KR101590648B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR101590648B1
KR101590648B1 KR1020100095308A KR20100095308A KR101590648B1 KR 101590648 B1 KR101590648 B1 KR 101590648B1 KR 1020100095308 A KR1020100095308 A KR 1020100095308A KR 20100095308 A KR20100095308 A KR 20100095308A KR 101590648 B1 KR101590648 B1 KR 101590648B1
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KR
South Korea
Prior art keywords
processing block
transfer
processing
substrate
stage
Prior art date
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KR1020100095308A
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English (en)
Korean (ko)
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KR20110037865A (ko
Inventor
세이키 이시다
유키요시 사이토
Original Assignee
도쿄엘렉트론가부시키가이샤
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Publication of KR20110037865A publication Critical patent/KR20110037865A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/53365—Multiple station assembly apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/534—Multiple station assembly or disassembly apparatus

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020100095308A 2009-10-06 2010-09-30 기판 처리 장치 Active KR101590648B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009232769 2009-10-06
JPJP-P-2009-232769 2009-10-06
JPJP-P-2010-180921 2010-08-12
JP2010180921A JP5736687B2 (ja) 2009-10-06 2010-08-12 基板処理装置

Publications (2)

Publication Number Publication Date
KR20110037865A KR20110037865A (ko) 2011-04-13
KR101590648B1 true KR101590648B1 (ko) 2016-02-01

Family

ID=43822051

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100095308A Active KR101590648B1 (ko) 2009-10-06 2010-09-30 기판 처리 장치

Country Status (5)

Country Link
US (1) US8443513B2 (https=)
JP (1) JP5736687B2 (https=)
KR (1) KR101590648B1 (https=)
CN (1) CN102034727B (https=)
TW (1) TWI467686B (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5006122B2 (ja) * 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5160204B2 (ja) * 2007-11-30 2013-03-13 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5001828B2 (ja) 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
US8882431B2 (en) * 2008-10-07 2014-11-11 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer robot and substrate transfer system
KR101744372B1 (ko) * 2011-01-20 2017-06-07 도쿄엘렉트론가부시키가이샤 진공 처리 장치
US9153464B2 (en) * 2011-05-31 2015-10-06 Semes Co., Ltd. Substrate processing apparatus and substrate processing method
JP2013033963A (ja) * 2011-07-29 2013-02-14 Semes Co Ltd 基板処理装置及び基板処理方法
CN106373911B (zh) * 2011-09-22 2019-04-09 东京毅力科创株式会社 基板处理装置及基板处理方法
US9048271B2 (en) 2011-09-29 2015-06-02 Asm International N.V. Modular semiconductor processing system
JP6058999B2 (ja) * 2012-12-11 2017-01-11 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理方法
KR101527901B1 (ko) * 2013-10-10 2015-06-10 피에스케이 주식회사 기판 처리 장치 및 기판 반송 방법
US10236196B2 (en) * 2013-11-14 2019-03-19 Tokyo Electron Limited Substrate processing system
JP5977729B2 (ja) * 2013-11-14 2016-08-24 東京エレクトロン株式会社 基板処理システム
JP5977728B2 (ja) * 2013-11-14 2016-08-24 東京エレクトロン株式会社 基板処理システム
DK178352B1 (da) * 2015-02-27 2016-01-04 Intelligent Systems As Transport- og lagersystem til servicering af et antal behandlings og plejeområder på et hospital, samt fremgangsmåde til drift heraf.
JP6292155B2 (ja) * 2015-03-19 2018-03-14 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
KR102478317B1 (ko) * 2015-04-08 2022-12-16 도쿄엘렉트론가부시키가이샤 기판 처리 시스템
KR102168381B1 (ko) * 2018-06-07 2020-10-21 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
WO2020196506A1 (ja) * 2019-03-28 2020-10-01 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7718161B2 (ja) * 2021-08-17 2025-08-05 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006287178A (ja) 2005-03-11 2006-10-19 Tokyo Electron Ltd 塗布、現像装置
JP2007287887A (ja) 2006-04-14 2007-11-01 Tokyo Electron Ltd 塗布、現像装置、塗布、現像方法及び記憶媒体
JP2008258209A (ja) 2007-03-30 2008-10-23 Tokyo Electron Ltd 塗布、現像装置及びその方法並びに記憶媒体
JP2009194067A (ja) 2008-02-13 2009-08-27 Dainippon Screen Mfg Co Ltd 基板処理装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3442669B2 (ja) * 1998-10-20 2003-09-02 東京エレクトロン株式会社 基板処理装置
JP3462426B2 (ja) * 1999-05-24 2003-11-05 東京エレクトロン株式会社 基板処理装置
JP4381909B2 (ja) * 2004-07-06 2009-12-09 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4767783B2 (ja) 2006-07-26 2011-09-07 東京エレクトロン株式会社 液処理装置
TW200919117A (en) * 2007-08-28 2009-05-01 Tokyo Electron Ltd Coating-developing apparatus, coating-developing method and storage medium
JP5050018B2 (ja) * 2009-08-24 2012-10-17 東京エレクトロン株式会社 塗布現像装置及び塗布現像方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006287178A (ja) 2005-03-11 2006-10-19 Tokyo Electron Ltd 塗布、現像装置
JP2007287887A (ja) 2006-04-14 2007-11-01 Tokyo Electron Ltd 塗布、現像装置、塗布、現像方法及び記憶媒体
JP2008258209A (ja) 2007-03-30 2008-10-23 Tokyo Electron Ltd 塗布、現像装置及びその方法並びに記憶媒体
JP2009194067A (ja) 2008-02-13 2009-08-27 Dainippon Screen Mfg Co Ltd 基板処理装置

Also Published As

Publication number Publication date
US20110078898A1 (en) 2011-04-07
JP5736687B2 (ja) 2015-06-17
CN102034727A (zh) 2011-04-27
JP2011100970A (ja) 2011-05-19
US8443513B2 (en) 2013-05-21
TW201133682A (en) 2011-10-01
CN102034727B (zh) 2014-07-09
KR20110037865A (ko) 2011-04-13
TWI467686B (zh) 2015-01-01

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