KR101866299B1 - 고온 안정성 열 전도성 재료 - Google Patents

고온 안정성 열 전도성 재료 Download PDF

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KR101866299B1
KR101866299B1 KR1020137019092A KR20137019092A KR101866299B1 KR 101866299 B1 KR101866299 B1 KR 101866299B1 KR 1020137019092 A KR1020137019092 A KR 1020137019092A KR 20137019092 A KR20137019092 A KR 20137019092A KR 101866299 B1 KR101866299 B1 KR 101866299B1
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thermally conductive
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KR20140007823A (ko
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도랩 에듈 브하그와가르
켈리 메씽
엘리자베스 우드
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다우 실리콘즈 코포레이션
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C08K5/3417—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • F28F21/067—Details
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F23/00—Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/14—Carbides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020137019092A 2011-01-26 2012-01-10 고온 안정성 열 전도성 재료 Active KR101866299B1 (ko)

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Application Number Priority Date Filing Date Title
US201161436214P 2011-01-26 2011-01-26
US61/436,214 2011-01-26
PCT/US2012/020699 WO2012102852A1 (en) 2011-01-26 2012-01-10 High temperature stable thermally conductive materials

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KR20140007823A KR20140007823A (ko) 2014-01-20
KR101866299B1 true KR101866299B1 (ko) 2018-06-12

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US (2) US9598575B2 (enExample)
EP (1) EP2668239B1 (enExample)
JP (1) JP6048416B2 (enExample)
KR (1) KR101866299B1 (enExample)
CN (2) CN103298887A (enExample)
TW (1) TWI620797B (enExample)
WO (1) WO2012102852A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102980313B1 (ko) * 2019-04-23 2026-06-19 허니웰 인터내셔날 인코포레이티드 낮은 경화-전 점도 및 경화-후 탄성 특성을 갖는 겔-유형 열 계면 재료

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103946314A (zh) * 2011-10-06 2014-07-23 道康宁公司 具有改善的热稳定性的凝胶
TWI575025B (zh) * 2011-10-06 2017-03-21 道康寧公司 形成具有改良的熱穩定性之凝膠的方法
US9070660B2 (en) * 2013-03-15 2015-06-30 Intel Corporation Polymer thermal interface material having enhanced thermal conductivity
EP2970666B1 (en) 2013-03-15 2016-10-19 Dow Corning Corporation Aryl group-containing siloxane compositions including alkaline earth metal
JP6205824B2 (ja) * 2013-04-26 2017-10-04 富士電機株式会社 パワーモジュール
EP3046981B1 (en) * 2013-09-18 2020-04-01 Dow Silicones Corporation Compositions of resin-linear organosiloxane block copolymers
EP3077578A4 (en) 2013-12-05 2017-07-26 Honeywell International Inc. Stannous methansulfonate solution with adjusted ph
CN106661331B (zh) * 2014-03-06 2020-10-23 汉高股份有限及两合公司 单晶氧化铝填充的管芯粘结膏
PL3166999T3 (pl) 2014-07-07 2023-07-03 Honeywell International Inc. Materiał termoprzewodzący ze zmiataczem jonów
JP6395153B2 (ja) * 2014-11-04 2018-09-26 日本タングステン株式会社 コーティング膜、その製造方法およびコーティング膜形成方法
MY183994A (en) 2014-12-05 2021-03-17 Honeywell Int Inc High performance thermal interface materials with low thermal impedance
CN104497574A (zh) * 2014-12-10 2015-04-08 深圳市博恩实业有限公司 多功能有机硅热界面材料
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
US10962209B2 (en) 2015-12-15 2021-03-30 Wangs Alliance Corporation LED lighting methods and apparatus
US10941924B2 (en) 2015-12-15 2021-03-09 Wangs Alliance Corporation LED lighting methods and apparatus
US11686459B2 (en) 2015-12-15 2023-06-27 Wangs Alliance Corporation LED lighting methods and apparatus
CN109072051B (zh) 2016-03-08 2023-12-26 霍尼韦尔国际公司 相变材料
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US11213409B2 (en) 2016-08-11 2022-01-04 Willowwood Global Llc Conductive human interfaces
US11464438B2 (en) 2016-08-11 2022-10-11 Willowwood Global Llc Conductive human interfaces
SG10201607550RA (en) * 2016-09-09 2018-04-27 3M Innovative Properties Co Thermal Interface Material
US11357974B2 (en) 2016-10-06 2022-06-14 Willowwood Global Llc Electrically conductive gel and conductive human interfaces and electrodes formed using electrically conductive gel
JP6702233B2 (ja) * 2017-03-09 2020-05-27 信越化学工業株式会社 付加硬化型オルガノポリシロキサン樹脂組成物、該組成物の硬化物及び該硬化物を有する半導体装置
JP6941810B2 (ja) * 2017-04-19 2021-09-29 パナソニックＩｐマネジメント株式会社 樹脂組成物ならびにそれを用いた電子部品および電子機器
US11812525B2 (en) 2017-06-27 2023-11-07 Wangs Alliance Corporation Methods and apparatus for controlling the current supplied to light emitting diodes
CN110770319B (zh) * 2017-06-27 2021-12-07 积水保力马科技株式会社 导热性片
WO2019021824A1 (ja) 2017-07-24 2019-01-31 東レ・ダウコーニング株式会社 熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
KR102625363B1 (ko) 2017-07-24 2024-01-17 다우 도레이 캄파니 리미티드 다성분 경화형 열전도성 실리콘 겔 조성물, 열전도성 부재 및 방열 구조체
KR20200033274A (ko) 2017-07-24 2020-03-27 다우 도레이 캄파니 리미티드 열전도성 실리콘 겔 조성물 열전도성 부재 및 방열 구조체
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
WO2019054371A1 (ja) 2017-09-15 2019-03-21 東レ・ダウコーニング株式会社 電子部品またはその前駆体、それらの製造方法
WO2019054370A1 (ja) 2017-09-15 2019-03-21 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物およびパターン形成方法
US10344194B2 (en) * 2017-09-27 2019-07-09 Momentive Performance Materials Inc. Thermal interface composition comprising ionically modified siloxane
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
JP6646643B2 (ja) * 2017-12-14 2020-02-14 株式会社ノリタケカンパニーリミテド 感光性組成物とその利用
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
EP3527615A1 (en) * 2018-02-16 2019-08-21 Venator Germany GmbH Thermoconductive filler particles and polymer compositions containing them
CN112334542B (zh) * 2018-06-27 2023-02-21 美国陶氏有机硅公司 热间隙填料及其在电池管理系统中的应用
JP6956697B2 (ja) * 2018-09-18 2021-11-02 住友理工株式会社 シリコーンゴム組成物およびシリコーンゴム架橋体
CN109261207B (zh) * 2018-09-26 2021-05-28 合肥国轩高科动力能源有限公司 光催化材料及其制法和在废旧锂电池电解液处理中的应用
US12122915B2 (en) 2018-10-18 2024-10-22 Dow Toray Co., Ltd. Curable organopolysiloxane composition having excellent cold resistance, and a pattern forming method
JP7033047B2 (ja) * 2018-10-26 2022-03-09 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
WO2020102790A2 (en) * 2018-11-16 2020-05-22 Henkel IP & Holding GmbH Dual curable silicone-organic hybrid polymer compositions for liquid optically clear adhesive applications
JP7311609B2 (ja) * 2018-12-29 2023-07-19 ダウ グローバル テクノロジーズ エルエルシー Ｍｇｏフィラーを含有する熱伝導性組成物および当該組成物が使用される方法およびデバイス
CN110172250A (zh) * 2019-05-22 2019-08-27 平湖阿莱德实业有限公司 一种新能源汽车用超低密度高导热填隙界面材料及其制备方法
WO2020261647A1 (ja) * 2019-06-24 2020-12-30 富士高分子工業株式会社 耐熱性熱伝導性組成物及び耐熱性熱伝導性シート
JP7136065B2 (ja) * 2019-11-14 2022-09-13 信越化学工業株式会社 熱伝導性シリコーン組成物及び熱伝導性シリコーンシート
KR20220100592A (ko) * 2019-11-19 2022-07-15 헨켈 아게 운트 코. 카게아아 열 계면 재료 및 적용 방법
US11598517B2 (en) 2019-12-31 2023-03-07 Lumien Enterprise, Inc. Electronic module group
CN110985903B (zh) 2019-12-31 2020-08-14 江苏舒适照明有限公司 一种灯模组
US12281783B2 (en) 2019-12-31 2025-04-22 Lumien Enterprise, Inc. Electronic module group
CN113661215B (zh) * 2020-02-13 2024-07-23 富士高分子工业株式会社 耐热性有机硅树脂组合物及耐热性有机硅树脂复合材料
WO2021178119A1 (en) * 2020-03-05 2021-09-10 Dow Global Technologies Llc Shear thinning thermally conductive silicone compositions
EP4118162A4 (en) * 2020-03-13 2023-11-29 DDP Specialty Electronic Materials US, LLC Thermal interface material comprising magnesium hydroxide
US12503599B2 (en) 2020-03-16 2025-12-23 Dow Silicones Corporation Thermal conductive silicone composition
CN111503556B (zh) 2020-04-23 2020-11-27 江苏舒适照明有限公司 一种射灯结构
US12187951B2 (en) 2020-07-27 2025-01-07 Google Llc Thermal interface material and method for making the same
US12195666B2 (en) * 2020-07-27 2025-01-14 Google Llc Thermal interface material and method for making the same
EP4217422B1 (en) * 2020-09-23 2025-10-29 Dow Global Technologies LLC Thermal interface material with low dispensing viscosity, low vertical flow after dispensing, and low thermal impedance after cure
CN114539781A (zh) * 2020-11-25 2022-05-27 深圳先进电子材料国际创新研究院 一种导热凝胶及其制备方法
CN117203284A (zh) * 2021-04-09 2023-12-08 陶氏东丽株式会社 固化性聚有机硅氧烷组合物、导热性构件以及散热结构体
US12230950B2 (en) 2021-07-29 2025-02-18 Lumien Enterprise, Inc. Junction box
WO2023087233A1 (en) * 2021-11-19 2023-05-25 Dow Silicones Corporation Silicone rubber composition
EP4491673A4 (en) 2022-03-08 2026-03-18 Shinetsu Chemical Co TWO-COMPONENT ADDITION-CURDED THERMOCONDUCTIVE SILICONE COMPOSITION, AND A HARDENED SILICONE OBJECT THEREIN
CN118829691A (zh) 2022-03-08 2024-10-22 信越化学工业株式会社 导热性加成固化型有机硅组合物及其有机硅固化物
CN115214202A (zh) * 2022-04-26 2022-10-21 北京科技大学 一种高导热层状热界面材料及其制备方法
US11802682B1 (en) 2022-08-29 2023-10-31 Wangs Alliance Corporation Modular articulating lighting
JP2026510167A (ja) 2022-10-19 2026-04-02 ダウ シリコーンズ コーポレーション 液体シリコーンゴム組成物
KR20250086760A (ko) 2022-10-19 2025-06-13 다우 실리콘즈 코포레이션 액체 실리콘 고무 조성물
WO2024086138A1 (en) 2022-10-19 2024-04-25 Dow Silicones Corporation Liquid silicone rubber composition
KR20260049322A (ko) * 2023-08-23 2026-04-13 다우 실리콘즈 코포레이션 고온 안정성 열전도성 재료
WO2025142027A1 (ja) 2023-12-26 2025-07-03 ダウ・東レ株式会社 分子鎖両末端にアルケニル基を有するオルガノポリシロキサン、それを含む熱伝導性オルガノポリシロキサン組成物、熱伝導性部材および放熱構造体、その他の組成物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2796744B2 (ja) * 1989-10-31 1998-09-10 東レ・ダウコーニング・シリコーン株式会社 硬化性オルガノポリシロキサンゴム組成物

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB731166A (en) * 1952-05-27 1955-06-01 Midland Silicones Ltd Improvements in or relating to organosiloxane elastomers
GB893399A (en) 1959-09-24 1962-04-11 Dow Corning Improvements in or relating to organosiloxane compositions
NL129346C (enExample) 1966-06-23
US3364161A (en) 1967-01-19 1968-01-16 Navy Usa Silicone rubber composition containing corrosion inhibiting curing agent
US3989667A (en) 1974-12-02 1976-11-02 Dow Corning Corporation Olefinic siloxanes as platinum inhibitors
GB1470465A (en) 1975-01-20 1977-04-14 Int Paint Co Coated marine surfaces
US4087585A (en) 1977-05-23 1978-05-02 Dow Corning Corporation Self-adhering silicone compositions and preparations thereof
US4370358A (en) 1980-09-22 1983-01-25 General Electric Company Ultraviolet curable silicone adhesives
JPS61195129A (ja) 1985-02-22 1986-08-29 Toray Silicone Co Ltd 有機けい素重合体の製造方法
US4584361A (en) 1985-06-03 1986-04-22 Dow Corning Corporation Storage stable, one part polyorganosiloxane compositions
JPS62223788A (ja) 1986-03-26 1987-10-01 株式会社日立製作所 デイスプレイ装置
JP2670804B2 (ja) 1988-05-06 1997-10-29 コスモ石油株式会社 塗膜塗料組成物
US5036117A (en) 1989-11-03 1991-07-30 Dow Corning Corporation Heat-curable silicone compositions having improved bath life
JP3029680B2 (ja) 1991-01-29 2000-04-04 東レ・ダウコーニング・シリコーン株式会社 オルガノペンタシロキサンおよびその製造方法
JP2511348B2 (ja) 1991-10-17 1996-06-26 東レ・ダウコーニング・シリコーン株式会社 オルガノポリシロキサンおよびその製造方法
JP3046484B2 (ja) * 1993-12-28 2000-05-29 ジーイー東芝シリコーン株式会社 安定した電気特性を有するシリコーンゴム組成物
KR20000064867A (ko) 1997-02-07 2000-11-06 아이. 데이비드 크로산 전도성，수지-기재 조성물
JPH1145965A (ja) * 1997-07-28 1999-02-16 Kyocera Corp 伝熱性化合物およびこれを用いた半導体装置
JP3444199B2 (ja) 1998-06-17 2003-09-08 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及びその製造方法
JP2002521749A (ja) 1998-07-24 2002-07-16 サン・マイクロシステムズ・インコーポレーテッド コンピュータ・システムにおける決定論的メモリ割り当て応答の達成方法および装置
JP4727017B2 (ja) * 1999-11-15 2011-07-20 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
US20030207128A1 (en) * 2000-04-10 2003-11-06 Tomoaki Uchiya Thermally conductive sheet
US20040092655A1 (en) * 2001-04-02 2004-05-13 Takayoshi Otomo Mouldable silicone gel compositions
JP3580366B2 (ja) * 2001-05-01 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
US20040195678A1 (en) * 2001-07-02 2004-10-07 Yoshinao Yamazaki Thermoconductive composition
JP4551074B2 (ja) 2003-10-07 2010-09-22 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP4413649B2 (ja) * 2004-03-03 2010-02-10 日産自動車株式会社 放熱構造体及びその製造方法
US20050228097A1 (en) * 2004-03-30 2005-10-13 General Electric Company Thermally conductive compositions and methods of making thereof
US7655719B2 (en) * 2004-07-13 2010-02-02 Cool Options, Inc. Thermally conductive polymer compositions having moderate tensile and flexural properties
JP4828146B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4828145B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
US20070219312A1 (en) * 2006-03-17 2007-09-20 Jennifer Lynn David Silicone adhesive composition and method for preparing the same
TWI380325B (en) * 2006-09-26 2012-12-21 Polytronics Technology Corp Heat-conductive dielectric polymer composition and heat dissipation substrate containing the same
DE102006048575A1 (de) * 2006-10-13 2008-04-17 Evonik Degussa Gmbh Oberflächenmodifizierte Kieselsäuren
JP4970987B2 (ja) * 2007-03-08 2012-07-11 株式会社メニコン 眼用レンズ材料用シリコーンインク組成物
WO2009032212A1 (en) * 2007-08-31 2009-03-12 Cabot Corporation Thermal interface materials
JP4572243B2 (ja) 2008-03-27 2010-11-04 信越化学工業株式会社 熱伝導性積層体およびその製造方法
JP5329114B2 (ja) 2008-03-31 2013-10-30 株式会社ジーシー 歯科用シリコーン系適合試験材組成物
WO2010104534A1 (en) * 2009-03-12 2010-09-16 Dow Corning Corporation Thermal interface materials and mehtods for their preparation and use
JP5538872B2 (ja) 2009-12-24 2014-07-02 東レ・ダウコーニング株式会社 シリコーンエラストマー組成物
JP5783128B2 (ja) 2012-04-24 2015-09-24 信越化学工業株式会社 加熱硬化型熱伝導性シリコーングリース組成物
JP5947267B2 (ja) 2013-09-20 2016-07-06 信越化学工業株式会社 シリコーン組成物及び熱伝導性シリコーン組成物の製造方法
EP3150672B1 (en) 2015-10-02 2018-05-09 Shin-Etsu Chemical Co., Ltd. Thermal conductive silicone composition and semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2796744B2 (ja) * 1989-10-31 1998-09-10 東レ・ダウコーニング・シリコーン株式会社 硬化性オルガノポリシロキサンゴム組成物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
일본 특허공보 특허 제 2796744호(1998.09.10.) 1부. *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102980313B1 (ko) * 2019-04-23 2026-06-19 허니웰 인터내셔날 인코포레이티드 낮은 경화-전 점도 및 경화-후 탄성 특성을 갖는 겔-유형 열 계면 재료

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