CN104488040B - 使用激光刻蚀加工用导电性糊剂而成的回路配线、电路及触摸面板 - Google Patents

使用激光刻蚀加工用导电性糊剂而成的回路配线、电路及触摸面板 Download PDF

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Publication number
CN104488040B
CN104488040B CN201380038679.7A CN201380038679A CN104488040B CN 104488040 B CN104488040 B CN 104488040B CN 201380038679 A CN201380038679 A CN 201380038679A CN 104488040 B CN104488040 B CN 104488040B
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CN
China
Prior art keywords
resin
laser
laser ablation
conductive paste
circuit wiring
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Active
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CN201380038679.7A
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English (en)
Chinese (zh)
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CN104488040A (zh
Inventor
滨崎亮
大前慎太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongyang Textile Mc Co ltd
Original Assignee
Toyobo Co Ltd
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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09363—Conductive planes wherein only contours around conductors are removed for insulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Paints Or Removers (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201380038679.7A 2012-07-20 2013-07-08 使用激光刻蚀加工用导电性糊剂而成的回路配线、电路及触摸面板 Active CN104488040B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-161485 2012-07-20
JP2012161485 2012-07-20
PCT/JP2013/068613 WO2014013899A1 (ja) 2012-07-20 2013-07-08 レーザーエッチング加工用導電性ペースト、導電性薄膜および導電性積層体

Publications (2)

Publication Number Publication Date
CN104488040A CN104488040A (zh) 2015-04-01
CN104488040B true CN104488040B (zh) 2018-08-03

Family

ID=49948729

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380038679.7A Active CN104488040B (zh) 2012-07-20 2013-07-08 使用激光刻蚀加工用导电性糊剂而成的回路配线、电路及触摸面板

Country Status (5)

Country Link
JP (9) JP5773292B2 (ja)
KR (2) KR20150037861A (ja)
CN (1) CN104488040B (ja)
TW (2) TW201409489A (ja)
WO (1) WO2014013899A1 (ja)

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KR102324621B1 (ko) * 2014-01-22 2021-11-11 도요보 가부시키가이샤 레이저 에칭 가공용 도전성 페이스트, 도전성 박막, 도전성 적층체
JP6582982B2 (ja) * 2014-01-22 2019-10-02 東洋紡株式会社 レーザーエッチング加工用導電性ペースト、導電性薄膜、導電性積層体
CN104951116B (zh) * 2014-03-31 2018-08-31 宸盛光电有限公司 触控装置及其制造方法
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JP6519243B2 (ja) * 2015-03-13 2019-05-29 東洋インキＳｃホールディングス株式会社 レーザー加工用導電性ペースト、およびその利用
JP6519242B2 (ja) * 2015-03-13 2019-05-29 東洋インキＳｃホールディングス株式会社 レーザー加工用導電性ペースト、およびその利用
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JPWO2014013899A1 (ja) 2016-06-30
JP6363048B2 (ja) 2018-07-25
JP2015127958A (ja) 2015-07-09
JP2020053393A (ja) 2020-04-02
JP5880650B2 (ja) 2016-03-09
JP6458820B2 (ja) 2019-01-30
JP2017126771A (ja) 2017-07-20
TWI620202B (zh) 2018-04-01
JP5987930B2 (ja) 2016-09-07
JP2018067548A (ja) 2018-04-26
JP5773298B2 (ja) 2015-09-02
JP2015026618A (ja) 2015-02-05
JP2015181207A (ja) 2015-10-15
TW201409489A (zh) 2014-03-01
JP5987878B2 (ja) 2016-09-07
JP5773292B2 (ja) 2015-09-02
CN104488040A (zh) 2015-04-01
JP7059240B2 (ja) 2022-04-25
KR102007129B1 (ko) 2019-08-02
WO2014013899A1 (ja) 2014-01-23
KR20180031820A (ko) 2018-03-28
JP2014225709A (ja) 2014-12-04
JP2015135817A (ja) 2015-07-27
TW201515022A (zh) 2015-04-16
KR20150037861A (ko) 2015-04-08

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Address after: No. 1, No. 13, meitian-1, Shibei District, Osaka, Osaka, Japan

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Address after: South Building, Meitian Twin Towers, No. 13-1, Meitian 1-chome, Kita ku, Osaka City, Osaka Prefecture, Japan

Patentee after: Dongyang Textile MC Co.,Ltd.

Address before: No. 1, No. 13, meitian-1, Shibei District, Osaka, Osaka, Japan

Patentee before: TOYOBO Co.,Ltd.