KR102007129B1 - 레이저 에칭 가공용 도전성 페이스트, 도전성 박막 및 도전성 적층체 - Google Patents

레이저 에칭 가공용 도전성 페이스트, 도전성 박막 및 도전성 적층체 Download PDF

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Publication number
KR102007129B1
KR102007129B1 KR1020187007912A KR20187007912A KR102007129B1 KR 102007129 B1 KR102007129 B1 KR 102007129B1 KR 1020187007912 A KR1020187007912 A KR 1020187007912A KR 20187007912 A KR20187007912 A KR 20187007912A KR 102007129 B1 KR102007129 B1 KR 102007129B1
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South Korea
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resin
conductive
laser
thin film
conductive thin
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KR1020187007912A
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English (en)
Korean (ko)
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KR20180031820A (ko
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료우 하마사키
신타로우 오마에
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도요보 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09363—Conductive planes wherein only contours around conductors are removed for insulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Paints Or Removers (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020187007912A 2012-07-20 2013-07-08 레이저 에칭 가공용 도전성 페이스트, 도전성 박막 및 도전성 적층체 KR102007129B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012161485 2012-07-20
JPJP-P-2012-161485 2012-07-20
PCT/JP2013/068613 WO2014013899A1 (ja) 2012-07-20 2013-07-08 レーザーエッチング加工用導電性ペースト、導電性薄膜および導電性積層体

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR20157001614A Division KR20150037861A (ko) 2012-07-20 2013-07-08 레이저 에칭 가공용 도전성 페이스트, 도전성 박막 및 도전성 적층체

Publications (2)

Publication Number Publication Date
KR20180031820A KR20180031820A (ko) 2018-03-28
KR102007129B1 true KR102007129B1 (ko) 2019-08-02

Family

ID=49948729

Family Applications (2)

Application Number Title Priority Date Filing Date
KR20157001614A KR20150037861A (ko) 2012-07-20 2013-07-08 레이저 에칭 가공용 도전성 페이스트, 도전성 박막 및 도전성 적층체
KR1020187007912A KR102007129B1 (ko) 2012-07-20 2013-07-08 레이저 에칭 가공용 도전성 페이스트, 도전성 박막 및 도전성 적층체

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR20157001614A KR20150037861A (ko) 2012-07-20 2013-07-08 레이저 에칭 가공용 도전성 페이스트, 도전성 박막 및 도전성 적층체

Country Status (5)

Country Link
JP (9) JP5773292B2 (ja)
KR (2) KR20150037861A (ja)
CN (1) CN104488040B (ja)
TW (2) TWI620202B (ja)
WO (1) WO2014013899A1 (ja)

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KR20150037861A (ko) 2015-04-08
JP5987878B2 (ja) 2016-09-07
JP2017126771A (ja) 2017-07-20
CN104488040B (zh) 2018-08-03
JP2018067548A (ja) 2018-04-26
JP6363048B2 (ja) 2018-07-25
TW201515022A (zh) 2015-04-16
JP2020053393A (ja) 2020-04-02
TWI620202B (zh) 2018-04-01
JP6458820B2 (ja) 2019-01-30
JP2015135817A (ja) 2015-07-27
TW201409489A (zh) 2014-03-01
JP2015026618A (ja) 2015-02-05
JP2014225709A (ja) 2014-12-04
KR20180031820A (ko) 2018-03-28
JP2015127958A (ja) 2015-07-09
JPWO2014013899A1 (ja) 2016-06-30
WO2014013899A1 (ja) 2014-01-23
JP5773292B2 (ja) 2015-09-02
JP5987930B2 (ja) 2016-09-07
JP7059240B2 (ja) 2022-04-25
CN104488040A (zh) 2015-04-01
JP2015181207A (ja) 2015-10-15
JP5880650B2 (ja) 2016-03-09
JP5773298B2 (ja) 2015-09-02

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