KR101706465B1 - 프린트 기판 검사 장치 및 검사 방법 - Google Patents

프린트 기판 검사 장치 및 검사 방법 Download PDF

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Publication number
KR101706465B1
KR101706465B1 KR1020150105732A KR20150105732A KR101706465B1 KR 101706465 B1 KR101706465 B1 KR 101706465B1 KR 1020150105732 A KR1020150105732 A KR 1020150105732A KR 20150105732 A KR20150105732 A KR 20150105732A KR 101706465 B1 KR101706465 B1 KR 101706465B1
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KR
South Korea
Prior art keywords
probe
current source
constant current
conductor pattern
time
Prior art date
Application number
KR1020150105732A
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English (en)
Korean (ko)
Other versions
KR20160014540A (ko
Inventor
겐고 즈치다
야스시 미야케
Original Assignee
야마하 파인 테크 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 야마하 파인 테크 가부시키가이샤 filed Critical 야마하 파인 테크 가부시키가이샤
Publication of KR20160014540A publication Critical patent/KR20160014540A/ko
Application granted granted Critical
Publication of KR101706465B1 publication Critical patent/KR101706465B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
KR1020150105732A 2014-07-29 2015-07-27 프린트 기판 검사 장치 및 검사 방법 KR101706465B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014153493 2014-07-29
JPJP-P-2014-153493 2014-07-29

Publications (2)

Publication Number Publication Date
KR20160014540A KR20160014540A (ko) 2016-02-11
KR101706465B1 true KR101706465B1 (ko) 2017-02-13

Family

ID=55247299

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150105732A KR101706465B1 (ko) 2014-07-29 2015-07-27 프린트 기판 검사 장치 및 검사 방법

Country Status (4)

Country Link
JP (1) JP6095735B2 (ja)
KR (1) KR101706465B1 (ja)
CN (1) CN105319476B (ja)
TW (1) TWI598604B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6474362B2 (ja) * 2016-04-04 2019-02-27 ファナック株式会社 プリント基板の劣化検出装置
CN106824832B (zh) * 2017-02-15 2019-05-17 友达光电（苏州）有限公司 一种检测装置及其使用方法
JP7009814B2 (ja) * 2017-07-27 2022-02-10 日本電産リード株式会社 絶縁検査装置及び絶縁検査方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002014135A (ja) * 2000-06-30 2002-01-18 Hioki Ee Corp 回路基板検査方法および回路基板検査装置
JP2002014134A (ja) * 2000-06-30 2002-01-18 Hioki Ee Corp 回路基板検査装置
JP2008232963A (ja) * 2007-03-23 2008-10-02 Hioki Ee Corp プローブ、プローブ装置および検査装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2670655B2 (ja) * 1992-11-04 1997-10-29 株式会社アドテックエンジニアリング 回路パターン検査装置及び検査方法
JPH07244107A (ja) * 1994-03-03 1995-09-19 Hioki Ee Corp Ｉｃのｘ−ｙ方式インサーキットテスタによる逆配置検出方法
JP2994259B2 (ja) 1996-03-28 1999-12-27 オー・エイチ・ティー株式会社 基板検査方法および基板検査装置
JP3165056B2 (ja) * 1997-02-28 2001-05-14 日本電産リード株式会社 基板検査装置および基板検査方法
JP3361311B2 (ja) 1997-02-28 2003-01-07 日本電産リード株式会社 基板検査装置および基板検査方法
JP2002156399A (ja) * 2000-11-17 2002-05-31 Oht Inc 回路基板の検査装置及び検査方法
US7250781B2 (en) * 2002-12-19 2007-07-31 Fuji Xerox Co., Ltd. Circuit board inspection device
JP4825083B2 (ja) * 2006-08-28 2011-11-30 株式会社アドテックエンジニアリング なぞり式回路基板検査装置
CN201014993Y (zh) * 2006-12-04 2008-01-30 杨世光 Pcb板测试仪的测试电路改良
JP6229876B2 (ja) * 2013-08-27 2017-11-15 日本電産リード株式会社 検査装置
JP6229877B2 (ja) * 2013-08-27 2017-11-15 日本電産リード株式会社 検査装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002014135A (ja) * 2000-06-30 2002-01-18 Hioki Ee Corp 回路基板検査方法および回路基板検査装置
JP2002014134A (ja) * 2000-06-30 2002-01-18 Hioki Ee Corp 回路基板検査装置
JP2008232963A (ja) * 2007-03-23 2008-10-02 Hioki Ee Corp プローブ、プローブ装置および検査装置

Also Published As

Publication number Publication date
TW201604564A (zh) 2016-02-01
CN105319476A (zh) 2016-02-10
JP2016033511A (ja) 2016-03-10
KR20160014540A (ko) 2016-02-11
TWI598604B (zh) 2017-09-11
CN105319476B (zh) 2018-05-08
JP6095735B2 (ja) 2017-03-15

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