬化樹脂の粘度は、500cP~6000cPの範囲内であることを特徴とする金型の微細パターン面清掃方法。
- 前記請求項1に記載した金型の微細パターン面清掃方法において、前記金型の前記光硬化樹脂層に対する圧力を1kPa~10kPaの範囲とすることを特徴とする金型の微細パターン面清掃方法。
- 内部に被転写体である基板を格納すると共に、当該基板を供給する基板供給手段部と、
前記基板供給手段部により供給される前記基板の表面に光硬化性樹脂を膜状に塗布する光硬化性樹脂成膜部と、
前記光硬化性樹脂成膜部により膜状に塗布された前記光硬化性樹脂に金型を押圧して微細パターンを形成し、硬化することにより、前記基板の表面に微細パターンを形成する微細パターン形成部と、
前記基板供給手段部と前記光硬化性樹脂成膜部と前記微細パターン形成部における動作を制御するための制御部とを備えたインプリント装置において、
前記微細パターン形成部は、更に、
前記金型と、当該金型を前記基板の光硬化性樹脂膜形成面に対して押圧・剥離するための手段と、前記基板の表面に塗布された前記光硬化性樹脂にその硬化のための光を照射する手段とを備えており、そして、
前記制御部は、前記インプリント装置による前記基板表面への微細パターン形成動作において、所定のタイミングで、前記請求項1~4の何れか1項に記載した金型の微細パターン面清掃方法を実行することを特徴とするインプリント装置。 - 前記請求項5に記載したインプリント装置において、前記制御部は、前記押圧・剥離手段の押圧力を変更するための手段を備えていることを特徴とするインプリント装置。
- 前記請求項5に記載したインプリント装置において、前記制御部は、更に、前記光硬化性樹脂成膜部において塗布される前記光硬化性樹脂の厚さを変更するための手段を備えていることを特徴とするインプリント装置。
- 前記請求項5に記載したインプリント装置において、前記制御部は、更に、前記光硬化性樹脂成膜部において塗布される前記光硬化性樹脂の粘度を変更するための手段を備えていることを特徴とするインプリント装置。
- 前記請求項5に記載したインプリント装置において、前記制御部は、前記金型の微細パターン面清掃方法を、当該インプリント装置が行う前記基板表面への微細パターン形成動作の回数に応じたタイミングで実行することを特徴とするインプリント装置。
- 前記請求項5に記載したインプリント装置において、前記制御部は、前記金型の微細パターン面清掃方法を、当該インプリント装置が行う前記基板表面への微細パターン形成動作の実行時間に応じたタイミングで実行することを特徴とするインプリント装置。
- 前記請求項5に記載したインプリント装置において、前記微細パターン形成部は、更に、前記金型表面の異物の付着を検出する手段を備えており、かつ、
前記前記制御部は、前記異物検出手段からの検出出力のタイミングで、前記金型の微細パターン面清掃方法を実行することを特徴とするインプリント装置。 - 前記請求項4に記載したインプリント装置において、前記基板供給手段部は、その内部に前記基板と共に、金型清掃用基板を格納すると共に、当該基板と当該金型清掃用基板とを選択的に供給し、
前記前記制御部は、前記金型清掃用基板が供給されたタイミングで、前記金型の微細パターン面清掃方法を実行することを特徴とするインプリント装置。
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US13/883,844 US20130224322A1 (en) | 2010-11-12 | 2011-11-11 | Method For Cleaning Fine Pattern Surface Of Mold, And Imprinting Device Using Same |
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