JP7204318B2 - 研削ホイール - Google Patents
研削ホイール Download PDFInfo
- Publication number
- JP7204318B2 JP7204318B2 JP2017213648A JP2017213648A JP7204318B2 JP 7204318 B2 JP7204318 B2 JP 7204318B2 JP 2017213648 A JP2017213648 A JP 2017213648A JP 2017213648 A JP2017213648 A JP 2017213648A JP 7204318 B2 JP7204318 B2 JP 7204318B2
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- wafer
- base
- grindstone
- grinding wheel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 60
- 235000012431 wafers Nutrition 0.000 description 49
- 238000000034 method Methods 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/002—Grinding heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B24B41/047—Grinding heads for working on plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
図1に示すように、基台10の中央には、基台10を装着面100から砥石固定面101まで貫通する円形状の開口102が形成されている。
なお、ウェーハWは保持テーブル30の緩やかな円錐面である保持面300aにならって吸引保持されているため、図4に示すように、セグメント砥石11の回転軌跡中の矢印Rで示す範囲内において、セグメント砥石11はウェーハWに当接し研削を行う。
102:開口 103:研削水供給口 104:隙間 106:スリット 11:セグメント砥石
20:スピンドル 20a:流路 21:マウント 21b:流路
30:保持テーブル 300:吸着部 300a:保持面 31:回転手段
38:研削水噴射ノズル
1A:従来の研削ホイール
W:ウェーハ
Claims (1)
- スピンドルの先端に装着され保持テーブルが保持したウェーハを研削する研削ホイールであって、
該スピンドルの先端に装着する装着面を有する基台と、該装着面の反対面に均等間隔で隙間を空けて環状に配設されたセグメント砥石と、隣接する該セグメント砥石どうしの間に形成された該隙間の幅で該隙間を該基台側に延長させて該基台に形成されたスリットと、を備え、該基台の内側面は傾斜面に形成され、該内側面には、該セグメント砥石に研削水を供給する研削水供給口が周方向に等間隔を空けて形成され、該スリットは、該基台の厚みの中位置まで延在し、該研削水供給口から噴出した研削水が該傾斜面を流れて該セグメント砥石に到達する、
研削ホイール。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017213648A JP7204318B2 (ja) | 2017-11-06 | 2017-11-06 | 研削ホイール |
TW107134916A TWI793187B (zh) | 2017-11-06 | 2018-10-03 | 磨削輪 |
KR1020180130927A KR20190051815A (ko) | 2017-11-06 | 2018-10-30 | 연삭 휠 |
US16/174,394 US20190134782A1 (en) | 2017-11-06 | 2018-10-30 | Grinding wheel |
CN201811285155.9A CN109746842A (zh) | 2017-11-06 | 2018-10-31 | 磨削磨轮 |
DE102018218797.5A DE102018218797A1 (de) | 2017-11-06 | 2018-11-05 | Schleifscheibe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017213648A JP7204318B2 (ja) | 2017-11-06 | 2017-11-06 | 研削ホイール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019084613A JP2019084613A (ja) | 2019-06-06 |
JP7204318B2 true JP7204318B2 (ja) | 2023-01-16 |
Family
ID=66179301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017213648A Active JP7204318B2 (ja) | 2017-11-06 | 2017-11-06 | 研削ホイール |
Country Status (6)
Country | Link |
---|---|
US (1) | US20190134782A1 (ja) |
JP (1) | JP7204318B2 (ja) |
KR (1) | KR20190051815A (ja) |
CN (1) | CN109746842A (ja) |
DE (1) | DE102018218797A1 (ja) |
TW (1) | TWI793187B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10835920B2 (en) * | 2018-08-03 | 2020-11-17 | Indian Institute Of Technology Ropar | Technology and process for coating a substrate with swarf particles |
EP3900876B1 (de) * | 2020-04-23 | 2024-05-01 | Siltronic AG | Verfahren zum schleifen einer halbleiterscheibe |
EP4144480B1 (de) | 2021-09-01 | 2024-01-31 | Siltronic AG | Verfahren zum schleifen von halbleiterscheiben |
US11465261B1 (en) * | 2021-09-03 | 2022-10-11 | Dixie Diamond Manufacturing, Inc. | Reciprocal segment abrasive cutting tool |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010052076A (ja) | 2008-08-27 | 2010-03-11 | Disco Abrasive Syst Ltd | 研削ホイール |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0086086A2 (en) * | 1982-02-05 | 1983-08-17 | Boart International Limited | Cutting device, a tool including a cutting device and a method of making a cutting device |
JP2800475B2 (ja) * | 1991-07-05 | 1998-09-21 | 日立工機株式会社 | ダイヤモンドコアビットの製造方法 |
CN2128182Y (zh) * | 1992-04-07 | 1993-03-17 | 王裕兴 | 滑板水口用金刚石瓦状磨块 |
JPH11245169A (ja) * | 1998-02-27 | 1999-09-14 | Asahi Diamond Ind Co Ltd | カップ型ホイール |
JP2000024892A (ja) * | 1998-07-15 | 2000-01-25 | Nippei Toyama Corp | 両頭平面研削装置 |
JP4154067B2 (ja) | 1999-04-06 | 2008-09-24 | 株式会社ディスコ | 研削装置 |
SG119140A1 (en) * | 2001-07-04 | 2006-02-28 | Disco Corp | Grinding wheel |
JP2004074356A (ja) * | 2002-08-20 | 2004-03-11 | Noritake Super Abrasive:Kk | 軸付き砥石 |
JP2006021291A (ja) * | 2004-07-09 | 2006-01-26 | Tokyo Seimitsu Co Ltd | 研削砥石、研削装置、及び研削方法 |
JP2009094326A (ja) * | 2007-10-10 | 2009-04-30 | Disco Abrasive Syst Ltd | ウェーハの研削方法 |
TWI391208B (zh) * | 2009-07-03 | 2013-04-01 | Kinik Co | 可調動態平衡及排屑之研磨砂輪 |
JP6049183B2 (ja) * | 2012-11-21 | 2016-12-21 | 株式会社ディスコ | 研削装置 |
CN203156587U (zh) * | 2013-01-25 | 2013-08-28 | 河南富耐克超硬材料股份有限公司 | 一种杯形砂轮 |
JP2014205225A (ja) * | 2013-04-15 | 2014-10-30 | 株式会社ノリタケカンパニーリミテド | 高硬度脆性材料の研削用砥石 |
CN203210204U (zh) * | 2013-04-24 | 2013-09-25 | 河南富耐克超硬材料股份有限公司 | 锯齿型砂轮 |
JP6353684B2 (ja) * | 2014-04-04 | 2018-07-04 | 株式会社ディスコ | 研削ホイール及び研削室の洗浄方法 |
JP2016168660A (ja) * | 2015-03-13 | 2016-09-23 | 株式会社ディスコ | 研削ホイール |
TWM505373U (zh) * | 2015-04-15 | 2015-07-21 | Taiwan Asahi Diamond Ind Co Ltd | 具有排屑溝之硏磨砂輪 |
JP2017056522A (ja) * | 2015-09-17 | 2017-03-23 | 株式会社ディスコ | 研削ホイール及び研削方法 |
ITUB20160714A1 (it) * | 2016-02-12 | 2017-08-12 | Up Tools Ltd | Mola a tazza per la lavorazione di bordi di lastre |
JP7049801B2 (ja) * | 2017-10-12 | 2022-04-07 | 株式会社ディスコ | 被加工物の研削方法 |
-
2017
- 2017-11-06 JP JP2017213648A patent/JP7204318B2/ja active Active
-
2018
- 2018-10-03 TW TW107134916A patent/TWI793187B/zh active
- 2018-10-30 KR KR1020180130927A patent/KR20190051815A/ko not_active Application Discontinuation
- 2018-10-30 US US16/174,394 patent/US20190134782A1/en not_active Abandoned
- 2018-10-31 CN CN201811285155.9A patent/CN109746842A/zh active Pending
- 2018-11-05 DE DE102018218797.5A patent/DE102018218797A1/de active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010052076A (ja) | 2008-08-27 | 2010-03-11 | Disco Abrasive Syst Ltd | 研削ホイール |
Also Published As
Publication number | Publication date |
---|---|
US20190134782A1 (en) | 2019-05-09 |
JP2019084613A (ja) | 2019-06-06 |
CN109746842A (zh) | 2019-05-14 |
TWI793187B (zh) | 2023-02-21 |
DE102018218797A1 (de) | 2019-05-09 |
KR20190051815A (ko) | 2019-05-15 |
TW201918326A (zh) | 2019-05-16 |
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