KR102010103B1 - 이방성 도전 접착제 및 그의 제조 방법, 발광 장치 및 그의 제조 방법 - Google Patents

이방성 도전 접착제 및 그의 제조 방법, 발광 장치 및 그의 제조 방법 Download PDF

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KR102010103B1
KR102010103B1 KR1020147011209A KR20147011209A KR102010103B1 KR 102010103 B1 KR102010103 B1 KR 102010103B1 KR 1020147011209 A KR1020147011209 A KR 1020147011209A KR 20147011209 A KR20147011209 A KR 20147011209A KR 102010103 B1 KR102010103 B1 KR 102010103B1
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South Korea
Prior art keywords
light reflective
conductive adhesive
light emitting
anisotropic conductive
wiring board
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Korean (ko)
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KR20140084076A (ko
Inventor
아끼라 이시가미
시유끼 가니사와
히데쯔구 나미끼
히데아끼 우마꼬시
마사하루 아오끼
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데쿠세리아루즈 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Led Device Packages (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
KR1020147011209A 2011-10-07 2012-10-05 이방성 도전 접착제 및 그의 제조 방법, 발광 장치 및 그의 제조 방법 Active KR102010103B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2011-222498 2011-10-07
JP2011222498A JP5916334B2 (ja) 2011-10-07 2011-10-07 異方性導電接着剤及びその製造方法、発光装置及びその製造方法
PCT/JP2012/076011 WO2013051708A1 (ja) 2011-10-07 2012-10-05 異方性導電接着剤及びその製造方法、発光装置及びその製造方法

Publications (2)

Publication Number Publication Date
KR20140084076A KR20140084076A (ko) 2014-07-04
KR102010103B1 true KR102010103B1 (ko) 2019-08-12

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KR1020147011209A Active KR102010103B1 (ko) 2011-10-07 2012-10-05 이방성 도전 접착제 및 그의 제조 방법, 발광 장치 및 그의 제조 방법

Country Status (7)

Country Link
US (1) US20140217450A1 (cg-RX-API-DMAC10.html)
EP (1) EP2765173A4 (cg-RX-API-DMAC10.html)
JP (1) JP5916334B2 (cg-RX-API-DMAC10.html)
KR (1) KR102010103B1 (cg-RX-API-DMAC10.html)
CN (1) CN104039914B (cg-RX-API-DMAC10.html)
TW (1) TWI559334B (cg-RX-API-DMAC10.html)
WO (1) WO2013051708A1 (cg-RX-API-DMAC10.html)

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WO2024058398A1 (ko) * 2022-09-16 2024-03-21 삼성전자주식회사 고반사율 이방성 도전 필름 및 이를 포함하는 디스플레이 모듈

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WO2015046326A1 (ja) * 2013-09-26 2015-04-02 デクセリアルズ株式会社 発光装置、異方性導電接着剤、発光装置製造方法
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JP2017157724A (ja) * 2016-03-02 2017-09-07 デクセリアルズ株式会社 表示装置及びその製造方法、並びに発光装置及びその製造方法
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WO2019131904A1 (ja) * 2017-12-28 2019-07-04 日立化成株式会社 接続構造体及びその製造方法
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JP7160302B2 (ja) * 2018-01-31 2022-10-25 三国電子有限会社 接続構造体および接続構造体の作製方法
JP7046351B2 (ja) 2018-01-31 2022-04-04 三国電子有限会社 接続構造体の作製方法
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JP7348478B2 (ja) * 2018-07-09 2023-09-21 日亜化学工業株式会社 発光装置及びその製造方法
TWI671921B (zh) * 2018-09-14 2019-09-11 頎邦科技股份有限公司 晶片封裝構造及其晶片
JP7366337B2 (ja) * 2018-12-25 2023-10-23 日亜化学工業株式会社 光源装置の製造方法および光源装置
EP3675190B1 (en) 2018-12-25 2023-05-03 Nichia Corporation Method of manufacturing light source device and light source device
TWI690102B (zh) * 2019-01-04 2020-04-01 友達光電股份有限公司 發光裝置及其製造方法
JP7292669B2 (ja) * 2019-04-11 2023-06-19 株式会社レゾナック 導電粒子の製造方法
JP7298256B2 (ja) * 2019-04-11 2023-06-27 株式会社レゾナック 導電粒子
KR102862766B1 (ko) * 2019-05-29 2025-09-22 삼성전자주식회사 마이크로 엘이디 디스플레이 및 이의 제작 방법
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WO2024058398A1 (ko) * 2022-09-16 2024-03-21 삼성전자주식회사 고반사율 이방성 도전 필름 및 이를 포함하는 디스플레이 모듈

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Publication number Publication date
JP2013082784A (ja) 2013-05-09
WO2013051708A1 (ja) 2013-04-11
JP5916334B2 (ja) 2016-05-11
US20140217450A1 (en) 2014-08-07
KR20140084076A (ko) 2014-07-04
CN104039914B (zh) 2016-08-24
CN104039914A (zh) 2014-09-10
TW201331955A (zh) 2013-08-01
TWI559334B (zh) 2016-11-21
EP2765173A4 (en) 2015-04-29
EP2765173A1 (en) 2014-08-13

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