JP5736687B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP5736687B2
JP5736687B2 JP2010180921A JP2010180921A JP5736687B2 JP 5736687 B2 JP5736687 B2 JP 5736687B2 JP 2010180921 A JP2010180921 A JP 2010180921A JP 2010180921 A JP2010180921 A JP 2010180921A JP 5736687 B2 JP5736687 B2 JP 5736687B2
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JP
Japan
Prior art keywords
substrate
processing block
processing
stage
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010180921A
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English (en)
Japanese (ja)
Other versions
JP2011100970A5 (https=
JP2011100970A (ja
Inventor
省貴 石田
省貴 石田
幸良 齊藤
幸良 齊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2010180921A priority Critical patent/JP5736687B2/ja
Priority to CN201010501399.3A priority patent/CN102034727B/zh
Priority to US12/895,576 priority patent/US8443513B2/en
Priority to KR1020100095308A priority patent/KR101590648B1/ko
Priority to TW99133727A priority patent/TWI467686B/zh
Publication of JP2011100970A publication Critical patent/JP2011100970A/ja
Publication of JP2011100970A5 publication Critical patent/JP2011100970A5/ja
Application granted granted Critical
Publication of JP5736687B2 publication Critical patent/JP5736687B2/ja
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/53365—Multiple station assembly apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/534—Multiple station assembly or disassembly apparatus

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2010180921A 2009-10-06 2010-08-12 基板処理装置 Active JP5736687B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010180921A JP5736687B2 (ja) 2009-10-06 2010-08-12 基板処理装置
CN201010501399.3A CN102034727B (zh) 2009-10-06 2010-09-29 基板处理装置
US12/895,576 US8443513B2 (en) 2009-10-06 2010-09-30 Substrate processing apparatus
KR1020100095308A KR101590648B1 (ko) 2009-10-06 2010-09-30 기판 처리 장치
TW99133727A TWI467686B (zh) 2009-10-06 2010-10-04 基板處理裝置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009232769 2009-10-06
JP2009232769 2009-10-06
JP2010180921A JP5736687B2 (ja) 2009-10-06 2010-08-12 基板処理装置

Publications (3)

Publication Number Publication Date
JP2011100970A JP2011100970A (ja) 2011-05-19
JP2011100970A5 JP2011100970A5 (https=) 2013-03-14
JP5736687B2 true JP5736687B2 (ja) 2015-06-17

Family

ID=43822051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010180921A Active JP5736687B2 (ja) 2009-10-06 2010-08-12 基板処理装置

Country Status (5)

Country Link
US (1) US8443513B2 (https=)
JP (1) JP5736687B2 (https=)
KR (1) KR101590648B1 (https=)
CN (1) CN102034727B (https=)
TW (1) TWI467686B (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5006122B2 (ja) * 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5160204B2 (ja) * 2007-11-30 2013-03-13 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5001828B2 (ja) 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
US8882431B2 (en) * 2008-10-07 2014-11-11 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer robot and substrate transfer system
KR101744372B1 (ko) * 2011-01-20 2017-06-07 도쿄엘렉트론가부시키가이샤 진공 처리 장치
US9153464B2 (en) * 2011-05-31 2015-10-06 Semes Co., Ltd. Substrate processing apparatus and substrate processing method
JP2013033963A (ja) * 2011-07-29 2013-02-14 Semes Co Ltd 基板処理装置及び基板処理方法
CN106373911B (zh) * 2011-09-22 2019-04-09 东京毅力科创株式会社 基板处理装置及基板处理方法
US9048271B2 (en) 2011-09-29 2015-06-02 Asm International N.V. Modular semiconductor processing system
JP6058999B2 (ja) * 2012-12-11 2017-01-11 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理方法
KR101527901B1 (ko) * 2013-10-10 2015-06-10 피에스케이 주식회사 기판 처리 장치 및 기판 반송 방법
US10236196B2 (en) * 2013-11-14 2019-03-19 Tokyo Electron Limited Substrate processing system
JP5977729B2 (ja) * 2013-11-14 2016-08-24 東京エレクトロン株式会社 基板処理システム
JP5977728B2 (ja) * 2013-11-14 2016-08-24 東京エレクトロン株式会社 基板処理システム
DK178352B1 (da) * 2015-02-27 2016-01-04 Intelligent Systems As Transport- og lagersystem til servicering af et antal behandlings og plejeområder på et hospital, samt fremgangsmåde til drift heraf.
JP6292155B2 (ja) * 2015-03-19 2018-03-14 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
KR102478317B1 (ko) * 2015-04-08 2022-12-16 도쿄엘렉트론가부시키가이샤 기판 처리 시스템
KR102168381B1 (ko) * 2018-06-07 2020-10-21 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
WO2020196506A1 (ja) * 2019-03-28 2020-10-01 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7718161B2 (ja) * 2021-08-17 2025-08-05 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3442669B2 (ja) * 1998-10-20 2003-09-02 東京エレクトロン株式会社 基板処理装置
JP3462426B2 (ja) * 1999-05-24 2003-11-05 東京エレクトロン株式会社 基板処理装置
JP4381909B2 (ja) * 2004-07-06 2009-12-09 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4685584B2 (ja) * 2005-03-11 2011-05-18 東京エレクトロン株式会社 塗布、現像装置
JP4816217B2 (ja) * 2006-04-14 2011-11-16 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP4767783B2 (ja) 2006-07-26 2011-09-07 東京エレクトロン株式会社 液処理装置
JP4687682B2 (ja) * 2007-03-30 2011-05-25 東京エレクトロン株式会社 塗布、現像装置及びその方法並びに記憶媒体
TW200919117A (en) * 2007-08-28 2009-05-01 Tokyo Electron Ltd Coating-developing apparatus, coating-developing method and storage medium
JP5362232B2 (ja) * 2008-02-13 2013-12-11 大日本スクリーン製造株式会社 基板処理装置
JP5050018B2 (ja) * 2009-08-24 2012-10-17 東京エレクトロン株式会社 塗布現像装置及び塗布現像方法

Also Published As

Publication number Publication date
US20110078898A1 (en) 2011-04-07
CN102034727A (zh) 2011-04-27
JP2011100970A (ja) 2011-05-19
US8443513B2 (en) 2013-05-21
TW201133682A (en) 2011-10-01
CN102034727B (zh) 2014-07-09
KR20110037865A (ko) 2011-04-13
TWI467686B (zh) 2015-01-01
KR101590648B1 (ko) 2016-02-01

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