KR101683312B1 - 이방성 도전 접착제 및 그것을 사용한 접속 구조체의 제조 방법 - Google Patents
이방성 도전 접착제 및 그것을 사용한 접속 구조체의 제조 방법 Download PDFInfo
- Publication number
- KR101683312B1 KR101683312B1 KR1020117007216A KR20117007216A KR101683312B1 KR 101683312 B1 KR101683312 B1 KR 101683312B1 KR 1020117007216 A KR1020117007216 A KR 1020117007216A KR 20117007216 A KR20117007216 A KR 20117007216A KR 101683312 B1 KR101683312 B1 KR 101683312B1
- Authority
- KR
- South Korea
- Prior art keywords
- anisotropic conductive
- conductive adhesive
- flexible printed
- wiring board
- printed wiring
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2409/00—Presence of diene rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Combinations Of Printed Boards (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2008-254323 | 2008-09-30 | ||
JP2008254323 | 2008-09-30 | ||
PCT/JP2009/066987 WO2010038753A1 (ja) | 2008-09-30 | 2009-09-29 | 異方性導電接着剤及びそれを用いた接続構造体の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110063500A KR20110063500A (ko) | 2011-06-10 |
KR101683312B1 true KR101683312B1 (ko) | 2016-12-06 |
Family
ID=42073514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020117007216A KR101683312B1 (ko) | 2008-09-30 | 2009-09-29 | 이방성 도전 접착제 및 그것을 사용한 접속 구조체의 제조 방법 |
Country Status (6)
Country | Link |
---|---|
JP (2) | JP5728803B2 (zh) |
KR (1) | KR101683312B1 (zh) |
CN (2) | CN102171306B (zh) |
HK (2) | HK1156963A1 (zh) |
TW (2) | TWI548719B (zh) |
WO (1) | WO2010038753A1 (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5840418B2 (ja) * | 2011-08-23 | 2016-01-06 | デクセリアルズ株式会社 | 導電性接着剤及び太陽電池モジュール |
AT511655B1 (de) * | 2011-10-20 | 2013-02-15 | Prelonic Technologies Gmbh | Verfahren zum verkleben von schaltungselementen und kleber |
KR101355857B1 (ko) * | 2011-12-16 | 2014-01-27 | 제일모직주식회사 | 이방 전도성 필름용 조성물, 이로부터 제조된 이방 전도성 필름 및 반도체 장치 |
KR101355854B1 (ko) * | 2011-12-16 | 2014-01-29 | 제일모직주식회사 | 이방성 도전 필름 |
KR101355856B1 (ko) * | 2011-12-26 | 2014-01-27 | 제일모직주식회사 | 이방 전도성 접착 필름용 조성물 및 이를 이용한 이방 전도성 접착 필름 |
JP5934528B2 (ja) * | 2012-03-12 | 2016-06-15 | デクセリアルズ株式会社 | 回路接続材料、及びそれを用いた実装体の製造方法 |
JP6029922B2 (ja) * | 2012-10-05 | 2016-11-24 | デクセリアルズ株式会社 | 回路接続材料及びその製造方法、並びにそれを用いた実装体の製造方法 |
JP6330346B2 (ja) * | 2014-01-29 | 2018-05-30 | 日立化成株式会社 | 接着剤組成物、接着剤組成物を用いた電子部材、及び半導体装置の製造方法 |
JP6337630B2 (ja) * | 2014-06-12 | 2018-06-06 | 日立化成株式会社 | 回路接続材料及び回路接続構造体 |
JP2016178225A (ja) * | 2015-03-20 | 2016-10-06 | デクセリアルズ株式会社 | 異方性導電接続構造体、異方性導電接続方法、及び異方性導電接着剤 |
JP7386773B2 (ja) * | 2015-03-20 | 2023-11-27 | デクセリアルズ株式会社 | 異方性導電接着剤、接続構造体、異方性導電接続方法、及び接続構造体の製造方法 |
JP6750197B2 (ja) * | 2015-07-13 | 2020-09-02 | デクセリアルズ株式会社 | 異方性導電フィルム及び接続構造体 |
JP6971245B2 (ja) * | 2016-09-20 | 2021-11-24 | 大阪有機化学工業株式会社 | (メタ)アクリル系導電性材料 |
CN109389903B (zh) * | 2017-08-04 | 2021-01-29 | 京东方科技集团股份有限公司 | 柔性基板及其加工方法、加工系统 |
TWI786193B (zh) * | 2017-12-19 | 2022-12-11 | 日商琳得科股份有限公司 | 重複彎曲裝置用黏著劑、黏著片、重複彎曲積層構件及重複彎曲裝置 |
JP7032367B2 (ja) * | 2019-10-25 | 2022-03-08 | デクセリアルズ株式会社 | 接続体の製造方法、異方性導電接合材料、及び接続体 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005264109A (ja) * | 2004-03-22 | 2005-09-29 | Hitachi Chem Co Ltd | フィルム状接着剤およびこれを用いた半導体装置の製造方法 |
WO2008065997A1 (fr) * | 2006-12-01 | 2008-06-05 | Hitachi Chemical Company, Ltd. | Adhésif et structure de liaison utilisant celui-ci |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07169792A (ja) * | 1993-12-14 | 1995-07-04 | Asahi Chem Ind Co Ltd | 半導体集積回路用フィルムキャリヤ |
JP3248149B2 (ja) * | 1995-11-21 | 2002-01-21 | シャープ株式会社 | 樹脂封止型半導体装置及びその製造方法 |
JP3477367B2 (ja) * | 1998-05-12 | 2003-12-10 | ソニーケミカル株式会社 | 異方導電性接着フィルム |
JP3507705B2 (ja) * | 1998-07-28 | 2004-03-15 | ソニーケミカル株式会社 | 絶縁性接着フィルム |
JP3714147B2 (ja) * | 1999-10-22 | 2005-11-09 | ソニーケミカル株式会社 | 低温硬化型異方性導電接続材料 |
KR100925361B1 (ko) * | 1999-10-22 | 2009-11-09 | 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 | 저온 경화형 이방성 도전 접속재료 |
JP2002184487A (ja) * | 2000-12-15 | 2002-06-28 | Sony Chem Corp | 異方性導電接着剤 |
TWI288170B (en) * | 2002-11-29 | 2007-10-11 | Hitachi Chemical Co Ltd | Adhesive composition, adhesive composition for circuit connection, connected circuit structure, and semiconductor devices |
JP4720073B2 (ja) * | 2003-08-07 | 2011-07-13 | 日立化成工業株式会社 | 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置 |
JP5191627B2 (ja) * | 2004-03-22 | 2013-05-08 | 日立化成株式会社 | フィルム状接着剤およびこれを用いた半導体装置の製造方法 |
JP2005320455A (ja) * | 2004-05-10 | 2005-11-17 | Hitachi Chem Co Ltd | 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置 |
CN101831246B (zh) * | 2004-06-09 | 2012-07-04 | 日立化成工业株式会社 | 粘结剂组合物、电路连接材料、电路部材的连接结构以及半导体装置 |
JP4732894B2 (ja) * | 2004-12-28 | 2011-07-27 | セイコーインスツル株式会社 | ボンディング方法及びボンディング装置 |
JP5013067B2 (ja) * | 2007-01-22 | 2012-08-29 | ソニーケミカル&インフォメーションデバイス株式会社 | 異方性導電フィルム |
JP2009074020A (ja) * | 2007-03-06 | 2009-04-09 | Tokai Rubber Ind Ltd | 異方性導電膜 |
-
2009
- 2009-09-29 KR KR1020117007216A patent/KR101683312B1/ko active IP Right Grant
- 2009-09-29 CN CN200980139585.2A patent/CN102171306B/zh active Active
- 2009-09-29 WO PCT/JP2009/066987 patent/WO2010038753A1/ja active Application Filing
- 2009-09-29 CN CN201410328402.4A patent/CN104059547B/zh active Active
- 2009-09-29 JP JP2009224181A patent/JP5728803B2/ja active Active
- 2009-09-30 TW TW102137474A patent/TWI548719B/zh not_active IP Right Cessation
- 2009-09-30 TW TW098133142A patent/TWI541318B/zh not_active IP Right Cessation
-
2011
- 2011-10-20 HK HK11111342.9A patent/HK1156963A1/zh unknown
-
2014
- 2014-11-12 JP JP2014229893A patent/JP5975088B2/ja active Active
-
2015
- 2015-03-17 HK HK15102693.9A patent/HK1202132A1/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005264109A (ja) * | 2004-03-22 | 2005-09-29 | Hitachi Chem Co Ltd | フィルム状接着剤およびこれを用いた半導体装置の製造方法 |
WO2008065997A1 (fr) * | 2006-12-01 | 2008-06-05 | Hitachi Chemical Company, Ltd. | Adhésif et structure de liaison utilisant celui-ci |
Also Published As
Publication number | Publication date |
---|---|
HK1202132A1 (zh) | 2015-09-18 |
CN104059547B (zh) | 2016-08-24 |
TW201406921A (zh) | 2014-02-16 |
CN102171306B (zh) | 2014-08-13 |
TWI541318B (zh) | 2016-07-11 |
JP2015083681A (ja) | 2015-04-30 |
JP5975088B2 (ja) | 2016-08-23 |
TWI548719B (zh) | 2016-09-11 |
JP5728803B2 (ja) | 2015-06-03 |
TW201012894A (en) | 2010-04-01 |
KR20110063500A (ko) | 2011-06-10 |
HK1156963A1 (zh) | 2012-06-22 |
CN102171306A (zh) | 2011-08-31 |
CN104059547A (zh) | 2014-09-24 |
JP2010106261A (ja) | 2010-05-13 |
WO2010038753A1 (ja) | 2010-04-08 |
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