KR101711961B1 - 발광 디바이스 - Google Patents

발광 디바이스 Download PDF

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Publication number
KR101711961B1
KR101711961B1 KR1020100089048A KR20100089048A KR101711961B1 KR 101711961 B1 KR101711961 B1 KR 101711961B1 KR 1020100089048 A KR1020100089048 A KR 1020100089048A KR 20100089048 A KR20100089048 A KR 20100089048A KR 101711961 B1 KR101711961 B1 KR 101711961B1
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KR
South Korea
Prior art keywords
substrate
light emitting
integrated circuit
emitting device
driving integrated
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KR1020100089048A
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English (en)
Korean (ko)
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KR20120026873A (ko
Inventor
송호영
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삼성전자주식회사
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Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR1020100089048A priority Critical patent/KR101711961B1/ko
Priority to EP11180601.4A priority patent/EP2428991B1/en
Priority to US13/229,152 priority patent/US9006973B2/en
Priority to JP2011197317A priority patent/JP5945392B2/ja
Priority to CN201110276376.1A priority patent/CN102403309B/zh
Publication of KR20120026873A publication Critical patent/KR20120026873A/ko
Application granted granted Critical
Publication of KR101711961B1 publication Critical patent/KR101711961B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
KR1020100089048A 2010-09-10 2010-09-10 발광 디바이스 Active KR101711961B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020100089048A KR101711961B1 (ko) 2010-09-10 2010-09-10 발광 디바이스
EP11180601.4A EP2428991B1 (en) 2010-09-10 2011-09-08 Light Emitting Component with integrated control
US13/229,152 US9006973B2 (en) 2010-09-10 2011-09-09 Light emitting device
JP2011197317A JP5945392B2 (ja) 2010-09-10 2011-09-09 発光デバイス
CN201110276376.1A CN102403309B (zh) 2010-09-10 2011-09-13 发光器件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100089048A KR101711961B1 (ko) 2010-09-10 2010-09-10 발광 디바이스

Publications (2)

Publication Number Publication Date
KR20120026873A KR20120026873A (ko) 2012-03-20
KR101711961B1 true KR101711961B1 (ko) 2017-03-03

Family

ID=44582605

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100089048A Active KR101711961B1 (ko) 2010-09-10 2010-09-10 발광 디바이스

Country Status (5)

Country Link
US (1) US9006973B2 (enExample)
EP (1) EP2428991B1 (enExample)
JP (1) JP5945392B2 (enExample)
KR (1) KR101711961B1 (enExample)
CN (1) CN102403309B (enExample)

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* Cited by examiner, † Cited by third party
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CN102751296B (zh) * 2012-07-24 2015-05-20 矽光光电科技（上海）有限公司 整合集成电路、发光元件及传感元件的单衬底器件
CN105264661B (zh) * 2013-03-25 2018-01-16 香港科技大学 功率片上系统结构
EP3022779B1 (en) * 2013-07-19 2020-03-18 Lumileds Holding B.V. Pc led with optical element and without substrate carrier
TWM496091U (zh) * 2014-03-26 2015-02-21 賀喜能源股份有限公司 具矽基座的發光二極體及發光二極體燈具
DE102014105734A1 (de) * 2014-04-23 2015-10-29 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
JP6736260B2 (ja) * 2015-05-13 2020-08-05 ローム株式会社 半導体発光装置
US20170104135A1 (en) * 2015-10-13 2017-04-13 Sensor Electronic Technology, Inc. Light Emitting Diode Mounting Structure
JP7329502B2 (ja) * 2018-04-19 2023-08-18 ソニーセミコンダクタソリューションズ株式会社 半導体レーザ駆動装置およびその製造方法
US12148743B2 (en) * 2018-12-11 2024-11-19 Sony Semiconductor Solutions Corporation Semiconductor device and electronic equipment
CN113594194B (zh) 2020-04-30 2024-09-17 华为机器有限公司 一种堆叠结构、显示屏及显示装置
KR102557580B1 (ko) * 2021-01-05 2023-07-20 엘지전자 주식회사 반도체 발광 소자 패키지 및 디스플레이 장치

Citations (2)

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Publication number Priority date Publication date Assignee Title
US20070257901A1 (en) * 2004-04-19 2007-11-08 Matsushita Electric Industrial Co., Ltd. Semiconductor chip for driving light emitting element, light emitting device, and lighting device
US20080290353A1 (en) * 2007-05-24 2008-11-27 Medendorp Jr Nicholas W Microscale optoelectronic device packages

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JPS63111682A (ja) * 1986-10-29 1988-05-16 Mitsubishi Electric Corp 光半導体素子用サブマウント
US6333522B1 (en) 1997-01-31 2001-12-25 Matsushita Electric Industrial Co., Ltd. Light-emitting element, semiconductor light-emitting device, and manufacturing methods therefor
US6777883B2 (en) 2002-04-10 2004-08-17 Koninklijke Philips Electronics N.V. Integrated LED drive electronics on silicon-on-insulator integrated circuits
US20040206970A1 (en) 2003-04-16 2004-10-21 Martin Paul S. Alternating current light emitting device
JP2005142294A (ja) 2003-11-05 2005-06-02 Matsushita Electric Ind Co Ltd 半導体レーザユニットおよびそれを用いた光ピックアップ装置
ATE524839T1 (de) 2004-06-30 2011-09-15 Cree Inc Verfahren zum kapseln eines lichtemittierenden bauelements und gekapselte lichtemittierende bauelemente im chip-massstab
KR100927256B1 (ko) 2004-07-09 2009-11-16 엘지전자 주식회사 제너다이오드가 집적된 발광소자 서브마운트 제작방법
US7221044B2 (en) 2005-01-21 2007-05-22 Ac Led Lighting, L.L.C. Heterogeneous integrated high voltage DC/AC light emitter
JP4601464B2 (ja) * 2005-03-10 2010-12-22 株式会社沖データ 半導体装置、プリントヘッド、及びそれを用いた画像形成装置
JP5059739B2 (ja) 2005-03-11 2012-10-31 ソウル セミコンダクター カンパニー リミテッド 直列接続された発光セルのアレイを有する発光ダイオードパッケージ
KR101241973B1 (ko) 2005-03-11 2013-03-08 서울반도체 주식회사 발광 장치 및 이의 제조 방법
US7495944B2 (en) 2005-03-30 2009-02-24 Ovonyx, Inc. Reading phase change memories
JP4969055B2 (ja) * 2005-04-28 2012-07-04 ローム株式会社 光通信モジュール
US7994514B2 (en) 2006-04-21 2011-08-09 Koninklijke Philips Electronics N.V. Semiconductor light emitting device with integrated electronic components
US7655957B2 (en) 2006-04-27 2010-02-02 Cree, Inc. Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same
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WO2008123020A1 (ja) * 2007-03-09 2008-10-16 Sanyo Electric Co., Ltd. 半導体装置及びその製造方法
JP2008235792A (ja) * 2007-03-23 2008-10-02 Matsushita Electric Ind Co Ltd 半導体装置とその製造方法
KR100878326B1 (ko) 2007-07-03 2009-01-14 한국광기술원 칩스케일 패키징 발광소자 및 그의 제조방법
JP2009117536A (ja) * 2007-11-05 2009-05-28 Towa Corp 樹脂封止発光体及びその製造方法
JP5102605B2 (ja) 2007-12-25 2012-12-19 パナソニック株式会社 発光装置およびその製造方法
JP5475954B2 (ja) * 2008-01-28 2014-04-16 パナソニック株式会社 発光装置
US8084780B2 (en) * 2009-08-13 2011-12-27 Semileds Optoelectronics Co. Smart integrated semiconductor light emitting system including light emitting diodes and application specific integrated circuits (ASIC)

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070257901A1 (en) * 2004-04-19 2007-11-08 Matsushita Electric Industrial Co., Ltd. Semiconductor chip for driving light emitting element, light emitting device, and lighting device
US20080290353A1 (en) * 2007-05-24 2008-11-27 Medendorp Jr Nicholas W Microscale optoelectronic device packages

Also Published As

Publication number Publication date
CN102403309A (zh) 2012-04-04
EP2428991A3 (en) 2014-06-11
JP2012060133A (ja) 2012-03-22
EP2428991B1 (en) 2019-02-20
JP5945392B2 (ja) 2016-07-05
EP2428991A2 (en) 2012-03-14
US20120062115A1 (en) 2012-03-15
KR20120026873A (ko) 2012-03-20
CN102403309B (zh) 2015-09-16
US9006973B2 (en) 2015-04-14

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