KR101458110B1 - 접착물 도포장치 및 접착물 도포방법 - Google Patents

접착물 도포장치 및 접착물 도포방법 Download PDF

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Publication number
KR101458110B1
KR101458110B1 KR1020127009736A KR20127009736A KR101458110B1 KR 101458110 B1 KR101458110 B1 KR 101458110B1 KR 1020127009736 A KR1020127009736 A KR 1020127009736A KR 20127009736 A KR20127009736 A KR 20127009736A KR 101458110 B1 KR101458110 B1 KR 101458110B1
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KR
South Korea
Prior art keywords
nozzle
adhesive
water injection
photoresist
adhesive water
Prior art date
Application number
KR1020127009736A
Other languages
English (en)
Korean (ko)
Other versions
KR20120089855A (ko
Inventor
웨이펑 저우
지안 구오
싱 밍
Original Assignee
베이징 비오이 옵토일렉트로닉스 테크놀로지 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 베이징 비오이 옵토일렉트로닉스 테크놀로지 컴퍼니 리미티드 filed Critical 베이징 비오이 옵토일렉트로닉스 테크놀로지 컴퍼니 리미티드
Publication of KR20120089855A publication Critical patent/KR20120089855A/ko
Application granted granted Critical
Publication of KR101458110B1 publication Critical patent/KR101458110B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/06—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying two different liquids or other fluent materials, or the same liquid or other fluent material twice, to the same side of the work
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020127009736A 2010-04-19 2011-04-19 접착물 도포장치 및 접착물 도포방법 KR101458110B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201010154127.0 2010-04-19
CN2010101541270A CN102221784B (zh) 2010-04-19 2010-04-19 胶涂覆设备及胶涂覆方法
PCT/CN2011/073010 WO2011131121A1 (fr) 2010-04-19 2011-04-19 Dispositif et procédé de gommage

Publications (2)

Publication Number Publication Date
KR20120089855A KR20120089855A (ko) 2012-08-14
KR101458110B1 true KR101458110B1 (ko) 2014-11-04

Family

ID=44778369

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127009736A KR101458110B1 (ko) 2010-04-19 2011-04-19 접착물 도포장치 및 접착물 도포방법

Country Status (6)

Country Link
US (1) US20120201964A1 (fr)
EP (1) EP2472331B1 (fr)
JP (1) JP5930477B2 (fr)
KR (1) KR101458110B1 (fr)
CN (1) CN102221784B (fr)
WO (1) WO2011131121A1 (fr)

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JP6049560B2 (ja) * 2013-07-09 2016-12-21 東京エレクトロン株式会社 塗布装置およびスリットノズル
US20150182992A1 (en) 2013-12-31 2015-07-02 Johnson & Johnson Consumer Companies, Inc. Process for forming a multilayered shaped film product
JP6517216B2 (ja) 2013-12-31 2019-05-22 ジョンソン・アンド・ジョンソン・コンシューマー・インコーポレイテッド 多層賦形フィルム製品を形成するための単一パス方法
WO2015103033A1 (fr) 2013-12-31 2015-07-09 Johnson & Johnson Consumer Companies, Inc. Procédé de formation d'un produit de type pellicule mise en forme
CN104391430A (zh) * 2014-12-15 2015-03-04 京东方科技集团股份有限公司 涂胶设备和涂胶方法
CN104437979B (zh) * 2014-12-19 2017-07-25 深圳市轴心自控技术有限公司 双组份涂覆头及使用该双组份涂覆头的双组份涂胶系统
CN104801463B (zh) * 2015-05-05 2017-05-31 深圳市华星光电技术有限公司 点胶装置及点胶方法
CN104808446B (zh) 2015-05-07 2021-02-02 合肥京东方光电科技有限公司 一种涂布机
US11577513B2 (en) * 2020-10-06 2023-02-14 Funai Electric Co., Ltd. Photoimageable nozzle member for reduced fluid cross-contamination and method therefor
USD1000493S1 (en) * 2021-05-06 2023-10-03 Alexander Binzel Schweisstechnik Gmbh & Co. Kg Nozzle for welding torch
CN115903390B (zh) * 2022-11-23 2023-12-08 上海图双精密装备有限公司 一种上胶机构以及涂胶设备

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KR20060048152A (ko) * 2004-06-18 2006-05-18 마츠시타 덴끼 산교 가부시키가이샤 약액도포장치 및 약액도포방법

Also Published As

Publication number Publication date
KR20120089855A (ko) 2012-08-14
EP2472331B1 (fr) 2018-06-06
US20120201964A1 (en) 2012-08-09
JP5930477B2 (ja) 2016-06-08
CN102221784A (zh) 2011-10-19
EP2472331A4 (fr) 2014-05-28
WO2011131121A1 (fr) 2011-10-27
EP2472331A1 (fr) 2012-07-04
CN102221784B (zh) 2013-07-24
JP2013530812A (ja) 2013-08-01

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