JP5013067B2 - 異方性導電フィルム - Google Patents
異方性導電フィルム Download PDFInfo
- Publication number
- JP5013067B2 JP5013067B2 JP2007011592A JP2007011592A JP5013067B2 JP 5013067 B2 JP5013067 B2 JP 5013067B2 JP 2007011592 A JP2007011592 A JP 2007011592A JP 2007011592 A JP2007011592 A JP 2007011592A JP 5013067 B2 JP5013067 B2 JP 5013067B2
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- JP
- Japan
- Prior art keywords
- anisotropic conductive
- conductive film
- temperature
- minute
- life temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
- C08J2371/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08J2371/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08J2371/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2375/04—Polyurethanes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Description
表1の組成の成分を常法により均一に混合し、剥離ポリエステルフィルムに塗布し、70℃の熱風を5分間吹き掛けて乾燥して30μm厚の異方性導電フィルムを作成した。
Claims (9)
- 重合性アクリル系化合物、フィルム形成樹脂、導電性粒子及び重合開始剤を含有してなる異方性導電フィルムにおいて、該重合開始剤が、一分間半減期温度の異なる2種類の有機過酸化物を含有し、該2種類の有機過酸化物のうち、一分間半減期温度の高い有機過酸化物が分解により安息香酸又はその誘導体を発生するものであることを特徴とする異方性導電フィルム。
- 該2種類の有機過酸化物のうち、一分間半減期温度の低い有機過酸化物の1分間半減期温度が80℃以上120℃未満であり、一分間半減期温度の高い有機過酸化物の1分間半減期温度が120℃以上150℃以下である請求項1記載の異方性導電フィルム。
- 分解温度の異なる2種類の有機過酸化物の間の1分間半減期温度差が、10℃以上30℃以下である請求項1又は2記載の異方性導電フィルム。
- 該2種類の有機過酸化物のうち、一分間半減期温度の低い有機過酸化物と一分間半減期温度の高い有機過酸化物との重量比が10:1〜1:5である請求項1〜3のいずれかに記載の異方性導電フィルム。
- 該2種類の有機過酸化物のうち、一分間半減期温度の低い有機過酸化物がジラウロイルパーオキサイドであり、一分間半減期温度の高い有機過酸化物がジベンゾイルパーオキサイドである請求項4記載の異方性導電フィルム。
- 重合性アクリル系化合物が、リン酸エステル型アクリレートまたはフルオレン基を有するアクリレートである請求項1〜5のいずれかに記載の異方性導電フィルム。
- フィルム形成樹脂が、ポリエステル樹脂、ポリウレタン樹脂又はフェノキシ樹脂である請求項1〜6のいずれかに記載の異方性導電フィルム。
- 第1の配線基板の接続部と第2の配線基板の接続部との間を、請求項1〜7のいずれかに記載の異方性導電フィルムで異方性接続した接続構造体。
- 第1の配線基板の接続部と第2の配線基板の接続部との間に請求項1〜7のいずれかに記載の異方性導電フィルムを挟持させ、一分間半減期温度の低い有機過酸化物が分解しない第1の温度で仮貼りした後、一分間半減期温度の高い有機過酸化物が分解する第2の温度で熱圧着することを特徴とする接続構造体の製造方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007011592A JP5013067B2 (ja) | 2007-01-22 | 2007-01-22 | 異方性導電フィルム |
CN2008800028476A CN101589514B (zh) | 2007-01-22 | 2008-01-17 | 各向异性导电膜 |
PCT/JP2008/050483 WO2008090791A1 (ja) | 2007-01-22 | 2008-01-17 | 異方性導電フィルム |
KR1020097001050A KR101098205B1 (ko) | 2007-01-22 | 2008-01-17 | 이방성 도전 필름 |
US12/227,164 US8067514B2 (en) | 2007-01-22 | 2008-01-17 | Anisotropic conductive film |
TW097102311A TW200837858A (en) | 2007-01-22 | 2008-01-22 | Anisotropic electroconductive film |
HK10102236.8A HK1135803A1 (en) | 2007-01-22 | 2010-03-02 | Anisotropic electroconductive film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007011592A JP5013067B2 (ja) | 2007-01-22 | 2007-01-22 | 異方性導電フィルム |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008174687A JP2008174687A (ja) | 2008-07-31 |
JP2008174687A5 JP2008174687A5 (ja) | 2011-05-26 |
JP5013067B2 true JP5013067B2 (ja) | 2012-08-29 |
Family
ID=39644367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007011592A Active JP5013067B2 (ja) | 2007-01-22 | 2007-01-22 | 異方性導電フィルム |
Country Status (7)
Country | Link |
---|---|
US (1) | US8067514B2 (ja) |
JP (1) | JP5013067B2 (ja) |
KR (1) | KR101098205B1 (ja) |
CN (1) | CN101589514B (ja) |
HK (1) | HK1135803A1 (ja) |
TW (1) | TW200837858A (ja) |
WO (1) | WO2008090791A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006056485A1 (en) * | 2004-11-29 | 2006-06-01 | Fritz Nauer Ag. | Polyurethane foam |
KR100920611B1 (ko) | 2007-12-06 | 2009-10-08 | 제일모직주식회사 | 2-스텝 열경화형 이방 도전성 접착 조성물 및 이방 도전성접착 필름 |
JP5549103B2 (ja) * | 2008-07-11 | 2014-07-16 | デクセリアルズ株式会社 | 異方性導電フィルム |
CN102171306B (zh) * | 2008-09-30 | 2014-08-13 | 迪睿合电子材料有限公司 | 各向异性导电粘结剂及使用该粘结剂的连接结构体的制备方法 |
JP4590473B2 (ja) * | 2008-12-10 | 2010-12-01 | 大日本塗料株式会社 | 型内被覆組成物及び型内被覆成形体 |
JP2011040297A (ja) * | 2009-08-12 | 2011-02-24 | Iinuma Gauge Seisakusho:Kk | 基板と基板を接続する方法および装置 |
JP5398455B2 (ja) * | 2009-09-30 | 2014-01-29 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
KR20130073200A (ko) * | 2011-12-23 | 2013-07-03 | 삼성전기주식회사 | 스핀들 모터 |
JP6029922B2 (ja) * | 2012-10-05 | 2016-11-24 | デクセリアルズ株式会社 | 回路接続材料及びその製造方法、並びにそれを用いた実装体の製造方法 |
KR101535600B1 (ko) * | 2012-11-06 | 2015-07-09 | 제일모직주식회사 | 이방성 도전 필름 및 반도체 장치 |
JP6437323B2 (ja) * | 2014-02-14 | 2018-12-12 | デクセリアルズ株式会社 | 接続構造体の製造方法、及び回路接続材料 |
WO2019226641A1 (en) * | 2018-05-21 | 2019-11-28 | Kaneka Americas Holding, Inc. | Varnish of polyimide having high heat resistance and excellent mechanical strength |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10168412A (ja) * | 1996-12-10 | 1998-06-23 | Sumitomo Bakelite Co Ltd | 異方導電性接着剤 |
JPH10338860A (ja) * | 1997-06-06 | 1998-12-22 | Bridgestone Corp | 異方性導電フィルム |
JP2001031916A (ja) * | 1999-07-22 | 2001-02-06 | Bridgestone Corp | 異方性導電フィルム |
JP4351348B2 (ja) * | 2000-01-27 | 2009-10-28 | リンテック株式会社 | 保護層を有するicカードの製造方法 |
JP2002184487A (ja) * | 2000-12-15 | 2002-06-28 | Sony Chem Corp | 異方性導電接着剤 |
JP4158434B2 (ja) * | 2001-07-05 | 2008-10-01 | 株式会社ブリヂストン | 異方性導電フィルム |
DE10259451A1 (de) * | 2002-12-19 | 2004-07-08 | Tesa Ag | Haftklebeartikel mit wenigstens einer Schicht aus einer thermisch leitfähigen Haftklebemasse und Verfahren zu seiner Herstellung |
JP4444632B2 (ja) | 2003-11-11 | 2010-03-31 | リンテック株式会社 | 光学用フィルム |
EP1754762A4 (en) * | 2004-06-09 | 2009-07-22 | Hitachi Chemical Co Ltd | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING CONSTRUCTION FOR CIRCUIT ELEMENT AND SEMICONDUCTOR DEVICE |
JP4780647B2 (ja) * | 2004-12-02 | 2011-09-28 | 日東電工株式会社 | 光学フィルム用粘着剤、光学フィルム用粘着剤層およびその製造方法、粘着型光学フィルム、ならびに画像表示装置 |
JP2006199825A (ja) * | 2005-01-20 | 2006-08-03 | Soken Chem & Eng Co Ltd | 異方導電性接着テープおよび配線基板異方導電接着体 |
JP5524531B2 (ja) * | 2009-07-31 | 2014-06-18 | 北海製罐株式会社 | 溶接缶体 |
-
2007
- 2007-01-22 JP JP2007011592A patent/JP5013067B2/ja active Active
-
2008
- 2008-01-17 WO PCT/JP2008/050483 patent/WO2008090791A1/ja active Application Filing
- 2008-01-17 CN CN2008800028476A patent/CN101589514B/zh active Active
- 2008-01-17 KR KR1020097001050A patent/KR101098205B1/ko active IP Right Grant
- 2008-01-17 US US12/227,164 patent/US8067514B2/en active Active
- 2008-01-22 TW TW097102311A patent/TW200837858A/zh unknown
-
2010
- 2010-03-02 HK HK10102236.8A patent/HK1135803A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
CN101589514B (zh) | 2011-04-06 |
TWI347645B (ja) | 2011-08-21 |
US20090107625A1 (en) | 2009-04-30 |
CN101589514A (zh) | 2009-11-25 |
HK1135803A1 (en) | 2010-06-11 |
JP2008174687A (ja) | 2008-07-31 |
TW200837858A (en) | 2008-09-16 |
US8067514B2 (en) | 2011-11-29 |
KR101098205B1 (ko) | 2011-12-23 |
KR20090045196A (ko) | 2009-05-07 |
WO2008090791A1 (ja) | 2008-07-31 |
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