KR101876501B1 - 인-시츄 제거 가능한 정전 척 - Google Patents

인-시츄 제거 가능한 정전 척 Download PDF

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Publication number
KR101876501B1
KR101876501B1 KR1020167005800A KR20167005800A KR101876501B1 KR 101876501 B1 KR101876501 B1 KR 101876501B1 KR 1020167005800 A KR1020167005800 A KR 1020167005800A KR 20167005800 A KR20167005800 A KR 20167005800A KR 101876501 B1 KR101876501 B1 KR 101876501B1
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South Korea
Prior art keywords
top surface
electrostatic chuck
esc
substrate
support member
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KR1020167005800A
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English (en)
Korean (ko)
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KR20160041982A (ko
Inventor
마이클 에스. 콕스
라라 하우릴책
스티븐 브이. 샌소니
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어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR20160041982A publication Critical patent/KR20160041982A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75723—Electrostatic holding means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Engineering (AREA)
KR1020167005800A 2013-08-05 2014-07-22 인-시츄 제거 가능한 정전 척 Active KR101876501B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361862462P 2013-08-05 2013-08-05
US61/862,462 2013-08-05
PCT/US2014/047656 WO2015020791A1 (en) 2013-08-05 2014-07-22 In-situ removable electrostatic chuck

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020177031250A Division KR20170124620A (ko) 2013-08-05 2014-07-22 인-시츄 제거 가능한 정전 척

Publications (2)

Publication Number Publication Date
KR20160041982A KR20160041982A (ko) 2016-04-18
KR101876501B1 true KR101876501B1 (ko) 2018-07-10

Family

ID=52427453

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020167005800A Active KR101876501B1 (ko) 2013-08-05 2014-07-22 인-시츄 제거 가능한 정전 척
KR1020177031250A Ceased KR20170124620A (ko) 2013-08-05 2014-07-22 인-시츄 제거 가능한 정전 척

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020177031250A Ceased KR20170124620A (ko) 2013-08-05 2014-07-22 인-시츄 제거 가능한 정전 척

Country Status (6)

Country Link
US (2) US9508584B2 (enExample)
JP (1) JP6423880B2 (enExample)
KR (2) KR101876501B1 (enExample)
CN (1) CN105359265B (enExample)
TW (2) TWI629747B (enExample)
WO (1) WO2015020791A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12170191B2 (en) 2022-07-29 2024-12-17 Semes Co., Ltd. Substrate supporting apparatus and substrate treating apparatus including the same

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9264672B2 (en) 2010-12-22 2016-02-16 Magna Mirrors Of America, Inc. Vision display system for vehicle
KR101876501B1 (ko) * 2013-08-05 2018-07-10 어플라이드 머티어리얼스, 인코포레이티드 인-시츄 제거 가능한 정전 척
KR102139682B1 (ko) * 2013-08-05 2020-07-30 어플라이드 머티어리얼스, 인코포레이티드 얇은 기판 취급을 위한 정전 캐리어
US9999947B2 (en) * 2015-05-01 2018-06-19 Component Re-Engineering Company, Inc. Method for repairing heaters and chucks used in semiconductor processing
US10008399B2 (en) 2015-05-19 2018-06-26 Applied Materials, Inc. Electrostatic puck assembly with metal bonded backing plate for high temperature processes
JP2017022343A (ja) * 2015-07-15 2017-01-26 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体製造装置、ウエハリフトピン穴清掃治具
CN108781044A (zh) * 2016-01-12 2018-11-09 格拉比特公司 制造中基于电粘附操作和机械释放的方法和系统
US11011355B2 (en) * 2017-05-12 2021-05-18 Lam Research Corporation Temperature-tuned substrate support for substrate processing systems
KR102098129B1 (ko) * 2018-04-23 2020-04-07 주식회사 엠와이에스 정전기 척
GB201815258D0 (en) * 2018-09-19 2018-10-31 Spts Technologies Ltd A support
US10957520B2 (en) * 2018-09-20 2021-03-23 Lam Research Corporation Long-life high-power terminals for substrate support with embedded heating elements
US11260679B2 (en) * 2018-12-21 2022-03-01 Kateeva, Inc. Gripping for print substrates
KR102651311B1 (ko) 2019-06-03 2024-03-27 삼성전자주식회사 마이크로폰들을 이용하여 사용자의 음성을 분석하는 전자 장치 및 모바일 장치
WO2020255319A1 (ja) * 2019-06-20 2020-12-24 株式会社日立ハイテク プラズマ処理装置およびプラズマ処理方法
US11887878B2 (en) * 2019-06-28 2024-01-30 Applied Materials, Inc. Detachable biasable electrostatic chuck for high temperature applications
KR102640172B1 (ko) 2019-07-03 2024-02-23 삼성전자주식회사 기판 처리 장치 및 이의 구동 방법
JP7615150B2 (ja) * 2019-12-31 2025-01-16 エーエスエムエル ホールディング エヌ．ブイ． 両面静電クランプを製造するためのシステムおよび方法
US12334315B2 (en) * 2020-04-30 2025-06-17 Applied Materials, Inc. Cooled substrate support assembly for radio frequency environments
CN115552589A (zh) * 2020-06-29 2022-12-30 住友大阪水泥股份有限公司 静电吸盘装置
US11749542B2 (en) * 2020-07-27 2023-09-05 Applied Materials, Inc. Apparatus, system, and method for non-contact temperature monitoring of substrate supports
US20220076978A1 (en) * 2020-09-09 2022-03-10 Applied Materials, Inc. Alignment of an electrostatic chuck with a substrate support
CN114695048A (zh) * 2020-12-30 2022-07-01 中微半导体设备(上海)股份有限公司 下电极组件和包含下电极组件的等离子体处理装置
JP2022165477A (ja) * 2021-04-20 2022-11-01 日新イオン機器株式会社 ウエハ支持装置
CN114220758B (zh) * 2021-11-29 2025-05-23 北京北方华创微电子装备有限公司 晶圆承载装置及工艺腔室
US20240249965A1 (en) * 2023-01-19 2024-07-25 Applied Materials, Inc. Substrate support carrier having multiple ceramic discs
TWI844352B (zh) * 2023-05-03 2024-06-01 劉華煒 半導體製程真空腔之靜電吸盤快速排氣結構
US20250118586A1 (en) * 2023-10-06 2025-04-10 Applied Materials, Inc. Electrostatically secured substrate support assembly

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09162272A (ja) * 1995-12-04 1997-06-20 Sony Corp 静電チャック、薄板保持装置及び半導体製造装置並びに搬送方法
JP2003188240A (ja) * 2001-12-21 2003-07-04 Nhk Spring Co Ltd ウエハー保持装置
JP2003282692A (ja) * 2002-03-27 2003-10-03 Matsushita Electric Ind Co Ltd 基板搬送用トレーおよびこれを用いた基板処理装置
JP2004095665A (ja) * 2002-08-29 2004-03-25 Tokyo Electron Ltd 静電吸着装置および処理装置
JP2005109358A (ja) * 2003-10-01 2005-04-21 Canon Inc 基板吸着装置、チャックおよび保持装置ならびにそれらを用いた露光装置

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0828205B2 (ja) * 1989-10-27 1996-03-21 株式会社日立製作所 ウエハ搬送装置
JP3095790B2 (ja) 1991-01-22 2000-10-10 富士電機株式会社 静電チャック
JPH07257751A (ja) 1994-03-18 1995-10-09 Kanagawa Kagaku Gijutsu Akad 静電浮上搬送装置及びその静電浮上用電極
US5740009A (en) * 1996-11-29 1998-04-14 Applied Materials, Inc. Apparatus for improving wafer and chuck edge protection
JP3296292B2 (ja) * 1998-06-26 2002-06-24 松下電器産業株式会社 エッチング方法、クリーニング方法、及びプラズマ処理装置
JP3805134B2 (ja) 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
JP2001035907A (ja) 1999-07-26 2001-02-09 Ulvac Japan Ltd 吸着装置
US6678143B2 (en) 2000-12-11 2004-01-13 General Electric Company Electrostatic chuck and method of manufacturing the same
JP2002357838A (ja) 2001-05-31 2002-12-13 Hitachi Industries Co Ltd 基板貼り合わせ方法及びその装置
JP2003179128A (ja) 2001-12-11 2003-06-27 Ngk Spark Plug Co Ltd 静電チャック
JP2003243493A (ja) 2002-02-15 2003-08-29 Taiheiyo Cement Corp 双極型静電チャック
JP3962661B2 (ja) * 2002-08-30 2007-08-22 三菱重工業株式会社 静電チャック支持機構及び支持台装置及びプラズマ処理装置
JP2004103799A (ja) * 2002-09-09 2004-04-02 Canon Inc 基板保持装置、デバイス製造装置及びデバイス製造方法
JP3748559B2 (ja) * 2003-06-30 2006-02-22 キヤノン株式会社 ステージ装置、露光装置、荷電ビーム描画装置、デバイス製造方法、基板電位測定方法及び静電チャック
US7916447B2 (en) 2003-07-08 2011-03-29 Future Vision Inc. Electrostatic chuck for substrate stage, electrode used for the chuck, and treating system having the chuck and electrode
JP2005245106A (ja) * 2004-02-25 2005-09-08 Kyocera Corp 静電チャック
JP4684222B2 (ja) 2004-03-19 2011-05-18 株式会社クリエイティブ テクノロジー 双極型静電チャック
CN100576486C (zh) 2005-05-20 2009-12-30 筑波精工株式会社 静电保持装置以及使用其的静电钳
KR20070016227A (ko) * 2005-08-02 2007-02-08 삼성전자주식회사 반도체 제조설비
KR100994299B1 (ko) 2005-12-06 2010-11-12 가부시키가이샤 크리에이티브 테크놀러지 정전척용 전극 시트 및 정전척
JP4802018B2 (ja) 2006-03-09 2011-10-26 筑波精工株式会社 静電保持装置及びそれを用いた真空環境装置並びにアライメント装置又は貼り合わせ装置
JP4790458B2 (ja) * 2006-03-22 2011-10-12 東京エレクトロン株式会社 プラズマ処理装置
US20080062609A1 (en) 2006-08-10 2008-03-13 Shinji Himori Electrostatic chuck device
US7989022B2 (en) 2007-07-20 2011-08-02 Micron Technology, Inc. Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto
JP5112808B2 (ja) 2007-10-15 2013-01-09 筑波精工株式会社 静電型補強装置
EP2306505A4 (en) 2008-07-08 2011-09-14 Creative Tech Corp BIPOLAR ELECTROSTATIC CHUCK
KR101001454B1 (ko) 2009-01-23 2010-12-14 삼성모바일디스플레이주식회사 정전척 및 이를 구비한 유기전계발광 소자의 제조장치
WO2010095540A1 (ja) * 2009-02-18 2010-08-26 株式会社アルバック ウェハ搬送用トレイ及びこのトレイ上にウェハを固定する方法
US20120227886A1 (en) 2011-03-10 2012-09-13 Taipei Semiconductor Manufacturing Company, Ltd. Substrate Assembly Carrier Using Electrostatic Force
JP6003011B2 (ja) * 2011-03-31 2016-10-05 東京エレクトロン株式会社 基板処理装置
KR102047001B1 (ko) 2012-10-16 2019-12-03 삼성디스플레이 주식회사 정전 척
KR101876501B1 (ko) * 2013-08-05 2018-07-10 어플라이드 머티어리얼스, 인코포레이티드 인-시츄 제거 가능한 정전 척
US9740111B2 (en) 2014-05-16 2017-08-22 Applied Materials, Inc. Electrostatic carrier for handling substrates for processing
US10978334B2 (en) 2014-09-02 2021-04-13 Applied Materials, Inc. Sealing structure for workpiece to substrate bonding in a processing chamber

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09162272A (ja) * 1995-12-04 1997-06-20 Sony Corp 静電チャック、薄板保持装置及び半導体製造装置並びに搬送方法
JP2003188240A (ja) * 2001-12-21 2003-07-04 Nhk Spring Co Ltd ウエハー保持装置
JP2003282692A (ja) * 2002-03-27 2003-10-03 Matsushita Electric Ind Co Ltd 基板搬送用トレーおよびこれを用いた基板処理装置
JP2004095665A (ja) * 2002-08-29 2004-03-25 Tokyo Electron Ltd 静電吸着装置および処理装置
JP2005109358A (ja) * 2003-10-01 2005-04-21 Canon Inc 基板吸着装置、チャックおよび保持装置ならびにそれらを用いた露光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12170191B2 (en) 2022-07-29 2024-12-17 Semes Co., Ltd. Substrate supporting apparatus and substrate treating apparatus including the same

Also Published As

Publication number Publication date
TW201513262A (zh) 2015-04-01
CN105359265B (zh) 2018-12-14
US9508584B2 (en) 2016-11-29
WO2015020791A1 (en) 2015-02-12
JP2016531438A (ja) 2016-10-06
JP6423880B2 (ja) 2018-11-14
TWI629747B (zh) 2018-07-11
CN105359265A (zh) 2016-02-24
TW201729337A (zh) 2017-08-16
KR20160041982A (ko) 2016-04-18
KR20170124620A (ko) 2017-11-10
US20170062260A1 (en) 2017-03-02
TWI613752B (zh) 2018-02-01
US9773692B2 (en) 2017-09-26
US20150036259A1 (en) 2015-02-05

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