JP7098240B2 - 研磨パッド - Google Patents
研磨パッド Download PDFInfo
- Publication number
- JP7098240B2 JP7098240B2 JP2018155656A JP2018155656A JP7098240B2 JP 7098240 B2 JP7098240 B2 JP 7098240B2 JP 2018155656 A JP2018155656 A JP 2018155656A JP 2018155656 A JP2018155656 A JP 2018155656A JP 7098240 B2 JP7098240 B2 JP 7098240B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- groove
- workpiece
- layer
- polishing layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000005498 polishing Methods 0.000 claims description 322
- 239000007788 liquid Substances 0.000 claims description 77
- 239000000463 material Substances 0.000 claims description 47
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 109
- 235000012431 wafers Nutrition 0.000 description 29
- 230000007246 mechanism Effects 0.000 description 25
- 239000006061 abrasive grain Substances 0.000 description 14
- 230000007723 transport mechanism Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0015—Hanging grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Description
3 保護テープ
2 研磨装置
4 基台
4a 開口
4b 開口
6a,6b カセット載置台
8a,8b カセット
10 第1搬送機構
12 操作パネル
14 位置調整機構
16 第2搬送機構
18 X軸移動機構
20 防塵防滴カバー
22 移動テーブル
24 チャックテーブル
24a 保持面
24b 吸引路
26 支持構造
28 Z軸移動機構
30 Z軸ガイドレール
32 Z軸移動プレート
34 Z軸ボールネジ
36 Z軸パルスモータ
38 支持具
40 研磨ユニット
42 スピンドルハウジング
44 スピンドル
46 マウント
46a 貫通孔
48 研磨パッド
50 ボルト
52 研磨液供給路
54 研磨液供給源
56 第3搬送機構
58 洗浄機構
70 基材
70a 上面
70b 下面
70c ねじ孔
70d 貫通孔
72 研磨層
72a 上面
72b 下面
72c 貫通孔
72d 溝
72e 溝
74 研磨液
80 研磨パッド
82 研磨層
82b 下面
82c 貫通孔
82d 第1溝
82e 第2溝
82f 第3溝
90 研磨パッド
92 研磨層
92b 下面
92c 貫通孔
92d 第1溝
92e 第2溝
92f 第3溝
Claims (3)
- 円盤状の基材と、上面側が該基材に貼着される研磨層と、を有する研磨パッドであって、
該基材は、該基材を上下に貫通するように形成され研磨液が供給される第1貫通孔を該基材の中央部に備え、
該研磨層は、該研磨層を上下に貫通するように形成され該研磨液が供給される複数の第2貫通孔と、該研磨層の下面側に形成され該第2貫通孔と連結された複数の溝と、を備え、
該複数の第2貫通孔は、該第1貫通孔と重畳する位置に形成されており、
該複数の溝は、該複数の第2貫通孔から該研磨層の外周に向かって放射状に形成されていることを特徴とする研磨パッド。 - 該研磨層の下面側の、該複数の第2貫通孔よりも該研磨層の外周側に位置する領域には、該溝と連結された複数の同心円状の溝が形成されていることを特徴とする請求項1記載の研磨パッド。
- 該第2貫通孔と連結された該溝は、該研磨層の外周に到達しないように形成されていることを特徴とする請求項1又は2記載の研磨パッド。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018155656A JP7098240B2 (ja) | 2018-08-22 | 2018-08-22 | 研磨パッド |
KR1020190086529A KR20200022331A (ko) | 2018-08-22 | 2019-07-17 | 연마 패드 |
CN201910692943.8A CN110856908B (zh) | 2018-08-22 | 2019-07-30 | 研磨垫 |
US16/541,708 US11612979B2 (en) | 2018-08-22 | 2019-08-15 | Polishing pad |
TW108129537A TWI823988B (zh) | 2018-08-22 | 2019-08-19 | 研磨墊 |
DE102019212581.6A DE102019212581A1 (de) | 2018-08-22 | 2019-08-22 | Polierscheibe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018155656A JP7098240B2 (ja) | 2018-08-22 | 2018-08-22 | 研磨パッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020028944A JP2020028944A (ja) | 2020-02-27 |
JP7098240B2 true JP7098240B2 (ja) | 2022-07-11 |
Family
ID=69412756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018155656A Active JP7098240B2 (ja) | 2018-08-22 | 2018-08-22 | 研磨パッド |
Country Status (6)
Country | Link |
---|---|
US (1) | US11612979B2 (ja) |
JP (1) | JP7098240B2 (ja) |
KR (1) | KR20200022331A (ja) |
CN (1) | CN110856908B (ja) |
DE (1) | DE102019212581A1 (ja) |
TW (1) | TWI823988B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111805412A (zh) * | 2020-07-17 | 2020-10-23 | 中国科学院微电子研究所 | 一种抛光液施配器及抛光装置 |
CN113103077A (zh) * | 2021-04-13 | 2021-07-13 | 深圳微米智能装备科技有限公司 | 一种微晶玻璃加工设备及加工方法 |
US20230021149A1 (en) * | 2021-07-16 | 2023-01-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chemical-mechanical planarization pad and methods of use |
CN114274043B (zh) * | 2021-12-29 | 2023-02-24 | 湖北鼎汇微电子材料有限公司 | 一种抛光垫 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001071256A (ja) | 1999-08-31 | 2001-03-21 | Shinozaki Seisakusho:Kk | 研磨パッドの溝形成方法及び装置並びに研磨パッド |
JP2001138216A (ja) | 1999-11-16 | 2001-05-22 | Speedfam Co Ltd | 研磨装置 |
US20080220702A1 (en) | 2006-07-03 | 2008-09-11 | Sang Fang Chemical Industry Co., Ltd. | Polishing pad having surface texture |
JP2011000676A (ja) | 2009-06-19 | 2011-01-06 | Disco Abrasive Syst Ltd | 研磨パッド |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2089040A (en) * | 1935-07-05 | 1937-08-03 | Gardner Machine Co | Grinding machine and method of grinding |
JPS5859764A (ja) * | 1981-10-07 | 1983-04-08 | Toshiba Ceramics Co Ltd | ラツプ定盤 |
JPS60242975A (ja) * | 1984-05-14 | 1985-12-02 | Kanebo Ltd | 平面研磨装置 |
JPH0899265A (ja) | 1994-09-30 | 1996-04-16 | Disco Abrasive Syst Ltd | 研磨装置 |
US6056851A (en) * | 1996-06-24 | 2000-05-02 | Taiwan Semiconductor Manufacturing Company | Slurry supply system for chemical mechanical polishing |
JP4154067B2 (ja) | 1999-04-06 | 2008-09-24 | 株式会社ディスコ | 研削装置 |
JP2002059360A (ja) * | 2000-08-22 | 2002-02-26 | Nagase Integrex Co Ltd | ラップ盤 |
JP4484466B2 (ja) * | 2003-07-10 | 2010-06-16 | パナソニック株式会社 | 研磨方法およびその研磨方法に用いる粘弾性ポリッシャー |
JPWO2005023487A1 (ja) * | 2003-08-29 | 2007-10-04 | 東邦エンジニアリング株式会社 | 研磨パッドおよびその製造方法と製造装置 |
US20050260929A1 (en) * | 2004-05-20 | 2005-11-24 | Jsr Corporation | Chemical mechanical polishing pad and chemical mechanical polishing method |
CN100478138C (zh) * | 2006-07-03 | 2009-04-15 | 三芳化学工业股份有限公司 | 具有表面纹路的研磨垫 |
JP2008290197A (ja) * | 2007-05-25 | 2008-12-04 | Nihon Micro Coating Co Ltd | 研磨パッド及び方法 |
KR20090051641A (ko) * | 2007-11-19 | 2009-05-22 | 조선대학교산학협력단 | 화학적 기계적 연마장치 |
JP5516051B2 (ja) * | 2010-05-13 | 2014-06-11 | 旭硝子株式会社 | 研磨パッドを用いた研磨装置及びガラス板の製造方法 |
WO2012008252A1 (ja) * | 2010-07-12 | 2012-01-19 | Jsr株式会社 | 化学機械研磨パッドおよび化学機械研磨方法 |
TWI599447B (zh) * | 2013-10-18 | 2017-09-21 | 卡博特微電子公司 | 具有偏移同心溝槽圖樣之邊緣排除區的cmp拋光墊 |
JP6454326B2 (ja) * | 2014-04-18 | 2019-01-16 | 株式会社荏原製作所 | 基板処理装置、基板処理システム、および基板処理方法 |
US10183374B2 (en) * | 2014-08-26 | 2019-01-22 | Ebara Corporation | Buffing apparatus, and substrate processing apparatus |
US10272541B2 (en) * | 2016-01-22 | 2019-04-30 | Rohm and Haas Electronic Matericals CMP Holdings, Inc. | Polishing layer analyzer and method |
CN206998624U (zh) * | 2017-05-26 | 2018-02-13 | 天津以科美科技发展有限公司 | 一种单轴传动动梁式研磨加工装置 |
-
2018
- 2018-08-22 JP JP2018155656A patent/JP7098240B2/ja active Active
-
2019
- 2019-07-17 KR KR1020190086529A patent/KR20200022331A/ko not_active Application Discontinuation
- 2019-07-30 CN CN201910692943.8A patent/CN110856908B/zh active Active
- 2019-08-15 US US16/541,708 patent/US11612979B2/en active Active
- 2019-08-19 TW TW108129537A patent/TWI823988B/zh active
- 2019-08-22 DE DE102019212581.6A patent/DE102019212581A1/de active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001071256A (ja) | 1999-08-31 | 2001-03-21 | Shinozaki Seisakusho:Kk | 研磨パッドの溝形成方法及び装置並びに研磨パッド |
JP2001138216A (ja) | 1999-11-16 | 2001-05-22 | Speedfam Co Ltd | 研磨装置 |
US20080220702A1 (en) | 2006-07-03 | 2008-09-11 | Sang Fang Chemical Industry Co., Ltd. | Polishing pad having surface texture |
JP2011000676A (ja) | 2009-06-19 | 2011-01-06 | Disco Abrasive Syst Ltd | 研磨パッド |
Also Published As
Publication number | Publication date |
---|---|
KR20200022331A (ko) | 2020-03-03 |
CN110856908A (zh) | 2020-03-03 |
TW202009100A (zh) | 2020-03-01 |
US20200061773A1 (en) | 2020-02-27 |
DE102019212581A1 (de) | 2020-02-27 |
TWI823988B (zh) | 2023-12-01 |
US11612979B2 (en) | 2023-03-28 |
JP2020028944A (ja) | 2020-02-27 |
CN110856908B (zh) | 2023-05-05 |
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