KR102024391B1 - 연삭 장치 - Google Patents

연삭 장치 Download PDF

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Publication number
KR102024391B1
KR102024391B1 KR1020130127072A KR20130127072A KR102024391B1 KR 102024391 B1 KR102024391 B1 KR 102024391B1 KR 1020130127072 A KR1020130127072 A KR 1020130127072A KR 20130127072 A KR20130127072 A KR 20130127072A KR 102024391 B1 KR102024391 B1 KR 102024391B1
Authority
KR
South Korea
Prior art keywords
grinding
wheel
suction
grinding wheel
mounting surface
Prior art date
Application number
KR1020130127072A
Other languages
English (en)
Korean (ko)
Other versions
KR20140065331A (ko
Inventor
노부유키 다카다
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20140065331A publication Critical patent/KR20140065331A/ko
Application granted granted Critical
Publication of KR102024391B1 publication Critical patent/KR102024391B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00—Means for securing grinding wheels on rotary arbors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/07—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a stationary work-table

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020130127072A 2012-11-21 2013-10-24 연삭 장치 KR102024391B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-255132 2012-11-21
JP2012255132A JP6049183B2 (ja) 2012-11-21 2012-11-21 研削装置

Publications (2)

Publication Number Publication Date
KR20140065331A KR20140065331A (ko) 2014-05-29
KR102024391B1 true KR102024391B1 (ko) 2019-09-23

Family

ID=50795745

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130127072A KR102024391B1 (ko) 2012-11-21 2013-10-24 연삭 장치

Country Status (3)

Country Link
JP (1) JP6049183B2 (zh)
KR (1) KR102024391B1 (zh)
CN (1) CN103831682B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104891798A (zh) * 2015-05-20 2015-09-09 安徽省银锐玻璃机械有限公司 一种用于玻璃切割平台的喷水机构
JP6534861B2 (ja) * 2015-06-01 2019-06-26 株式会社ディスコ 研削装置
CN105538162B (zh) * 2015-12-28 2017-10-27 宁波鑫晟工具有限公司 一种设置有散热装置的磨光机
JP7204318B2 (ja) * 2017-11-06 2023-01-16 株式会社ディスコ 研削ホイール
JP7258566B2 (ja) * 2019-01-16 2023-04-17 株式会社東京精密 平面加工装置
JP7224243B2 (ja) * 2019-06-10 2023-02-17 株式会社ディスコ フランジ機構
CN110142683B (zh) * 2019-06-26 2020-04-10 河南城建学院 一种建筑装饰用板材光亮装置
JP7457533B2 (ja) * 2020-03-04 2024-03-28 株式会社東京精密 加工装置
CN117047610B (zh) * 2023-10-10 2024-01-02 苏州明远汽车零部件制造有限公司 一种气囊外壳体用多面磨削设备及磨削方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100574998B1 (ko) 2004-12-03 2006-05-02 삼성전자주식회사 백그라인딩 공정용 반도체 소자의 제조장치 및 백그라인딩공정용 연마판 고정방법
CN102166731A (zh) 2010-02-23 2011-08-31 株式会社迪思科 磨削装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW348279B (en) * 1995-04-10 1998-12-21 Matsushita Electric Ind Co Ltd Substrate grinding method
JP2000094307A (ja) * 1998-09-18 2000-04-04 Ebara Corp ポリッシング装置
JP4697839B2 (ja) * 2001-08-23 2011-06-08 株式会社ディスコ 研削装置
JP2006224201A (ja) 2005-02-15 2006-08-31 Disco Abrasive Syst Ltd 研削ホイール
JP2006237333A (ja) * 2005-02-25 2006-09-07 Disco Abrasive Syst Ltd 半導体ウエーハの研削方法および研削装置
JP5511343B2 (ja) * 2009-12-09 2014-06-04 株式会社ナノテム 研磨装置
JP2011121128A (ja) * 2009-12-09 2011-06-23 Disco Abrasive Syst Ltd 研削ホイールの着脱治具および研削ホイールケース

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100574998B1 (ko) 2004-12-03 2006-05-02 삼성전자주식회사 백그라인딩 공정용 반도체 소자의 제조장치 및 백그라인딩공정용 연마판 고정방법
US20060121840A1 (en) * 2004-12-03 2006-06-08 Jong-Su Kim Grinding assembly of semiconductor wafer back-grinding apparatus and method of fastening a grinding plate to a grinding mount of the same
CN102166731A (zh) 2010-02-23 2011-08-31 株式会社迪思科 磨削装置
JP2011173189A (ja) 2010-02-23 2011-09-08 Disco Corp 搬送機構

Also Published As

Publication number Publication date
KR20140065331A (ko) 2014-05-29
JP6049183B2 (ja) 2016-12-21
CN103831682B (zh) 2017-06-27
CN103831682A (zh) 2014-06-04
JP2014100772A (ja) 2014-06-05

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