KR101811914B1 - 열경화성 에폭시수지 조성물 및 그 용도 - Google Patents
열경화성 에폭시수지 조성물 및 그 용도 Download PDFInfo
- Publication number
- KR101811914B1 KR101811914B1 KR1020140097029A KR20140097029A KR101811914B1 KR 101811914 B1 KR101811914 B1 KR 101811914B1 KR 1020140097029 A KR1020140097029 A KR 1020140097029A KR 20140097029 A KR20140097029 A KR 20140097029A KR 101811914 B1 KR101811914 B1 KR 101811914B1
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- weight
- parts
- bisphenol
- inorganic filler
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C08G59/60—Amines together with other curing agents with amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0066—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410260933.4A CN105237949B (zh) | 2014-06-12 | 2014-06-12 | 一种热固性环氧树脂组合物及其用途 |
CN201410260933.4 | 2014-06-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20150143234A KR20150143234A (ko) | 2015-12-23 |
KR101811914B1 true KR101811914B1 (ko) | 2017-12-22 |
Family
ID=55035801
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020140097029A KR101811914B1 (ko) | 2014-06-12 | 2014-07-30 | 열경화성 에폭시수지 조성물 및 그 용도 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5923590B2 (zh) |
KR (1) | KR101811914B1 (zh) |
CN (1) | CN105237949B (zh) |
TW (1) | TWI535777B (zh) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2726406C2 (ru) * | 2016-01-26 | 2020-07-14 | Торэй Индастриз, Инк. | Композиция эпоксидной смолы, препрег и композитный материал, армированный волокном |
CN106496935B (zh) * | 2016-10-17 | 2019-01-29 | 无锡宏仁电子材料科技有限公司 | 一种用于覆铜板的无卤阻燃超高cti高耐压树脂组合物 |
CN107603149B (zh) * | 2017-08-28 | 2020-08-11 | 南亚新材料科技股份有限公司 | 一种检验电子级填料鱼目的方法 |
KR102025746B1 (ko) * | 2017-11-08 | 2019-09-26 | (주)영신 | 시트상의 접착성 가스켓을 이용한 파형 이음강관의 제조방법 |
CN109337288A (zh) * | 2017-12-29 | 2019-02-15 | 东莞联茂电子科技有限公司 | 一种用于覆铜板的无铅高cti树脂组合物 |
JP7006285B2 (ja) * | 2018-01-12 | 2022-01-24 | 住友ベークライト株式会社 | 樹脂組成物、金属張積層板、アルミベース基板およびプリント配線板 |
CN112004855B (zh) * | 2018-04-20 | 2024-01-12 | 三菱瓦斯化学株式会社 | 热固化性组合物、预浸料、层叠板、覆金属箔层叠板、印刷电路板和多层印刷电路板 |
CN109705532B (zh) * | 2018-12-29 | 2021-05-11 | 广东生益科技股份有限公司 | 一种无卤无磷无氮的阻燃树脂组合物、包含其的半固化片和覆金属箔层压板 |
JP7211829B2 (ja) | 2019-01-23 | 2023-01-24 | 日鉄ケミカル&マテリアル株式会社 | エポキシ樹脂組成物及びその硬化物 |
CN109912932A (zh) * | 2019-03-14 | 2019-06-21 | 南亚新材料科技股份有限公司 | 一种高cti值的无卤素粘合剂及其制备方法和应用 |
CN112694713B (zh) * | 2019-10-23 | 2022-06-03 | 中国石油化工股份有限公司 | 一种耐老化可钻复合材料及其制备方法 |
CN110872430A (zh) * | 2019-11-29 | 2020-03-10 | 陕西生益科技有限公司 | 一种高cti的树脂组合物、预浸料、层压板和覆金属箔层压板 |
CN111393069B (zh) * | 2020-03-25 | 2021-09-21 | 深圳绿景环保再生资源有限公司 | 一种改性粉体与级配砂的环氧砂浆制备方法及环氧砂浆 |
CN111534056A (zh) * | 2020-04-15 | 2020-08-14 | 浙江华正新材料股份有限公司 | 一种树脂组合物、预浸料及其层压板 |
CN112625284B (zh) * | 2020-12-11 | 2023-01-24 | 江苏恒神股份有限公司 | 一种连续纤维增强热固型阻燃预浸料及其制备方法 |
CN113416487A (zh) * | 2021-06-18 | 2021-09-21 | 中国船舶重工集团公司第七二五研究所 | 一种船舶复合材料防护用高耐候面漆及其制备方法 |
CN113736219A (zh) * | 2021-08-23 | 2021-12-03 | 浙江华正新材料股份有限公司 | 树脂组合物、半固化片、电路基板、印制电路板 |
CN114525100A (zh) * | 2022-03-16 | 2022-05-24 | 安徽工业技术创新研究院六安院 | 一种高导热低粘度环氧灌封胶及其制备方法 |
CN116970258B (zh) * | 2023-08-09 | 2024-04-05 | 上海江天高分子材料有限公司 | 耐开裂、高导热的阻燃真空浇注树脂、制备方法和应用 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008214602A (ja) * | 2007-02-07 | 2008-09-18 | Mitsubishi Gas Chem Co Inc | プリプレグ及び積層板 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07330867A (ja) * | 1994-06-06 | 1995-12-19 | Cmk Corp | 銅箔ラミネート方式ビルドアップ用絶縁樹脂組成物とこれを用いた多層プリント配線板の製造方法 |
JPH115826A (ja) * | 1997-04-22 | 1999-01-12 | Matsushita Electric Works Ltd | ビルドアップ用エポキシ樹脂組成物 |
JP2010126620A (ja) * | 2008-11-27 | 2010-06-10 | Nippon Zeon Co Ltd | プリプレグ及びそれを用いた積層体 |
JP5149917B2 (ja) * | 2009-03-27 | 2013-02-20 | 日立化成工業株式会社 | 熱硬化性樹脂組成物、並びにこれを用いたプリプレグ、積層板及び多層プリント配線板 |
CN102051023B (zh) * | 2010-12-09 | 2012-07-04 | 广东生益科技股份有限公司 | 无卤树脂组合物及使用其制作的涂树脂铜箔与覆铜板 |
CN102276961A (zh) * | 2011-07-22 | 2011-12-14 | 苏州生益科技有限公司 | 无卤无磷环氧树脂组合物及使用其制作的半固化片及层压板 |
JP6152246B2 (ja) * | 2011-09-26 | 2017-06-21 | 日立化成株式会社 | プリント配線板用プリプレグ、積層板及びプリント配線板 |
CN102585440B (zh) * | 2012-01-16 | 2013-09-04 | 广州宏仁电子工业有限公司 | 用于覆铜箔基板的高cti值无卤阻燃型树脂组合物 |
CN102827456B (zh) * | 2012-09-07 | 2016-03-16 | 黄山金瑞泰投资发展有限公司 | 环氧树脂组合物及其制备方法 |
CN102838839B (zh) * | 2012-09-07 | 2015-06-24 | 黄山金瑞泰投资发展有限公司 | 一种环氧树脂组合物及其制备方法 |
CN102838840A (zh) * | 2012-09-07 | 2012-12-26 | 黄山金瑞泰投资发展有限公司 | 一种环氧树脂组合物溶液及其制备方法 |
-
2014
- 2014-06-12 CN CN201410260933.4A patent/CN105237949B/zh active Active
- 2014-07-17 TW TW103124562A patent/TWI535777B/zh active
- 2014-07-30 KR KR1020140097029A patent/KR101811914B1/ko active IP Right Grant
- 2014-12-04 JP JP2014245841A patent/JP5923590B2/ja active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008214602A (ja) * | 2007-02-07 | 2008-09-18 | Mitsubishi Gas Chem Co Inc | プリプレグ及び積層板 |
Also Published As
Publication number | Publication date |
---|---|
JP5923590B2 (ja) | 2016-05-24 |
TWI535777B (zh) | 2016-06-01 |
CN105237949A (zh) | 2016-01-13 |
JP2016003335A (ja) | 2016-01-12 |
KR20150143234A (ko) | 2015-12-23 |
TW201546163A (zh) | 2015-12-16 |
CN105237949B (zh) | 2017-11-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101811914B1 (ko) | 열경화성 에폭시수지 조성물 및 그 용도 | |
US9629239B2 (en) | Resin composition, and prepreg as well as laminate using the same | |
EP3053963B1 (en) | Halogen-free resin composition and uses thereof | |
WO2017020464A1 (zh) | 一种覆铜板用环氧树脂组合物及其应用 | |
WO2017020462A1 (zh) | 一种覆铜板用环氧树脂组合物及其应用 | |
WO2017020463A1 (zh) | 一种覆铜板用环氧树脂组合物及其应用 | |
CN110885428B (zh) | 一种无卤热固性树脂组合物、使用它的预浸料、层压板及印制电路板 | |
TWI666248B (zh) | 馬來醯亞胺樹脂組合物、預浸料、層壓板和印刷電路板 | |
KR102325101B1 (ko) | 말레이미드 수지 조성물, 프리프레그, 적층판과 인쇄회로기판 | |
EP3412722B1 (en) | Halogen-free thermosetting resin composition, prepreg containing same, laminate, and printed circuit board | |
WO2007063947A1 (ja) | フェノール樹脂組成物、その硬化物、銅張積層板用樹脂組成物、銅張積層板、及び新規フェノール樹脂 | |
CN109651763B (zh) | 一种热固性树脂组合物及使用其的预浸料、层压板和覆金属箔层压板 | |
JP3821728B2 (ja) | プリプレグ | |
CN108148178B (zh) | 一种热固性树脂组合物 | |
KR101847223B1 (ko) | 수지 조성물, 프리프레그, 및 금속박 피복 적층판 | |
JP2009108144A (ja) | フレキシブルハロゲンフリーエポキシ樹脂組成物、樹脂付き金属箔、カバーレイフィルム、プリプレグ、プリント配線板用積層板、金属張フレキシブル積層板 | |
WO2015184652A1 (zh) | 一种无卤树脂组合物以及使用它的预浸料和印制电路用层压板 | |
EP3040357A1 (en) | Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit prepared from the same | |
WO2015188310A1 (zh) | 一种无卤树脂组合物以及使用它的预浸料和印制电路用层压板 | |
JP5428212B2 (ja) | 樹脂組成物、プリプレグおよびそれを用いたプリント配線板 | |
WO2015188352A1 (zh) | 一种热固性环氧树脂组合物及其用途 | |
EP3040356B1 (en) | Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit prepared from the same | |
JP3546594B2 (ja) | エポキシ樹脂組成物、プリプレグ及び積層板 | |
CN115353717A (zh) | 一种树脂组合物及其应用 | |
JP2008150575A (ja) | グアナミン化合物含有溶液、熱硬化性樹脂組成物並びにこれを用いたプリプレグ、積層板及びプリント配線板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
AMND | Amendment | ||
E902 | Notification of reason for refusal | ||
AMND | Amendment | ||
AMND | Amendment | ||
E902 | Notification of reason for refusal | ||
AMND | Amendment | ||
X701 | Decision to grant (after re-examination) | ||
GRNT | Written decision to grant |