JP6423880B2 - インシトゥで取り出すことができる静電チャック - Google Patents

インシトゥで取り出すことができる静電チャック Download PDF

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Publication number
JP6423880B2
JP6423880B2 JP2016533311A JP2016533311A JP6423880B2 JP 6423880 B2 JP6423880 B2 JP 6423880B2 JP 2016533311 A JP2016533311 A JP 2016533311A JP 2016533311 A JP2016533311 A JP 2016533311A JP 6423880 B2 JP6423880 B2 JP 6423880B2
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Prior art keywords
electrostatic chuck
top surface
dielectric layer
esc
support
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Active
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JP2016533311A
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Japanese (ja)
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JP2016531438A5 (enExample
JP2016531438A (ja
Inventor
マイケル エス コックス
マイケル エス コックス
ララ ホリルチャック
ララ ホリルチャック
スティーヴン ヴイ サンソーニ
スティーヴン ヴイ サンソーニ
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2016531438A5 publication Critical patent/JP2016531438A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75723—Electrostatic holding means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Engineering (AREA)
JP2016533311A 2013-08-05 2014-07-22 インシトゥで取り出すことができる静電チャック Active JP6423880B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361862462P 2013-08-05 2013-08-05
US61/862,462 2013-08-05
PCT/US2014/047656 WO2015020791A1 (en) 2013-08-05 2014-07-22 In-situ removable electrostatic chuck

Publications (3)

Publication Number Publication Date
JP2016531438A JP2016531438A (ja) 2016-10-06
JP2016531438A5 JP2016531438A5 (enExample) 2017-08-31
JP6423880B2 true JP6423880B2 (ja) 2018-11-14

Family

ID=52427453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016533311A Active JP6423880B2 (ja) 2013-08-05 2014-07-22 インシトゥで取り出すことができる静電チャック

Country Status (6)

Country Link
US (2) US9508584B2 (enExample)
JP (1) JP6423880B2 (enExample)
KR (2) KR101876501B1 (enExample)
CN (1) CN105359265B (enExample)
TW (2) TWI629747B (enExample)
WO (1) WO2015020791A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11548444B2 (en) 2010-12-22 2023-01-10 Magna Electronics Inc. Vehicular multi-camera surround view system with video display

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JP6518666B2 (ja) * 2013-08-05 2019-05-22 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 薄い基板をハンドリングするための静電キャリア
KR101876501B1 (ko) * 2013-08-05 2018-07-10 어플라이드 머티어리얼스, 인코포레이티드 인-시츄 제거 가능한 정전 척
US9999947B2 (en) * 2015-05-01 2018-06-19 Component Re-Engineering Company, Inc. Method for repairing heaters and chucks used in semiconductor processing
US10008399B2 (en) 2015-05-19 2018-06-26 Applied Materials, Inc. Electrostatic puck assembly with metal bonded backing plate for high temperature processes
JP2017022343A (ja) * 2015-07-15 2017-01-26 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体製造装置、ウエハリフトピン穴清掃治具
CN108781045A (zh) * 2016-01-12 2018-11-09 格拉比特公司 制造中基于电粘附操作的方法和系统
US11011355B2 (en) * 2017-05-12 2021-05-18 Lam Research Corporation Temperature-tuned substrate support for substrate processing systems
KR102098129B1 (ko) * 2018-04-23 2020-04-07 주식회사 엠와이에스 정전기 척
GB201815258D0 (en) 2018-09-19 2018-10-31 Spts Technologies Ltd A support
US10957520B2 (en) 2018-09-20 2021-03-23 Lam Research Corporation Long-life high-power terminals for substrate support with embedded heating elements
US11260679B2 (en) * 2018-12-21 2022-03-01 Kateeva, Inc. Gripping for print substrates
KR102651311B1 (ko) 2019-06-03 2024-03-27 삼성전자주식회사 마이크로폰들을 이용하여 사용자의 음성을 분석하는 전자 장치 및 모바일 장치
WO2020255319A1 (ja) * 2019-06-20 2020-12-24 株式会社日立ハイテク プラズマ処理装置およびプラズマ処理方法
US11887878B2 (en) 2019-06-28 2024-01-30 Applied Materials, Inc. Detachable biasable electrostatic chuck for high temperature applications
KR102640172B1 (ko) 2019-07-03 2024-02-23 삼성전자주식회사 기판 처리 장치 및 이의 구동 방법
KR20220122634A (ko) * 2019-12-31 2022-09-02 에이에스엠엘 홀딩 엔.브이. 양면 정전 클램프를 제조하기 위한 시스템 및 방법
US12334315B2 (en) * 2020-04-30 2025-06-17 Applied Materials, Inc. Cooled substrate support assembly for radio frequency environments
KR102859370B1 (ko) * 2020-06-29 2025-09-15 스미토모 오사카 세멘토 가부시키가이샤 정전 척 장치
US11749542B2 (en) * 2020-07-27 2023-09-05 Applied Materials, Inc. Apparatus, system, and method for non-contact temperature monitoring of substrate supports
US20220076978A1 (en) * 2020-09-09 2022-03-10 Applied Materials, Inc. Alignment of an electrostatic chuck with a substrate support
CN114695048A (zh) * 2020-12-30 2022-07-01 中微半导体设备(上海)股份有限公司 下电极组件和包含下电极组件的等离子体处理装置
JP2022165477A (ja) * 2021-04-20 2022-11-01 日新イオン機器株式会社 ウエハ支持装置
CN114220758B (zh) * 2021-11-29 2025-05-23 北京北方华创微电子装备有限公司 晶圆承载装置及工艺腔室
KR102757922B1 (ko) 2022-07-29 2025-01-21 세메스 주식회사 기판 지지 장치 및 이를 포함하는 기판 처리 장치
US20240249965A1 (en) * 2023-01-19 2024-07-25 Applied Materials, Inc. Substrate support carrier having multiple ceramic discs
TWI844352B (zh) * 2023-05-03 2024-06-01 劉華煒 半導體製程真空腔之靜電吸盤快速排氣結構
US20250118586A1 (en) * 2023-10-06 2025-04-10 Applied Materials, Inc. Electrostatically secured substrate support assembly

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11548444B2 (en) 2010-12-22 2023-01-10 Magna Electronics Inc. Vehicular multi-camera surround view system with video display

Also Published As

Publication number Publication date
TW201729337A (zh) 2017-08-16
TWI613752B (zh) 2018-02-01
KR20160041982A (ko) 2016-04-18
US9773692B2 (en) 2017-09-26
TWI629747B (zh) 2018-07-11
CN105359265A (zh) 2016-02-24
KR20170124620A (ko) 2017-11-10
TW201513262A (zh) 2015-04-01
JP2016531438A (ja) 2016-10-06
US9508584B2 (en) 2016-11-29
CN105359265B (zh) 2018-12-14
US20170062260A1 (en) 2017-03-02
WO2015020791A1 (en) 2015-02-12
US20150036259A1 (en) 2015-02-05
KR101876501B1 (ko) 2018-07-10

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