JP5923590B2 - 熱硬化性エポキシ樹脂組成物、プリプレグおよび積層板 - Google Patents

熱硬化性エポキシ樹脂組成物、プリプレグおよび積層板 Download PDF

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JP5923590B2
JP5923590B2 JP2014245841A JP2014245841A JP5923590B2 JP 5923590 B2 JP5923590 B2 JP 5923590B2 JP 2014245841 A JP2014245841 A JP 2014245841A JP 2014245841 A JP2014245841 A JP 2014245841A JP 5923590 B2 JP5923590 B2 JP 5923590B2
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epoxy resin
weight
parts
resin composition
bisphenol
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JP2016003335A (ja
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克 洪 方
克 洪 方
輝 李
輝 李
瑩 徐
瑩 徐
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Shengyi Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C08G59/60—Amines together with other curing agents with amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0066—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
JP2014245841A 2014-06-12 2014-12-04 熱硬化性エポキシ樹脂組成物、プリプレグおよび積層板 Active JP5923590B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410260933.4A CN105237949B (zh) 2014-06-12 2014-06-12 一种热固性环氧树脂组合物及其用途
CN201410260933.4 2014-06-12

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JP2016003335A JP2016003335A (ja) 2016-01-12
JP5923590B2 true JP5923590B2 (ja) 2016-05-24

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JP (1) JP5923590B2 (zh)
KR (1) KR101811914B1 (zh)
CN (1) CN105237949B (zh)
TW (1) TWI535777B (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6237951B1 (ja) * 2016-01-26 2017-11-29 東レ株式会社 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料
CN106496935B (zh) * 2016-10-17 2019-01-29 无锡宏仁电子材料科技有限公司 一种用于覆铜板的无卤阻燃超高cti高耐压树脂组合物
CN107603149B (zh) * 2017-08-28 2020-08-11 南亚新材料科技股份有限公司 一种检验电子级填料鱼目的方法
KR102025746B1 (ko) * 2017-11-08 2019-09-26 (주)영신 시트상의 접착성 가스켓을 이용한 파형 이음강관의 제조방법
CN109337288A (zh) * 2017-12-29 2019-02-15 东莞联茂电子科技有限公司 一种用于覆铜板的无铅高cti树脂组合物
JP7006285B2 (ja) * 2018-01-12 2022-01-24 住友ベークライト株式会社 樹脂組成物、金属張積層板、アルミベース基板およびプリント配線板
CN112004855B (zh) * 2018-04-20 2024-01-12 三菱瓦斯化学株式会社 热固化性组合物、预浸料、层叠板、覆金属箔层叠板、印刷电路板和多层印刷电路板
CN109705532B (zh) * 2018-12-29 2021-05-11 广东生益科技股份有限公司 一种无卤无磷无氮的阻燃树脂组合物、包含其的半固化片和覆金属箔层压板
JP7211829B2 (ja) * 2019-01-23 2023-01-24 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物及びその硬化物
CN109912932A (zh) * 2019-03-14 2019-06-21 南亚新材料科技股份有限公司 一种高cti值的无卤素粘合剂及其制备方法和应用
CN112694713B (zh) * 2019-10-23 2022-06-03 中国石油化工股份有限公司 一种耐老化可钻复合材料及其制备方法
CN110872430A (zh) * 2019-11-29 2020-03-10 陕西生益科技有限公司 一种高cti的树脂组合物、预浸料、层压板和覆金属箔层压板
CN111393069B (zh) * 2020-03-25 2021-09-21 深圳绿景环保再生资源有限公司 一种改性粉体与级配砂的环氧砂浆制备方法及环氧砂浆
CN111534056A (zh) * 2020-04-15 2020-08-14 浙江华正新材料股份有限公司 一种树脂组合物、预浸料及其层压板
CN112625284B (zh) * 2020-12-11 2023-01-24 江苏恒神股份有限公司 一种连续纤维增强热固型阻燃预浸料及其制备方法
CN113416487A (zh) * 2021-06-18 2021-09-21 中国船舶重工集团公司第七二五研究所 一种船舶复合材料防护用高耐候面漆及其制备方法
CN113736219A (zh) * 2021-08-23 2021-12-03 浙江华正新材料股份有限公司 树脂组合物、半固化片、电路基板、印制电路板
CN114525100A (zh) * 2022-03-16 2022-05-24 安徽工业技术创新研究院六安院 一种高导热低粘度环氧灌封胶及其制备方法
CN116970258B (zh) * 2023-08-09 2024-04-05 上海江天高分子材料有限公司 耐开裂、高导热的阻燃真空浇注树脂、制备方法和应用

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JPH115826A (ja) * 1997-04-22 1999-01-12 Matsushita Electric Works Ltd ビルドアップ用エポキシ樹脂組成物
JP5263705B2 (ja) * 2007-02-07 2013-08-14 三菱瓦斯化学株式会社 プリプレグ及び積層板
JP2010126620A (ja) * 2008-11-27 2010-06-10 Nippon Zeon Co Ltd プリプレグ及びそれを用いた積層体
JP5149917B2 (ja) * 2009-03-27 2013-02-20 日立化成工業株式会社 熱硬化性樹脂組成物、並びにこれを用いたプリプレグ、積層板及び多層プリント配線板
CN102051023B (zh) * 2010-12-09 2012-07-04 广东生益科技股份有限公司 无卤树脂组合物及使用其制作的涂树脂铜箔与覆铜板
CN102276961A (zh) * 2011-07-22 2011-12-14 苏州生益科技有限公司 无卤无磷环氧树脂组合物及使用其制作的半固化片及层压板
JP6152246B2 (ja) * 2011-09-26 2017-06-21 日立化成株式会社 プリント配線板用プリプレグ、積層板及びプリント配線板
CN102585440B (zh) * 2012-01-16 2013-09-04 广州宏仁电子工业有限公司 用于覆铜箔基板的高cti值无卤阻燃型树脂组合物
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CN105237949A (zh) 2016-01-13
KR101811914B1 (ko) 2017-12-22
JP2016003335A (ja) 2016-01-12
TW201546163A (zh) 2015-12-16
KR20150143234A (ko) 2015-12-23
TWI535777B (zh) 2016-06-01
CN105237949B (zh) 2017-11-03

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