KR101866299B1 - 고온 안정성 열 전도성 재료 - Google Patents

고온 안정성 열 전도성 재료 Download PDF

Info

Publication number
KR101866299B1
KR101866299B1 KR1020137019092A KR20137019092A KR101866299B1 KR 101866299 B1 KR101866299 B1 KR 101866299B1 KR 1020137019092 A KR1020137019092 A KR 1020137019092A KR 20137019092 A KR20137019092 A KR 20137019092A KR 101866299 B1 KR101866299 B1 KR 101866299B1
Authority
KR
South Korea
Prior art keywords
component
composition
thermally conductive
group
groups
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020137019092A
Other languages
English (en)
Korean (ko)
Other versions
KR20140007823A (ko
Inventor
도랩 에듈 브하그와가르
켈리 메씽
엘리자베스 우드
Original Assignee
다우 실리콘즈 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=45563525&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR101866299(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 다우 실리콘즈 코포레이션 filed Critical 다우 실리콘즈 코포레이션
Publication of KR20140007823A publication Critical patent/KR20140007823A/ko
Application granted granted Critical
Publication of KR101866299B1 publication Critical patent/KR101866299B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C08K5/3417—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • F28F21/067—Details
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F23/00—Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/14—Carbides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020137019092A 2011-01-26 2012-01-10 고온 안정성 열 전도성 재료 Active KR101866299B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161436214P 2011-01-26 2011-01-26
US61/436,214 2011-01-26
PCT/US2012/020699 WO2012102852A1 (en) 2011-01-26 2012-01-10 High temperature stable thermally conductive materials

Publications (2)

Publication Number Publication Date
KR20140007823A KR20140007823A (ko) 2014-01-20
KR101866299B1 true KR101866299B1 (ko) 2018-06-12

Family

ID=45563525

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137019092A Active KR101866299B1 (ko) 2011-01-26 2012-01-10 고온 안정성 열 전도성 재료

Country Status (7)

Country Link
US (2) US9598575B2 (enExample)
EP (1) EP2668239B1 (enExample)
JP (1) JP6048416B2 (enExample)
KR (1) KR101866299B1 (enExample)
CN (2) CN103298887A (enExample)
TW (1) TWI620797B (enExample)
WO (1) WO2012102852A1 (enExample)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101901122B1 (ko) * 2011-10-06 2018-09-28 한국다우케미칼실리콘(주) 향상된 열안정성을 갖는 겔의 형성 방법
US20150130086A1 (en) * 2011-10-06 2015-05-14 Dow Coming Corporation Gel Having Improved Thermal Stability
US9070660B2 (en) * 2013-03-15 2015-06-30 Intel Corporation Polymer thermal interface material having enhanced thermal conductivity
WO2014149670A2 (en) 2013-03-15 2014-09-25 Dow Corning Corporation Aryl group-containing siloxane compositions including alkaline earth metal
JP6205824B2 (ja) * 2013-04-26 2017-10-04 富士電機株式会社 パワーモジュール
WO2015042285A1 (en) * 2013-09-18 2015-03-26 Dow Corning Corporation Compositions of resin-linear organosiloxane block copolymers
JP2017504715A (ja) 2013-12-05 2017-02-09 ハネウェル・インターナショナル・インコーポレーテッド 調節されたｐＨを有するメタンスルホン酸第一スズ溶液
JP6411537B2 (ja) * 2014-03-06 2018-10-24 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 単結晶アルミナ充填ダイアタッチペースト
JP6401310B2 (ja) 2014-07-07 2018-10-10 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． イオンスカベンジャーを有する熱界面材料
JP6395153B2 (ja) * 2014-11-04 2018-09-26 日本タングステン株式会社 コーティング膜、その製造方法およびコーティング膜形成方法
MY183994A (en) 2014-12-05 2021-03-17 Honeywell Int Inc High performance thermal interface materials with low thermal impedance
CN104497574A (zh) * 2014-12-10 2015-04-08 深圳市博恩实业有限公司 多功能有机硅热界面材料
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
US11686459B2 (en) 2015-12-15 2023-06-27 Wangs Alliance Corporation LED lighting methods and apparatus
US10962209B2 (en) 2015-12-15 2021-03-30 Wangs Alliance Corporation LED lighting methods and apparatus
US10941924B2 (en) 2015-12-15 2021-03-09 Wangs Alliance Corporation LED lighting methods and apparatus
WO2017152353A1 (en) 2016-03-08 2017-09-14 Honeywell International Inc. Phase change material
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US11464438B2 (en) 2016-08-11 2022-10-11 Willowwood Global Llc Conductive human interfaces
US11213409B2 (en) 2016-08-11 2022-01-04 Willowwood Global Llc Conductive human interfaces
SG10201607550RA (en) * 2016-09-09 2018-04-27 3M Innovative Properties Co Thermal Interface Material
EP3522779B1 (en) * 2016-10-06 2022-10-26 WillowWood Global LLC Conductive human interfaces comprising electrodes formed using electrically conductive gel
JP6702233B2 (ja) * 2017-03-09 2020-05-27 信越化学工業株式会社 付加硬化型オルガノポリシロキサン樹脂組成物、該組成物の硬化物及び該硬化物を有する半導体装置
JP6941810B2 (ja) * 2017-04-19 2021-09-29 パナソニックＩｐマネジメント株式会社 樹脂組成物ならびにそれを用いた電子部品および電子機器
JP6613462B2 (ja) * 2017-06-27 2019-12-04 積水ポリマテック株式会社 熱伝導性シート
US11812525B2 (en) 2017-06-27 2023-11-07 Wangs Alliance Corporation Methods and apparatus for controlling the current supplied to light emitting diodes
US11674040B2 (en) * 2017-07-24 2023-06-13 Dow Toray Co., Ltd. Thermally-conductive silicone gel composition, thermally-conductive member, and heat dissipation structure
EP3660100B1 (en) 2017-07-24 2024-10-30 Dow Toray Co., Ltd. Multicomponent-curable thermally-conductive silicone gel composition, thermally-conductive member and heat dissipation structure
EP3660101B1 (en) 2017-07-24 2024-10-02 Dow Toray Co., Ltd. Thermally-conductive silicone gel composition, thermally-conductive member, and heat dissipation structure
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
CN112770848A (zh) 2017-09-15 2021-05-07 道康宁东丽株式会社 电子零件或其前驱体、它们的制造方法
CN111051435A (zh) * 2017-09-15 2020-04-21 陶氏东丽株式会社 硬化性有机聚硅氧烷组合物及图案形成方法
US10344194B2 (en) * 2017-09-27 2019-07-09 Momentive Performance Materials Inc. Thermal interface composition comprising ionically modified siloxane
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
JP6646643B2 (ja) * 2017-12-14 2020-02-14 株式会社ノリタケカンパニーリミテド 感光性組成物とその利用
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
EP3527615A1 (en) * 2018-02-16 2019-08-21 Venator Germany GmbH Thermoconductive filler particles and polymer compositions containing them
KR102578330B1 (ko) * 2018-06-27 2023-09-18 다우 실리콘즈 코포레이션 열 갭 충전제 및 배터리 관리 시스템을 위한 이의 응용
JP6956697B2 (ja) * 2018-09-18 2021-11-02 住友理工株式会社 シリコーンゴム組成物およびシリコーンゴム架橋体
CN109261207B (zh) * 2018-09-26 2021-05-28 合肥国轩高科动力能源有限公司 光催化材料及其制法和在废旧锂电池电解液处理中的应用
WO2020080326A1 (ja) * 2018-10-18 2020-04-23 ダウ・東レ株式会社 耐寒性に優れる硬化性オルガノポリシロキサン組成物、パターン形成方法および電子部品等
JP7033047B2 (ja) * 2018-10-26 2022-03-09 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
EP3902873A4 (en) * 2018-12-29 2022-11-09 Dow Global Technologies LLC THERMALLY CONDUCTIVE COMPOSITION WITH MGO FILLER AND METHODS AND DEVICES USING SUCH COMPOSITION
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
CN110172250A (zh) * 2019-05-22 2019-08-27 平湖阿莱德实业有限公司 一种新能源汽车用超低密度高导热填隙界面材料及其制备方法
WO2020261647A1 (ja) * 2019-06-24 2020-12-30 富士高分子工業株式会社 耐熱性熱伝導性組成物及び耐熱性熱伝導性シート
JP2023501754A (ja) * 2019-11-19 2023-01-18 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン サーマルインターフェース材料及び適用方法
US11598517B2 (en) 2019-12-31 2023-03-07 Lumien Enterprise, Inc. Electronic module group
CN110985903B (zh) 2019-12-31 2020-08-14 江苏舒适照明有限公司 一种灯模组
US12281783B2 (en) 2019-12-31 2025-04-22 Lumien Enterprise, Inc. Electronic module group
EP3929240A4 (en) * 2020-02-13 2022-04-27 Fuji Polymer Industries Co., Ltd. HEAT RESISTANT SILICONE RESIN COMPOSITION AND HEAT RESISTANT SILICONE RESIN COMPOSITE
KR102560192B1 (ko) * 2020-03-05 2023-07-28 다우 실리콘즈 코포레이션 전단 담화 열전도성 실리콘 조성물
WO2021179276A1 (en) * 2020-03-13 2021-09-16 Ddp Specialty Electronic Materials Us, Llc Thermal interface material comprising magnesium hydroxide
WO2021184149A1 (en) * 2020-03-16 2021-09-23 Dow Silicones Corporation Thermal conductive silicone composition
CN111503556B (zh) 2020-04-23 2020-11-27 江苏舒适照明有限公司 一种射灯结构
US12187951B2 (en) 2020-07-27 2025-01-07 Google Llc Thermal interface material and method for making the same
US12195666B2 (en) 2020-07-27 2025-01-14 Google Llc Thermal interface material and method for making the same
JP7731420B2 (ja) * 2020-09-23 2025-08-29 ダウ グローバル テクノロジーズ エルエルシー 分配粘度が低く、分配後の鉛直流が少なく、硬化後の熱インピーダンスが低い熱界面材料
CN114539781A (zh) * 2020-11-25 2022-05-27 深圳先进电子材料国际创新研究院 一种导热凝胶及其制备方法
CN117203284A (zh) * 2021-04-09 2023-12-08 陶氏东丽株式会社 固化性聚有机硅氧烷组合物、导热性构件以及散热结构体
US12230950B2 (en) 2021-07-29 2025-02-18 Lumien Enterprise, Inc. Junction box
CN118382675A (zh) * 2021-11-19 2024-07-23 美国陶氏有机硅公司 有机硅橡胶组合物
WO2023171353A1 (ja) 2022-03-08 2023-09-14 信越化学工業株式会社 ２液型熱伝導性付加硬化型シリコーン組成物及びそのシリコーン硬化物
KR20240157074A (ko) 2022-03-08 2024-10-31 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 부가 경화형 실리콘 조성물 및 그 실리콘 경화물
CN115214202A (zh) * 2022-04-26 2022-10-21 北京科技大学 一种高导热层状热界面材料及其制备方法
US11802682B1 (en) 2022-08-29 2023-10-31 Wangs Alliance Corporation Modular articulating lighting
EP4590758A1 (en) 2022-10-19 2025-07-30 Dow Silicones Corporation Liquid silicone rubber composition
KR20250086759A (ko) 2022-10-19 2025-06-13 다우 실리콘즈 코포레이션 액체 실리콘 고무 조성물
KR20250089523A (ko) 2022-10-19 2025-06-18 다우 실리콘즈 코포레이션 액체 실리콘 고무 조성물
WO2025039204A1 (en) * 2023-08-23 2025-02-27 Dow Silicones Corporation High temperature stable thermally conductive materials

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2796744B2 (ja) * 1989-10-31 1998-09-10 東レ・ダウコーニング・シリコーン株式会社 硬化性オルガノポリシロキサンゴム組成物

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB731166A (en) * 1952-05-27 1955-06-01 Midland Silicones Ltd Improvements in or relating to organosiloxane elastomers
GB893399A (en) 1959-09-24 1962-04-11 Dow Corning Improvements in or relating to organosiloxane compositions
NL129346C (enExample) 1966-06-23
US3364161A (en) 1967-01-19 1968-01-16 Navy Usa Silicone rubber composition containing corrosion inhibiting curing agent
US3989667A (en) 1974-12-02 1976-11-02 Dow Corning Corporation Olefinic siloxanes as platinum inhibitors
GB1470465A (en) 1975-01-20 1977-04-14 Int Paint Co Coated marine surfaces
US4087585A (en) 1977-05-23 1978-05-02 Dow Corning Corporation Self-adhering silicone compositions and preparations thereof
US4370358A (en) 1980-09-22 1983-01-25 General Electric Company Ultraviolet curable silicone adhesives
JPS61195129A (ja) 1985-02-22 1986-08-29 Toray Silicone Co Ltd 有機けい素重合体の製造方法
US4584361A (en) 1985-06-03 1986-04-22 Dow Corning Corporation Storage stable, one part polyorganosiloxane compositions
JPS62223788A (ja) 1986-03-26 1987-10-01 株式会社日立製作所 デイスプレイ装置
JP2670804B2 (ja) 1988-05-06 1997-10-29 コスモ石油株式会社 塗膜塗料組成物
US5036117A (en) 1989-11-03 1991-07-30 Dow Corning Corporation Heat-curable silicone compositions having improved bath life
JP3029680B2 (ja) 1991-01-29 2000-04-04 東レ・ダウコーニング・シリコーン株式会社 オルガノペンタシロキサンおよびその製造方法
JP2511348B2 (ja) 1991-10-17 1996-06-26 東レ・ダウコーニング・シリコーン株式会社 オルガノポリシロキサンおよびその製造方法
JP3046484B2 (ja) * 1993-12-28 2000-05-29 ジーイー東芝シリコーン株式会社 安定した電気特性を有するシリコーンゴム組成物
JP2001503471A (ja) 1997-02-07 2001-03-13 ロックタイト コーポレーション 伝導性樹脂組成物
JPH1145965A (ja) * 1997-07-28 1999-02-16 Kyocera Corp 伝熱性化合物およびこれを用いた半導体装置
JP3444199B2 (ja) 1998-06-17 2003-09-08 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及びその製造方法
DE69930855T2 (de) 1998-07-24 2006-11-23 Sun Microsystems, Inc., Santa Clara Verfahren und vorrichtung zur durchführung einer deterministischen speicherzuordnungsantwort in einem computer-system
JP4727017B2 (ja) * 1999-11-15 2011-07-20 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
US20030207128A1 (en) * 2000-04-10 2003-11-06 Tomoaki Uchiya Thermally conductive sheet
US20040092655A1 (en) * 2001-04-02 2004-05-13 Takayoshi Otomo Mouldable silicone gel compositions
JP3580366B2 (ja) * 2001-05-01 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
US20040195678A1 (en) * 2001-07-02 2004-10-07 Yoshinao Yamazaki Thermoconductive composition
JP4551074B2 (ja) 2003-10-07 2010-09-22 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP4413649B2 (ja) * 2004-03-03 2010-02-10 日産自動車株式会社 放熱構造体及びその製造方法
US20050228097A1 (en) * 2004-03-30 2005-10-13 General Electric Company Thermally conductive compositions and methods of making thereof
US7655719B2 (en) * 2004-07-13 2010-02-02 Cool Options, Inc. Thermally conductive polymer compositions having moderate tensile and flexural properties
JP4828145B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4828146B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
US20070219312A1 (en) * 2006-03-17 2007-09-20 Jennifer Lynn David Silicone adhesive composition and method for preparing the same
TWI380325B (en) * 2006-09-26 2012-12-21 Polytronics Technology Corp Heat-conductive dielectric polymer composition and heat dissipation substrate containing the same
DE102006048575A1 (de) * 2006-10-13 2008-04-17 Evonik Degussa Gmbh Oberflächenmodifizierte Kieselsäuren
JP4970987B2 (ja) * 2007-03-08 2012-07-11 株式会社メニコン 眼用レンズ材料用シリコーンインク組成物
CN101835830B (zh) * 2007-08-31 2013-02-20 卡伯特公司 热界面材料
JP4572243B2 (ja) 2008-03-27 2010-11-04 信越化学工業株式会社 熱伝導性積層体およびその製造方法
JP5329114B2 (ja) 2008-03-31 2013-10-30 株式会社ジーシー 歯科用シリコーン系適合試験材組成物
US8440312B2 (en) * 2009-03-12 2013-05-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
JP5538872B2 (ja) 2009-12-24 2014-07-02 東レ・ダウコーニング株式会社 シリコーンエラストマー組成物
JP5783128B2 (ja) 2012-04-24 2015-09-24 信越化学工業株式会社 加熱硬化型熱伝導性シリコーングリース組成物
JP5947267B2 (ja) 2013-09-20 2016-07-06 信越化学工業株式会社 シリコーン組成物及び熱伝導性シリコーン組成物の製造方法
EP3150672B1 (en) 2015-10-02 2018-05-09 Shin-Etsu Chemical Co., Ltd. Thermal conductive silicone composition and semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2796744B2 (ja) * 1989-10-31 1998-09-10 東レ・ダウコーニング・シリコーン株式会社 硬化性オルガノポリシロキサンゴム組成物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
일본 특허공보 특허 제 2796744호(1998.09.10.) 1부. *

Also Published As

Publication number Publication date
US20130248163A1 (en) 2013-09-26
KR20140007823A (ko) 2014-01-20
JP6048416B2 (ja) 2016-12-21
TW201245338A (en) 2012-11-16
WO2012102852A1 (en) 2012-08-02
TWI620797B (zh) 2018-04-11
CN109401333A (zh) 2019-03-01
US9598575B2 (en) 2017-03-21
US10000680B2 (en) 2018-06-19
CN103298887A (zh) 2013-09-11
EP2668239B1 (en) 2018-08-15
JP2014503680A (ja) 2014-02-13
US20170158937A1 (en) 2017-06-08
EP2668239A1 (en) 2013-12-04

Similar Documents

Publication Publication Date Title
KR101866299B1 (ko) 고온 안정성 열 전도성 재료
US11674040B2 (en) Thermally-conductive silicone gel composition, thermally-conductive member, and heat dissipation structure
CN102341459B (zh) 热界面材料和它们的制备与使用方法
TWI851537B (zh) 導熱性聚矽氧凝膠組合物、導熱性構件及散熱結構體
US11549043B2 (en) Multicomponent-curable thermally-conductive silicone gel composition, thermally-conductive member and heat dissipation structure
CN112805334B (zh) 导热组合物以及使用所述组合物的方法和装置
CN111094499B (zh) 导热组合物
WO2020203299A1 (ja) 多成分型熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
CN104822790A (zh) 制造电子器件的方法
CN102159647A (zh) 液体小片粘合剂
US12454615B2 (en) Curable organopolysiloxane composition, thermally conductive member and heat dissipation structure
JP3741855B2 (ja) 半導体素子パッケージの製造方法及びこれに使用するオルガノポリシロキサン組成物
WO2023136188A1 (ja) スポットポッティング用チキソ性シリコーンゲル組成物及びその硬化物並びにフォトカプラ

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20130719

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
AMND Amendment
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20170106

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20170821

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20180227

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20170821

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

AMND Amendment
PX0901 Re-examination

Patent event code: PX09011S01I

Patent event date: 20180227

Comment text: Decision to Refuse Application

Patent event code: PX09012R01I

Patent event date: 20171020

Comment text: Amendment to Specification, etc.

Patent event code: PX09012R01I

Patent event date: 20170106

Comment text: Amendment to Specification, etc.

PX0701 Decision of registration after re-examination

Patent event date: 20180423

Comment text: Decision to Grant Registration

Patent event code: PX07013S01D

Patent event date: 20180330

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

Patent event date: 20180227

Comment text: Decision to Refuse Application

Patent event code: PX07011S01I

Patent event date: 20171020

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

Patent event date: 20170106

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

X701 Decision to grant (after re-examination)
GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20180604

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20180605

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20210517

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20220415

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20230418

Start annual number: 6

End annual number: 6