KR101935609B1 - 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법, 프린트 배선판의 제조 방법 - Google Patents

감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법, 프린트 배선판의 제조 방법 Download PDF

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Publication number
KR101935609B1
KR101935609B1 KR1020120046196A KR20120046196A KR101935609B1 KR 101935609 B1 KR101935609 B1 KR 101935609B1 KR 1020120046196 A KR1020120046196 A KR 1020120046196A KR 20120046196 A KR20120046196 A KR 20120046196A KR 101935609 B1 KR101935609 B1 KR 101935609B1
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South Korea
Prior art keywords
resin composition
photosensitive resin
weight
resist pattern
meth
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KR1020120046196A
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English (en)
Korean (ko)
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KR20120126013A (ko
Inventor
타카히로 후카야
마사히로 미야사카
준이치 이소
Original Assignee
히타치가세이가부시끼가이샤
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Publication of KR20120126013A publication Critical patent/KR20120126013A/ko
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Publication of KR101935609B1 publication Critical patent/KR101935609B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/002—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using materials containing microcapsules; Preparing or processing such materials, e.g. by pressure; Devices or apparatus specially designed therefor
    • G03F7/0022—Devices or apparatus
    • G03F7/003—Devices or apparatus characterised by storage means for the light sensitive material, e.g. cartridges
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/016—Diazonium salts or compounds
    • G03F7/021—Macromolecular diazonium compounds; Macromolecular additives, e.g. binders
    • G03F7/0212—Macromolecular diazonium compounds; Macromolecular additives, e.g. binders characterised by the polymeric binder or the macromolecular additives other than the diazo resins or the polymeric diazonium compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/0275—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with dithiol or polysulfide compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Polymerisation Methods In General (AREA)
KR1020120046196A 2011-05-10 2012-05-02 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법, 프린트 배선판의 제조 방법 KR101935609B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011105441 2011-05-10
JPJP-P-2011-105441 2011-05-10

Publications (2)

Publication Number Publication Date
KR20120126013A KR20120126013A (ko) 2012-11-20
KR101935609B1 true KR101935609B1 (ko) 2019-01-04

Family

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Family Applications (1)

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KR1020120046196A KR101935609B1 (ko) 2011-05-10 2012-05-02 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법, 프린트 배선판의 제조 방법

Country Status (4)

Country Link
JP (2) JP5935462B2 (ja)
KR (1) KR101935609B1 (ja)
CN (2) CN109324480A (ja)
TW (2) TWI644171B (ja)

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* Cited by examiner, † Cited by third party
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CN103028842B (zh) * 2012-12-28 2014-12-31 苏州德龙激光股份有限公司 激光直接成像加工装置及其方法
JP6023010B2 (ja) * 2013-06-26 2016-11-09 東京エレクトロン株式会社 基板処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム
JP6318484B2 (ja) * 2013-07-09 2018-05-09 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP6690532B2 (ja) * 2014-05-13 2020-04-28 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
CN110632825A (zh) * 2019-09-14 2019-12-31 浙江福斯特新材料研究院有限公司 感光性树脂组合物、干膜抗蚀剂
CN110531583B (zh) * 2019-09-14 2023-09-29 浙江福斯特新材料研究院有限公司 感光性树脂组合物、干膜抗蚀层

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007025394A (ja) 2005-07-19 2007-02-01 Fujifilm Holdings Corp パターン形成方法
JP2007144820A (ja) 2005-11-28 2007-06-14 Fujifilm Corp プリント配線板用積層体、及び、それを用いたプリント配線板の作製方法

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JP4493385B2 (ja) * 2004-04-15 2010-06-30 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びその用途
KR20130042049A (ko) * 2004-07-14 2013-04-25 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 조성물, 패턴형성재료, 감광성 적층체, 및 패턴형성장치 및 패턴형성방법
JP4578269B2 (ja) * 2005-02-23 2010-11-10 旭化成イーマテリアルズ株式会社 光重合性樹脂組成物
JP4679356B2 (ja) * 2005-06-28 2011-04-27 旭化成イーマテリアルズ株式会社 感光性樹脂組成物およびそれを用いた感光性樹脂積層体
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JP4635935B2 (ja) * 2006-03-29 2011-02-23 Ｊｓｒ株式会社 着色層形成用感放射線性組成物、カラーフィルタおよびカラー液晶表示素子
CN101405656A (zh) * 2006-04-04 2009-04-08 日立化成工业株式会社 感光性树脂组合物、以及使用其的感光性元件、抗蚀图案的形成方法及印刷电路板的制造方法
JP4749270B2 (ja) * 2006-08-03 2011-08-17 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及び積層体
KR101059408B1 (ko) * 2006-08-03 2011-08-29 아사히 가세이 일렉트로닉스 가부시끼가이샤 감광성 수지 조성물 및 적층체
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WO2009116182A1 (ja) * 2008-03-21 2009-09-24 日立化成工業株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
CN101738861B (zh) * 2008-11-10 2012-07-25 日立化成工业株式会社 感光性树脂组合物以及使用其的印刷电路板的制造方法
CN103543608A (zh) * 2009-02-26 2014-01-29 日立化成工业株式会社 感光性树脂组合物、以及使用了该组合物的感光性元件、抗蚀剂图案的形成方法和印刷线路板的制造方法
KR101068622B1 (ko) * 2009-12-22 2011-09-28 주식회사 엘지화학 기판접착력이 향상된 고차광성 블랙매트릭스 조성물

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JP2007144820A (ja) 2005-11-28 2007-06-14 Fujifilm Corp プリント配線板用積層体、及び、それを用いたプリント配線板の作製方法

Also Published As

Publication number Publication date
TWI670568B (zh) 2019-09-01
JP2016118793A (ja) 2016-06-30
TW201303493A (zh) 2013-01-16
TW201839511A (zh) 2018-11-01
TWI644171B (zh) 2018-12-11
CN102778815A (zh) 2012-11-14
JP2012252320A (ja) 2012-12-20
JP6052440B2 (ja) 2016-12-27
KR20120126013A (ko) 2012-11-20
JP5935462B2 (ja) 2016-06-15
CN109324480A (zh) 2019-02-12

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