KR101929697B1 - 이방 도전성 필름 및 접속 구조체 - Google Patents

이방 도전성 필름 및 접속 구조체 Download PDF

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KR101929697B1
KR101929697B1 KR1020177015109A KR20177015109A KR101929697B1 KR 101929697 B1 KR101929697 B1 KR 101929697B1 KR 1020177015109 A KR1020177015109 A KR 1020177015109A KR 20177015109 A KR20177015109 A KR 20177015109A KR 101929697 B1 KR101929697 B1 KR 101929697B1
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South Korea
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conductive film
anisotropic conductive
conductive
anisotropic
connection
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Korean (ko)
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KR20170076783A (ko
Inventor
신이치 하야시
마사오 사이토
레이지 츠카오
야스시 아쿠츠
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데쿠세리아루즈 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
KR1020177015109A 2014-12-22 2015-12-22 이방 도전성 필름 및 접속 구조체 Active KR101929697B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2014-259509 2014-12-22
JP2014259509 2014-12-22
PCT/JP2015/085744 WO2016104463A1 (ja) 2014-12-22 2015-12-22 異方導電性フィルム及び接続構造体

Publications (2)

Publication Number Publication Date
KR20170076783A KR20170076783A (ko) 2017-07-04
KR101929697B1 true KR101929697B1 (ko) 2018-12-14

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KR1020177015109A Active KR101929697B1 (ko) 2014-12-22 2015-12-22 이방 도전성 필름 및 접속 구조체

Country Status (6)

Country Link
US (1) US9991614B2 (enExample)
JP (3) JP6759578B2 (enExample)
KR (1) KR101929697B1 (enExample)
CN (1) CN107004974B (enExample)
TW (1) TWI686014B (enExample)
WO (1) WO2016104463A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11209875B2 (en) 2019-08-09 2021-12-28 Samsung Display Co., Ltd. Adhesive member and display device including the same
US11419216B2 (en) 2020-03-30 2022-08-16 Samsung Display Co., Ltd. Display device and method of manufacturing the same

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KR102535557B1 (ko) 2016-03-07 2023-05-24 삼성디스플레이 주식회사 표시 장치 및 전자 디바이스
KR102267650B1 (ko) * 2016-12-01 2021-06-21 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
TWI763750B (zh) * 2016-12-01 2022-05-11 日商迪睿合股份有限公司 異向性導電膜
KR102519781B1 (ko) * 2016-12-01 2023-04-10 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
CN107452438B (zh) 2017-07-27 2019-10-11 京东方科技集团股份有限公司 一种各向异性导电胶带及胶带卷、绑定结构及显示装置
TWI845515B (zh) * 2018-06-06 2024-06-21 日商迪睿合股份有限公司 連接體、連接體之製造方法、連接方法
JP7321792B2 (ja) * 2019-06-26 2023-08-07 株式会社ジャパンディスプレイ 異方性導電膜及び表示装置
CN111303795A (zh) * 2020-02-14 2020-06-19 维沃移动通信有限公司 一种异方性导电胶膜及其制备方法和显示装置
KR20210138332A (ko) * 2020-05-12 2021-11-19 안성룡 전도체 본딩 방법
KR20230127298A (ko) * 2021-03-26 2023-08-31 데쿠세리아루즈 가부시키가이샤 필러 배열 필름
KR20230109182A (ko) * 2021-03-26 2023-07-19 데쿠세리아루즈 가부시키가이샤 필러 배열 필름
CN114999951A (zh) * 2022-05-30 2022-09-02 电子科技大学 各向异性导电胶膜互连电气失效可视化分析芯片制备方法
JP2024146277A (ja) * 2023-03-31 2024-10-15 デクセリアルズ株式会社 フィラー配列フィルム及びその製造方法並びに接続構造体及びその製造方法
KR20250156366A (ko) * 2024-04-25 2025-11-03 에이치엔에스하이텍 (주) 패턴 얼라인 정밀성을 향상시킨 이방도전성 접착필름

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JPH09320345A (ja) * 1996-05-31 1997-12-12 Whitaker Corp:The 異方導電性フィルム
JPH10209210A (ja) * 1997-01-20 1998-08-07 Sharp Corp 半導体装置及びその製造方法並びにその検査方法
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JP5543267B2 (ja) * 2010-05-07 2014-07-09 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法、並びに実装体及びその製造方法
JP5690648B2 (ja) * 2011-04-28 2015-03-25 デクセリアルズ株式会社 異方性導電フィルム、接続方法及び接続構造体
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KR102675434B1 (ko) * 2012-08-01 2024-06-17 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름의 제조 방법, 이방성 도전 필름, 및 접속 구조체
JP6476747B2 (ja) * 2014-10-28 2019-03-06 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体

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JP2014044946A (ja) * 2012-08-01 2014-03-13 Dexerials Corp 異方性導電フィルムの製造方法、異方性導電フィルム、及び接続構造体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11209875B2 (en) 2019-08-09 2021-12-28 Samsung Display Co., Ltd. Adhesive member and display device including the same
US11419216B2 (en) 2020-03-30 2022-08-16 Samsung Display Co., Ltd. Display device and method of manufacturing the same

Also Published As

Publication number Publication date
CN107004974B (zh) 2020-09-01
US9991614B2 (en) 2018-06-05
JP2016119306A (ja) 2016-06-30
KR20170076783A (ko) 2017-07-04
TW201635648A (zh) 2016-10-01
JP2023001341A (ja) 2023-01-04
TWI686014B (zh) 2020-02-21
JP6759578B2 (ja) 2020-09-23
JP7541249B2 (ja) 2024-08-28
JP2020177916A (ja) 2020-10-29
WO2016104463A1 (ja) 2016-06-30
US20170352967A1 (en) 2017-12-07
JP7176550B2 (ja) 2022-11-22
CN107004974A (zh) 2017-08-01

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