JP6517108B2 - Cmp研磨装置 - Google Patents
Cmp研磨装置 Download PDFInfo
- Publication number
- JP6517108B2 JP6517108B2 JP2015154670A JP2015154670A JP6517108B2 JP 6517108 B2 JP6517108 B2 JP 6517108B2 JP 2015154670 A JP2015154670 A JP 2015154670A JP 2015154670 A JP2015154670 A JP 2015154670A JP 6517108 B2 JP6517108 B2 JP 6517108B2
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- JP
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- Prior art keywords
- polishing
- wafer
- polishing pad
- slurry
- chuck table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005498 polishing Methods 0.000 claims description 132
- 239000002002 slurry Substances 0.000 claims description 59
- 230000002093 peripheral effect Effects 0.000 claims description 57
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 19
- 238000007711 solidification Methods 0.000 claims description 10
- 230000008023 solidification Effects 0.000 claims description 10
- 238000007517 polishing process Methods 0.000 claims description 7
- 239000008400 supply water Substances 0.000 claims description 2
- 238000013459 approach Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000006261 foam material Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
1 CMP研磨装置
15 チャックテーブル
16 保持面
25 回転モータ(回転手段)
35 研磨送り手段
40 研磨手段
42 スピンドル
45 研磨パッド
47 スラリ供給手段
50 ノズル
Claims (1)
- ウエーハを吸引保持する保持面を有するチャックテーブルと、該保持面の中心を軸に該チャックテーブルを回転させる回転手段と、該チャックテーブルに吸引保持される該ウエーハを研磨する円板状の研磨パッドと、該研磨パッドの中心を軸に該研磨パッドを回転させるスピンドルを有する研磨手段と、該研磨手段を該チャックテーブルに接近および離反する方向に研磨送りする研磨送り手段と、該研磨パッドの中心からスラリを供給するスラリ供給手段と、を備えるCMP研磨装置であって、
該研磨パッドは、該保持面より大きい面積で形成され、
研磨加工時の該保持面方向の該研磨パッドと該チャックテーブルとの位置関係は、該研磨パッドの外周縁と該チャックテーブルに保持されるウエーハの外周縁とを近づけさせていて、
該研磨パッドの外周縁と該チャックテーブルに保持されるウエーハの外周縁とが最も近づくウエーハの外周縁に水を供給するノズルを備え、
研磨加工中は、該研磨パッドにスラリを供給し該研磨パッドを該スピンドルで回転させ、ウエーハを保持する該チャックテーブルを該回転手段で回転させ、該ノズルから水を供給し、該保持面でのスラリの固化を防止することを特徴とするCMP研磨装置。
Priority Applications (1)
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---|---|---|---|
JP2015154670A JP6517108B2 (ja) | 2015-08-05 | 2015-08-05 | Cmp研磨装置 |
Applications Claiming Priority (1)
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JP2015154670A JP6517108B2 (ja) | 2015-08-05 | 2015-08-05 | Cmp研磨装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017034172A JP2017034172A (ja) | 2017-02-09 |
JP6517108B2 true JP6517108B2 (ja) | 2019-05-22 |
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JP2015154670A Active JP6517108B2 (ja) | 2015-08-05 | 2015-08-05 | Cmp研磨装置 |
Country Status (1)
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JP (1) | JP6517108B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6896472B2 (ja) * | 2017-03-23 | 2021-06-30 | 株式会社ディスコ | ウエーハの研磨方法及び研磨装置 |
CN109304670A (zh) * | 2018-09-20 | 2019-02-05 | 杭州众硅电子科技有限公司 | 一种柔性的抛光装卸部件模块 |
CN113302020A (zh) * | 2019-01-24 | 2021-08-24 | 东京毅力科创株式会社 | 加工装置和加工方法 |
JP7490311B2 (ja) | 2020-07-14 | 2024-05-27 | 株式会社ディスコ | 研磨装置及び研磨方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002079461A (ja) * | 2000-09-07 | 2002-03-19 | Ebara Corp | ポリッシング装置 |
JP4216051B2 (ja) * | 2002-11-22 | 2009-01-28 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP2006216895A (ja) * | 2005-02-07 | 2006-08-17 | Disco Abrasive Syst Ltd | 半導体ウエーハの研磨装置 |
JP5505383B2 (ja) * | 2005-09-15 | 2014-05-28 | 富士通セミコンダクター株式会社 | 研磨装置及び研磨方法 |
JP4901301B2 (ja) * | 2006-05-23 | 2012-03-21 | 株式会社東芝 | 研磨方法及び半導体装置の製造方法 |
JP2008098574A (ja) * | 2006-10-16 | 2008-04-24 | Disco Abrasive Syst Ltd | ウエーハの研磨装置 |
JP5275016B2 (ja) * | 2008-12-25 | 2013-08-28 | 株式会社ディスコ | 研削装置 |
JP5517698B2 (ja) * | 2010-03-30 | 2014-06-11 | 株式会社ディスコ | 研磨装置 |
JP5944724B2 (ja) * | 2012-04-12 | 2016-07-05 | 株式会社ディスコ | チャックテーブル |
JP2015062956A (ja) * | 2012-09-19 | 2015-04-09 | 株式会社荏原製作所 | 研磨装置 |
US20150017889A1 (en) * | 2013-07-12 | 2015-01-15 | Ebara Corporation | Polishing apparatus |
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2015
- 2015-08-05 JP JP2015154670A patent/JP6517108B2/ja active Active
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