KR101631561B1 - 폴리(사이클로헥실에틸렌)-폴리아크릴레이트 블럭 코폴리머, 이의 제조 방법 및 이를 포함하는 제품 - Google Patents

폴리(사이클로헥실에틸렌)-폴리아크릴레이트 블럭 코폴리머, 이의 제조 방법 및 이를 포함하는 제품 Download PDF

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KR101631561B1
KR101631561B1 KR1020140067715A KR20140067715A KR101631561B1 KR 101631561 B1 KR101631561 B1 KR 101631561B1 KR 1020140067715 A KR1020140067715 A KR 1020140067715A KR 20140067715 A KR20140067715 A KR 20140067715A KR 101631561 B1 KR101631561 B1 KR 101631561B1
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block
block copolymer
monomer
pche
polymer
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KR20140143715A (ko
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필립 딘 허스테드
프랭크 스티븐 베이츠
마르크 앤드류 힐미어
져스틴 글렌 케네무어
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리전츠 어브 더 유니버시티 오브 미네소타
다우 글로벌 테크놀로지스 엘엘씨
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F297/00—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F293/00—Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule
    • C08F293/005—Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule using free radical "living" or "controlled" polymerisation, e.g. using a complexing agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/12—Monomers containing a branched unsaturated aliphatic radical or a ring substituted by an alkyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04—Acids; Metal salts or ammonium salts thereof
    • C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/22—Esters containing halogen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2438/00—Living radical polymerisation
    • C08F2438/01—Atom Transfer Radical Polymerization [ATRP] or reverse ATRP

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Graft Or Block Polymers (AREA)
KR1020140067715A 2013-06-07 2014-06-03 폴리(사이클로헥실에틸렌)-폴리아크릴레이트 블럭 코폴리머, 이의 제조 방법 및 이를 포함하는 제품 Expired - Fee Related KR101631561B1 (ko)

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Application Number Priority Date Filing Date Title
US13/912,797 2013-06-07
US13/912,797 US10202479B2 (en) 2013-06-07 2013-06-07 Poly(cyclohexylethylene)-polyacrylate block copolymers, methods of manufacture thereof and articles comprising the same

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KR20140143715A KR20140143715A (ko) 2014-12-17
KR101631561B1 true KR101631561B1 (ko) 2016-06-20

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US (1) US10202479B2 (enExample)
JP (1) JP6574083B2 (enExample)
KR (1) KR101631561B1 (enExample)
CN (1) CN104231192A (enExample)
TW (1) TWI525117B (enExample)

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KR20160060223A (ko) * 2014-11-19 2016-05-30 삼성디스플레이 주식회사 미세 패턴 형성 방법
KR102611583B1 (ko) 2015-03-18 2023-12-07 리껭테크노스 가부시키가이샤 성형체
CN107405897B (zh) 2015-03-18 2020-08-07 理研科技株式会社 粘合膜
CN106232344B (zh) 2015-03-18 2018-09-18 理研科技株式会社 硬涂层层合膜及其生产方法
KR101970093B1 (ko) 2015-03-18 2019-04-17 리껭테크노스 가부시키가이샤 방현성 하드 코트 적층 필름
CN107428143B (zh) 2015-03-18 2019-09-20 理研科技株式会社 硬涂层层叠膜
WO2016147776A1 (ja) 2015-03-18 2016-09-22 リケンテクノス株式会社 ハードコート積層フィルム
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JP6599789B2 (ja) * 2015-11-25 2019-10-30 リケンテクノス株式会社 ハードコート積層フィルム
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TWI745316B (zh) 2015-11-25 2021-11-11 日商理研科技股份有限公司 門體
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EP3808800B1 (en) 2016-09-14 2022-01-05 Riken Technos Corporation Hard coat laminated film
KR102182235B1 (ko) 2016-10-25 2020-11-24 애버리 데니슨 코포레이션 백본에 광개시제기를 갖는 블록 폴리머 및 접착제 조성물에서의 그것의 용도
JP7064313B2 (ja) 2016-11-25 2022-05-10 リケンテクノス株式会社 ハードコート積層フィルム
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JP2018154760A (ja) * 2017-03-17 2018-10-04 東芝メモリ株式会社 パターン形成材料及びパターン形成方法
JP7507088B2 (ja) 2017-12-19 2024-06-27 エイブリィ・デニソン・コーポレイション ペンダント官能基の後重合官能化
EP3801851A4 (en) 2018-06-01 2022-03-23 3M Innovative Properties Company POROUS MEMBRANES WITH TRIBLOCK COPOLYMERS
CN116284517B (zh) * 2022-09-08 2025-06-27 上海八亿时空先进材料有限公司 一种分子量窄分布且高透光性phs树脂及其合成方法与应用

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JP2014237817A (ja) 2014-12-18
JP6574083B2 (ja) 2019-09-11
CN104231192A (zh) 2014-12-24
TW201509970A (zh) 2015-03-16
KR20140143715A (ko) 2014-12-17
US10202479B2 (en) 2019-02-12
TWI525117B (zh) 2016-03-11

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