KR101762463B1 - 웨이퍼 공정 중에 반도체 웨이퍼들에 전해지는 오염물의 양을 모니터하는 방법 - Google Patents

웨이퍼 공정 중에 반도체 웨이퍼들에 전해지는 오염물의 양을 모니터하는 방법 Download PDF

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KR101762463B1
KR101762463B1 KR1020127016382A KR20127016382A KR101762463B1 KR 101762463 B1 KR101762463 B1 KR 101762463B1 KR 1020127016382 A KR1020127016382 A KR 1020127016382A KR 20127016382 A KR20127016382 A KR 20127016382A KR 101762463 B1 KR101762463 B1 KR 101762463B1
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soi structure
silicon layer
metal contaminants
metal
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KR20120099733A (ko
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제프리 엘. 리버트
루 페이
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썬에디슨, 인크.
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
KR1020127016382A 2009-12-23 2010-12-17 웨이퍼 공정 중에 반도체 웨이퍼들에 전해지는 오염물의 양을 모니터하는 방법 Active KR101762463B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US28987809P 2009-12-23 2009-12-23
US61/289,878 2009-12-23
PCT/IB2010/055925 WO2011077344A2 (en) 2009-12-23 2010-12-17 Method for monitoring the amount of contamination imparted into semiconductor wafers during wafer processing

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KR20120099733A KR20120099733A (ko) 2012-09-11
KR101762463B1 true KR101762463B1 (ko) 2017-07-27

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US (4) US8143078B2 (enExample)
EP (1) EP2517234A2 (enExample)
JP (1) JP2013516063A (enExample)
KR (1) KR101762463B1 (enExample)
CN (1) CN102687260A (enExample)
SG (1) SG181427A1 (enExample)
TW (1) TWI528482B (enExample)
WO (1) WO2011077344A2 (enExample)

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JP5783312B1 (ja) * 2014-09-18 2015-09-24 株式会社Sumco エピタキシャルシリコンウェーハの製造方法及び気相成長装置
TWI559424B (zh) * 2015-03-05 2016-11-21 力晶科技股份有限公司 半導體晶圓的金屬汙染即時監控方法
CN104713588B (zh) * 2015-03-20 2017-03-29 上海华力微电子有限公司 一种监控电子显微镜真空腔体洁净度的方法
CN106206334B (zh) * 2015-05-07 2019-01-22 中芯国际集成电路制造(上海)有限公司 监测晶圆以及金属污染的监测方法
CN107301960A (zh) * 2016-04-15 2017-10-27 上海新昇半导体科技有限公司 晶圆金属污染的评估方法
JP6897764B2 (ja) * 2017-04-25 2021-07-07 株式会社Sumco シリコン単結晶の製造方法、および、エピタキシャルシリコンウェーハの製造方法
US10504805B2 (en) * 2017-08-24 2019-12-10 Applied Materials Israel Ltd. Method of examining defects in a semiconductor specimen and system thereof
GB2580858B (en) 2018-09-07 2021-07-21 Memsstar Ltd A method for detecting defects in thin film layers
US10714329B2 (en) * 2018-09-28 2020-07-14 Taiwan Semiconductor Manufacturing Co., Ltd. Pre-clean for contacts
CN111106024B (zh) * 2018-10-26 2023-09-29 长鑫存储技术有限公司 流场分布的检测方法
US11211272B2 (en) * 2019-09-25 2021-12-28 Micron Technology, Inc. Contaminant detection tools and related methods
WO2021159225A1 (en) 2020-02-10 2021-08-19 Yangtze Memory Technologies Co., Ltd. Metal contamination test apparatus and method
US12278124B2 (en) * 2021-10-28 2025-04-15 Applied Materials, Inc. Model-based controlled load lock pumping scheme
CN115793416B (zh) * 2023-01-16 2023-04-25 广州粤芯半导体技术有限公司 半导体器件制备方法及监测光刻工艺化学品杂质的方法
US12467877B2 (en) 2023-01-31 2025-11-11 Globalwafers Co., Ltd. Methods for detecting defects in a single crystal silicon structure
CN116387174B (zh) * 2023-03-27 2024-11-22 马鞍山芯乔科技有限公司 一种晶圆传递夹具污染自检测装置及其检测工艺

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Publication number Publication date
WO2011077344A2 (en) 2011-06-30
US20110151592A1 (en) 2011-06-23
CN102687260A (zh) 2012-09-19
US8143078B2 (en) 2012-03-27
SG181427A1 (en) 2012-07-30
KR20120099733A (ko) 2012-09-11
TW201142969A (en) 2011-12-01
EP2517234A2 (en) 2012-10-31
US20120115258A1 (en) 2012-05-10
TWI528482B (zh) 2016-04-01
US8822242B2 (en) 2014-09-02
WO2011077344A3 (en) 2011-10-13
JP2013516063A (ja) 2013-05-09
US20110212550A1 (en) 2011-09-01
US20110212547A1 (en) 2011-09-01

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