WO2017020464A1 - 一种覆铜板用环氧树脂组合物及其应用 - Google Patents
一种覆铜板用环氧树脂组合物及其应用 Download PDFInfo
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- WO2017020464A1 WO2017020464A1 PCT/CN2015/096519 CN2015096519W WO2017020464A1 WO 2017020464 A1 WO2017020464 A1 WO 2017020464A1 CN 2015096519 W CN2015096519 W CN 2015096519W WO 2017020464 A1 WO2017020464 A1 WO 2017020464A1
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- epoxy resin
- bromine
- weight
- resin composition
- phosphorus
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- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
Definitions
- the present invention relates to the field of laminate technology, and in particular to an epoxy resin composition, and more particularly to an epoxy resin composition for a copper clad laminate and a prepreg, a laminate and a printed circuit board produced therefrom.
- Bromine flame retardant Most of the traditional FR4 uses bromine flame retardant. Bromine has high flame retardant efficiency, and flame retardant materials such as tetrabromobisphenol A are inexpensive and easy to promote. However, if only bromine is flame retarded, the total bromine content in ordinary FR4 generally reaches 15% (the bromine content accounts for the mass ratio of the organic solids in the sheet) to reach the UL94V-O level.
- the higher bromine content is not only environmentally friendly, but also because the C-Br bond is easily broken, which also causes the heat resistance of the material itself to be seriously degraded; and the organic matter with high bromine content is not conducive to high temperature, high pressure, humidity and easily polluted environment.
- phosphorus flame retardant can also achieve the purpose of flame retardant, because the phosphorus flame retardant system does not contain bromine, so the heat resistance is much better than the bromine flame retardant system.
- the phosphorus element is easy to absorb moisture, and the moisture absorption rate of the flame retardant plate is high, which is not conducive to the stability of the electrical properties of the plate; and the current price of the phosphorus-based flame retardant is generally high, and the cost pressure is large, so although The call for halogen-free is high, but it is not possible to abandon bromine flame retardation for cost reasons.
- Chinese patent CN102093670A discloses a method for achieving flame retardancy using a phosphorus-containing phenolic aldehyde containing a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) structure, although the water absorption rate of DOPO is It is lower than phosphate, but because of its large amount, the phosphorus content is also above 2%, so the moisture absorption rate is not improved.
- DOPO 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide
- CN101892027 and CN101808466 disclose the sharing of bromine and phosphorus, but due to the use of a large amount of nitrile rubber, the acrylonitrile structure has a higher water absorption rate than the epoxy resin, and the voltage resistance of the composite substrate is lowered, and in addition, the nitrile rubber is used.
- the acrylonitrile structure accelerates the decomposition of bromine, which is detrimental to the CTI performance of the bromine-containing system.
- not all of the phosphorus source and the bromine source used in the above two patents are connected to the polymer backbone, and the rubber has a negative influence on the Tg, so it is difficult to achieve a high glass transition temperature with the above two patents.
- the object of the present invention is to provide an epoxy resin composition, in particular, an epoxy tree for copper clad laminates. Fat compositions and prepregs made therefrom, laminates and printed circuit boards.
- the present invention adopts the following technical solutions:
- the present invention provides an epoxy resin composition
- an epoxy resin composition comprising, by weight of the organic solids, the following components:
- (B) curing agent 1-50 parts by weight;
- (C) curing accelerator 0.05-1.0 parts by weight
- the bromine content is 5-12% of the sum of the weights of the organic solids in the composition; and the phosphorus content is 0.2-1.5 of the sum of the weights of the organic solids in the composition. %.
- bromine-containing epoxy resin flame retardant materials Due to the use of bromine-containing epoxy resin flame retardant materials in the production of existing copper clad laminates, the bromine content usually exceeds 15% to achieve flame retardancy, but higher bromine content leads to poor heat resistance, CTI The value is also difficult to reach 600V; when the flame retardant is used alone for flame retardant, UL94V-0 grade is usually achieved at a higher phosphorus content. However, due to the high phosphorus content, there is a disadvantage of increasing moisture absorption rate. .
- the invention combines the ratio of the bromine-containing epoxy resin and the phosphorus-containing epoxy resin in the epoxy resin composition by adding the bromine-containing epoxy resin and the phosphorus-containing epoxy resin at the same time, so that the bromine content is 5%-12 %, the phosphorus content is 0.2%-1.5%, which not only makes the flame retardancy reach UL94V-0 grade, but also has higher heat resistance than the copper clad laminate which is only flame-retardant with the bromine-containing epoxy resin flame retardant material, and It can achieve higher CTI value (CTI>600V), and has lower moisture absorption rate and longer dipping resistance time than copper clad laminate with flame retardant containing phosphorus.
- CTI value CTI>600V
- the mixture of the phosphorus-containing epoxy resin and the bromine-containing epoxy resin and other epoxy resins is 50-100 parts by weight, for example, 50 parts by weight, 52 parts by weight, 55 parts by weight, 58 parts by weight, 60 parts by weight, 62 parts by weight, 65 parts by weight, 68 parts by weight, 70 parts by weight, 72 parts by weight, 75 parts by weight Parts, 78 parts by weight, 80 parts by weight, 82 parts by weight, 85 parts by weight, 88 parts by weight, 90 parts by weight, 92 parts by weight, 95 parts by weight, 98 parts by weight, 100 parts by weight.
- the curing agent is 1 to 50 parts by weight, and may be, for example, 1 part by weight, 5 parts by weight, 10 parts by weight, 15 parts by weight, 20 parts by weight, 22 parts by weight, 25 parts by weight, 28 parts by weight, 30 parts by weight, 32 parts by weight, 35 parts by weight, 38 parts by weight, 40 parts by weight, 42 parts by weight, 45 parts by weight, 48 parts by weight, and 50 parts by weight.
- the curing accelerator is 0.05-1.0 parts by weight, and may be, for example, 0.05 parts by weight, 0.08 parts by weight, 0.1 parts by weight, 0.2 parts by weight, 0.3 parts by weight, 0.4 parts by weight, 0.5 parts by weight, 0.6 parts by weight. 0.7 parts by weight, 0.8 parts by weight, 0.9 parts by weight, 1.0 parts by weight.
- the bromine content is 5-12% of the sum of the weights of the organic solids in the composition, and may be, for example, 5%, 5.5%, 6%, 6.5%, 7%, 7.5. %, 8%, 8.5%, 9%, 9.5%, 10%, 10.5%, 11%, 11.5%, 12%, preferably 5-10%, further preferably 5-8%.
- the epoxy resin composition has a phosphorus content of 0.2 to 1.5% by weight of the total of the organic solids in the composition, and may be, for example, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%. 0.7%, 0.8%, 0.9%, 1.0%, 1.1%, 1.2%, 1.3%, 1.4%, 1.5%, preferably 0.5-1.5%, and the difference is preferably 0.8-1.5%.
- the bromine-containing epoxy resin is any one or at least two of a low bromine epoxy resin, a high bromine epoxy resin, a brominated isocyanate modified epoxy resin or a brominated bisphenol A phenolic epoxy resin.
- a low bromine epoxy resin a high bromine epoxy resin
- a brominated isocyanate modified epoxy resin a brominated bisphenol A phenolic epoxy resin.
- the low bromine epoxy resin has a bromine content of 10% to 25%
- the high bromine epoxy resin has a bromine content of 40% or more.
- the phosphorus-containing epoxy resin is a phosphorus-containing phenanthrene-type compound.
- the phosphorus-containing epoxy resin is 9,10-dihydro-9-oxo-10-phosphaphenanthrene or 9,10-dihydro-9-oxo-10-phosphaphenone Bismuth and bisphenol A epoxy resin, o-cresol novolac epoxy resin, bisphenol A novolac epoxy resin, phenol epoxy resin, dicyclopentadiene epoxy resin, MDI epoxy resin bisphenol F Any one or a mixture of at least two of a condensate of a type epoxy resin or a bisphenol S type epoxy resin.
- the existing bromine-containing copper-clad laminates are mostly reactive flame retardants such as brominated epoxy
- the bromine flame retardant system usually needs more than 15% bromine content to achieve stable flame retardancy, while high bromine content leads to It is a serious drop in heat resistance and tracking resistance.
- the use of phosphorus-containing epoxy as a flame retardant also requires a phosphorus content of nearly 3% to achieve a stable UL94-V0 grade, and a high phosphorus content causes a sharp rise in the water absorption of the material, resulting in a decrease in the reliability of the material.
- the invention adopts low bromine epoxy resin, high bromine epoxy resin, brominated isocyanate modified epoxy resin or brominated bisphenol A phenolic epoxy resin as a source of bromine element, and phosphorus-containing phenanthrene type which provides phosphorus source
- the compound can be used in combination, and the two can exert a synergistic effect, and the flame retardancy of the substrate can be achieved to a UL94V-0 level by requiring only a low content of bromine and phosphorus, and the adhesion of the substrate can be further improved.
- Processability and process operability and can achieve CTI 600V and lower water absorption, reducing the dependence of flame retardant on bromine elements, and thus more environmentally friendly.
- both the phosphorus and bromine of the present invention are attached to the polymer backbone, the composite can achieve a higher glass transition temperature than the addition type of phosphorus bromine.
- the other epoxy resin is an epoxy resin containing no phosphorus and bromine, specifically a bisphenol A epoxy resin, an o-cresol novolac epoxy resin, a bisphenol A novolac epoxy resin, and a phenol.
- Type epoxy resin dicyclopentadiene type epoxy resin, MDI epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol F type epoxy resin, tetrafunctional epoxy resin, naphthalene Any one or a mixture of at least two of a type epoxy resin or a biphenyl type epoxy resin.
- the curing agent is a mixture of any one or at least two of a phenol resin, an aromatic diamine curing agent, dicyandiamide, an aliphatic amine, an acid anhydride, an active polyester or a cyanate.
- the phenolic resin is a phenol type phenol resin, a bisphenol A type phenol resin, an o-cresol novolac resin, a trisphenol novolak resin, a naphthalene type phenol resin, a biphenyl type phenol resin or a dicyclopentadiene phenol resin. Any one or a mixture of at least two.
- the aromatic diamine curing agent has the following chemical structural formula:
- X is -CH 2 -, -O- or R 1 , R 3 and R 4 are H, -CH 3 or -C 2 H 5 , and R 2 is H, -CH 3 or -C 2 H 5 .
- the curing accelerator is any one or a mixture of at least two of an imidazole curing accelerator, an organic phosphine curing accelerator, and a tertiary amine curing accelerator.
- the imidazole curing accelerator is 2-methylimidazole, 2-methyl-4-ethylimidazole, 2-undecylimidazole, 2-phenylimidazole or 1-cyanoethyl-2- Any one or a mixture of at least two of ethyl-4-methylimidazole.
- the organophosphine curing accelerator is tributylphosphine and/or triphenylphosphine.
- the tertiary amine curing accelerator is benzyldimethylamine.
- the amount of the curing accelerator added is not excessive, and the reaction is rapid when the amount is too large, and Conducive to process operations and material storage.
- the epoxy resin composition further contains a filler, preferably an inorganic filler.
- the filler is boehmite, aluminum hydroxide, barium sulfate, calcium fluoride, magnesium hydroxide, silica, glass powder, kaolin, talc, mica powder, alumina, zinc oxide, magnesium oxide, Any one or a mixture of at least two of boron nitride, aluminum nitride or calcium carbonate.
- the filler has an average particle diameter of from 0.3 to 20 ⁇ m.
- the content of the filler is 20-200 parts by weight, for example, 20 parts by weight, 30 parts by weight, based on 100 parts by weight of the total of the organic solids of the components in the epoxy resin composition. 50 parts by weight, 60 parts by weight, 80 parts by weight, 100 parts by weight, 120 parts by weight, 140 parts by weight, 150 parts by weight, 180 parts by weight, and 200 parts by weight.
- the relative tracking index (CTI) of the substrate can be further increased, and the leakage tracking index (CTI) of the substrate can be made 600 V or more.
- the epoxy resin composition may also be appropriately added with an auxiliary agent, and the auxiliary agent used is an aminosilane coupling agent.
- an epoxy silane coupling agent such a coupling agent is free from heavy metals and has no adverse effect on human health, and is used in an amount of 0.5 to 2% by weight of the inorganic filler.
- the epoxy resin composition further contains a solvent, and is preferably an organic solvent.
- the solvent is any one or at least two of N,N'-dimethylformamide, ethylene glycol ethyl ether, propylene glycol methyl ether, acetone, methyl ethyl ketone, methanol, ethanol, benzene or toluene. mixing.
- the viscosity can be adjusted using a solvent, and by using the above solvent, the solid component content in the epoxy resin composition can be adjusted to 40 to 80%.
- the present invention provides a prepreg produced using the epoxy resin composition according to the first aspect of the present invention, comprising a base material; and an epoxy tree adhered thereto by dipping and drying Fat composition.
- the matrix material is a nonwoven or woven fiberglass cloth.
- the present invention also provides a laminate comprising the prepreg according to the second aspect of the invention.
- the invention provides a printed circuit board comprising the laminate of the third aspect of the invention.
- the present invention has the following beneficial effects:
- the epoxy resin composition of the present invention can effectively control the cost while not only achieving the flame retardancy up to UL94V-0 level, but also improving the material leakage compared with the leakage of the material.
- the index (CTI) can reach CTI>600V.
- the epoxy resin composition of the present invention has better heat resistance than the pure bromine flame retardant system, and has a lower moisture absorption rate than the pure phosphorus flame retardant system, that is, the pure bromine is solved.
- the flame retardant heat resistance is poor and the pure phosphorus flame retardant moisture absorption rate is high, and the comprehensive performance is excellent.
- the present invention can further reduce the dependence of the flame retardant on the bromine element, thereby making it more environmentally friendly.
- the epoxy resin, the curing agent, the filler and the curing accelerator are mixed with an organic solvent, uniformly mixed by a stirring and dispersing device, and the epoxy resin composition is pre-impregnated on the non-woven or spun fiberglass cloth. It is dried in a gluing machine (120-180 ° C) to prepare a prepreg for a printed circuit board in a semi-cured state.
- the prepreg is laminated several times, and the copper foil is laminated on one side or both sides of the laminate, and then placed on a 120-200 ° C laminator, and hot-pressed to form a printed circuit board.
- a copper clad laminate; the copper foil may also be replaced with an aluminum foil, a silver foil or a stainless steel foil.
- the glass transition temperature, the tracking tracking index (CTI), the flame retardancy, the dipping time, the PCT water absorption rate, the 5% thermal weight loss and the drilling process were tested.
- CTI tracking tracking index
- the flame retardancy the flame retardancy
- the dipping time the PCT water absorption rate
- the 5% thermal weight loss the drilling process was tested.
- the properties and the like are further explained and described as in the following Examples 1-5 and Comparative Examples 1-7.
- the measurement was carried out according to the DSC method specified in IPC-TM-6502.4.25 by differential scanning calorimetry (DSC).
- a double-sided copper foil sheet having a size of 100 ⁇ 100 mm was immersed in a solder bath heated to 288 ° C, and the time from the immersion to the occurrence of the delamination of the sheet was calculated.
- the pre-dried sample was weighed and then cooked in an autoclave for 4 hours to see the rate of change in mass.
- the temperature was raised to 500 ° C in a nitrogen atmosphere at a heating rate of 5 ° C / min, and the temperature at which the sample mass loss was 5% was recorded.
- the two plates with a thickness of 1.6mm are stacked together, drilled with a 0.3mm drill bit, the drilling speed is 110krpm, the falling speed is 33mm/s, and 5000 holes are continuously drilled. Whenever the 1000 holes, the tip wear of the drill bit is observed. The size of the wear determines the processability of the drill.
- Comparative Example 6 Synthetic rubber (commercial brand No. Nipol 1072CGX, produced by ZEON Corporation, USA) 23 parts by weight, brominated epoxy (manufactured by DER530A80, manufactured by DOW), 25 parts by weight, high 21 parts by weight of bromine epoxy (commercial brand No.
- EPICLON 153-60M produced by Dainippon Ink
- 25 parts by weight of biphenyl epoxy NC3000H, manufactured by Nippon Kayaku Co., Ltd.
- 2E4MI manufactured by Shikoku Chemical Co., Ltd.
- aromatic diamine 4,4-DDS produced by Taiwan Hygiene
- SPB-100 phenoxyphosphazene
- SPB-100 phosphorus content 13.4%
- Yabao, USA 20 parts by weight
- aluminum hydroxide manufactured by Yabao, USA
- 8 parts by weight of barium sulfate Guizhou Red Star Co., Ltd.
- the solvent MEK adjusted the solid content to 66%.
- Comparative Example 7 33 parts by weight of a nitrile rubber-modified epoxy (SC-024, manufactured by SHIN-A), 67 parts by weight of a brominated epoxy resin (DEBR 530A80, manufactured by The Dow Chemical Co., Ltd.), 3 parts of dicyandiamide, 2 - 0.02 parts of methylimidazole, 6 parts by weight of tetrabromobisphenol A, 31 parts by weight of phosphorus phenolic aldehyde (LC950, produced by SHIN-A), 17 parts by weight of aluminum hydroxide (manufactured by Yabao, USA), boehmite Source quartz material Co., Ltd.) 34 parts by weight, barium sulfate (Guizhou Red Star Co., Ltd.) 9 parts by weight, solvent MEK adjusted solid content to 66%.
- SC-024, manufactured by SHIN-A 67 parts by weight of a brominated epoxy resin
- DEBR 530A80 brominated epoxy resin
- LC950 phosphorus
- Example 1-5 Compared with Comparative Example 3, the PCT water absorption rate of Example 1-5 is superior to that of Comparative Example 3, since only phosphorus-containing epoxy resin is used in Comparative Example 3, the phosphorus content thereof is as high as 2.21%, and the moisture absorption property thereof is high. Rising, and in Example 1-5, after using a phosphorus-containing epoxy resin and a bromine-containing epoxy resin, low moisture absorption can be achieved at a phosphorus content of only 0.2% to 1.5%, indicating that a phosphorus-containing epoxy resin is used. Substrate after bromine-containing epoxy resin compounding technology Low water absorption can be obtained.
- Example 2-5 phosphorus-bromine synergistic flame-retarding requires only 11% or less of bromine to achieve flame retardant UL94V-0, while Comparative Example 2 only incorporates bromine flame retardant. Although the bromine content reaches 11%, it still does not reach the UL94V-0 level of flame retardant.
- Example 1-5 utilizes a phosphorus-bromine synergistic flame-retardant route, and only needs 12% or less of bromine element in the case of achieving the flame retardant UL94V-0 level, so Examples 1-5 Compared with Comparative Example 1, it has higher chemical heat resistance, that is, the 5% weight loss temperature is 10 ° C or more higher than Comparative Example 1, and the dipping resistance time is also longer.
- Comparative Example 6 and Comparative Example 7 The resin compositions invented by the patents CN 101808466A and CN 101892027A, respectively, have failed to reach CTI 600V under the same bromine content and phosphorus content as in the present invention and the same filler system. And the water absorption rate is significantly higher than the present invention, the dipping resistance time is less than 300 s, and the present invention exhibits better thermal shock resistance. Compared with Comparative Example 6, the present invention can achieve the glass transition temperature of the material without using the reactive phosphorus-bromine introduction method. In Comparative Example 7, although the phosphorus-containing phenolic aldehyde can be reacted, the reactivity itself is poor, and it is difficult to completely graft onto the polymer main chain, so that it affects the Tg of the sheet.
- the epoxy resin composition of the present invention has a much higher heat resistance than the pure bromine flame retardant system and has a CTI of 600 V or more after adding a filler such as boehmite; compared to pure phosphorus resistance
- the combustion system has lower water absorption rate, good drilling processability and good flame retardancy.
- the prepreg and the copper clad laminate prepared by using the above epoxy resin composition have excellent CTI characteristics, so that the PCB can be significantly improved in a harsh environment. Adaptability; at the same time relatively high heat resistance, long time of dipping resistance, can be suitable for the needs of lead-free soldering. And the invention can further reduce the dependence of the flame retardant on the bromine element, thereby making it more environmentally friendly.
- the present invention illustrates the process of the present invention by the above-described embodiments, but the present invention is not limited to the above process steps, that is, it does not mean that the present invention must rely on the above process steps to be implemented. It will be apparent to those skilled in the art that any modifications of the present invention, equivalent substitutions of the materials selected for the present invention, and the addition of the auxiliary ingredients, the selection of the specific means, etc., are all within the scope of the present invention.
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Abstract
Description
测试项目 | 实施例1 | 实施例2 | 实施例3 | 实施例4 | 实施例5 | 比较例1 | 比较例2 |
Tg(DSC)(℃) | 142 | 141 | 144 | 140 | 149 | 133 | 140 |
CTI(V) | 600 | 600 | 600 | 175 | 600 | 500 | 600 |
耐浸焊 | >600s | >600s | >600s | >600s | >600s | <400s | >600s |
PCT吸水率% | 0.19 | 0.21 | 0.25 | 0.22 | 0.24 | 0.20 | 0.21 |
Td5% | 360 | 362 | 366 | 360 | 358 | 350 | 361 |
燃烧性 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-1 |
钻孔性 | 好 | 好 | 好 | 好 | 好 | 好 | 好 |
测试项目 | 比较例3 | 比较例4 | 比较例5 | 比较例6 | 比较例7 |
Tg(DSC)(℃) | 134 | 141 | 139 | 112 | 131 |
CTI(V) | 600 | 300V | 600V | 525V | 550V |
耐浸焊 | >600s | <400s | <300s | <300s | <300s |
PCT吸水率% | 0.35 | 0.22 | 0.33 | 0.55 | 0.58 |
Td5% | 367 | 352 | 359 | 348 | 344 |
燃烧性 | V-0 | V-0 | V-0 | V-0 | V-0 |
钻孔性 | 一般 | 一般 | 一般 | 好 | 好 |
Claims (10)
- 一种环氧树脂组合物,其特征在于,以有机固形物重量份计,包括如下组分:(A)含磷环氧树脂与含溴环氧树脂和其他环氧树脂的混合物:50-100重量份;(B)固化剂:1-50重量份;(C)固化促进剂:0.05-1.0重量份;其中,所述环氧树脂组合物中,溴含量占所述组合物中有机固形物重量之和的5-12%;磷含量占所述组合物中有机固形物重量之和的0.2-1.5%。
- 如权利要求1所述的环氧树脂组合物,其特征在于,所述环氧树脂组合物中,溴含量占所述组合物中有机固形物重量之和的5-10%,优选为5-8%;磷含量占所述组合物中有机固形物重量之和的0.5-1.5%,优选为0.8-1.5%。
- 如权利要求1或2所述的环氧树脂组合物,其特征在于,所述含溴环氧树脂为低溴环氧树脂、高溴环氧树脂、溴化异氰酸酯改性环氧树脂或溴化双酚A酚醛环氧树脂中的任意一种或至少两种的混合;优选地,所述低溴环氧树脂溴含量为10%-25%,所述高溴环氧树脂溴含量为40%以上;优选地,所述含磷环氧树脂为含磷有菲型化合物;优选地,所述含磷环氧树脂为以9,10-二氢-9-氧-10-磷杂菲对苯二酚或9,10-二氢-9-氧-10-磷杂菲萘醌与双酚A型环氧树脂、邻甲酚型酚醛环氧树脂、双酚A型酚醛环氧树脂、苯酚型环氧树脂、双环戊二烯型环氧树脂、MDI环氧树脂双酚F型环氧树脂或双酚S型环氧树脂的缩合物中的任意一种或至少两种的混合。
- 如权利要求1-3任一项所述的环氧树脂组合物,其特征在于,所述其他 环氧树脂为不含磷和溴的环氧树脂;具体为双酚A型环氧树脂、邻甲酚型酚醛环氧树脂、双酚A型酚醛环氧树脂、苯酚型环氧树脂、双环戊二烯型环氧树脂、MDI环氧树脂、双酚F型环氧树脂、双酚S型环氧树脂、双酚F型环氧树脂、双酚S型环氧树脂、四官能环氧树脂、萘型环氧树脂或联苯型环氧树脂中的任意一种或至少两种的混合。
- 如权利要求1-5任一项所述的环氧树脂组合物,其特征在于,所述固化 促进剂为咪唑类固化促进剂、有机膦固化促进剂或三级胺固化促进剂中的任意一种或至少两种的混合;优选地,所述咪唑类固化促进剂为2-甲基咪唑、2-甲基-4-乙基咪唑、2-十一烷基咪唑、2-苯基咪唑或1-氰乙基-2-乙基-4-甲基咪唑中的任意一种或至少两种的混合;优选地,所述有机膦固化促进剂为三丁基膦和/或三苯基膦;优选地,所述三级胺固化促进剂为苄基二甲基胺。
- 如权利要求1-6任一项所述的环氧树脂组合物,其特征在于,所述环氧树脂组合物还含有填料,优选为无机填料;优选地,所述填料为勃姆石、氢氧化铝、硫酸钡、氟化钙、氢氧化镁、二氧化硅、玻璃粉、高岭土、滑石粉、云母粉、氧化铝、氧化锌、氧化镁、氮化硼、氮化铝或碳酸钙中的任意一种或至少两种的混合;优选地,所述填料的平均粒径为0.3-20μm;优选地,按所述环氧树脂组合物中各组分的有机固形物之和为100重量份计,所述填料的含量为20-100重量份;优选地,所述环氧树脂组合物还含有溶剂,优选为有机溶剂;优选地,所述溶剂为N,N’-二甲基甲酰胺、乙二醇乙醚、丙二醇甲醚、丙酮、丁酮、甲醇、乙醇、苯或甲苯中的任意一种或至少两种的混合。
- 一种使用如权利要求1-7任一项所述的环氧树脂组合物制作的预浸料,其特征在于,其包括基体材料;和通过浸渍干燥后附着在其上的环氧树脂组合物;优选地,所述的基体材料为无纺或有纺玻璃纤维布。
- 一种层压板,其特征在于,其包含如权利要求8所述的预浸料。
- 一种印刷电路板,其特征在于,其包含如权利要求9所述的层压板。
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