CN102221784A - 胶涂覆设备及胶涂覆方法 - Google Patents
胶涂覆设备及胶涂覆方法 Download PDFInfo
- Publication number
- CN102221784A CN102221784A CN2010101541270A CN201010154127A CN102221784A CN 102221784 A CN102221784 A CN 102221784A CN 2010101541270 A CN2010101541270 A CN 2010101541270A CN 201010154127 A CN201010154127 A CN 201010154127A CN 102221784 A CN102221784 A CN 102221784A
- Authority
- CN
- China
- Prior art keywords
- nozzle
- glue
- photoresist
- binder removal
- removal spray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/06—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying two different liquids or other fluent materials, or the same liquid or other fluent material twice, to the same side of the work
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Liquid Crystal (AREA)
Abstract
Description
Claims (9)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010101541270A CN102221784B (zh) | 2010-04-19 | 2010-04-19 | 胶涂覆设备及胶涂覆方法 |
EP11771574.8A EP2472331B1 (en) | 2010-04-19 | 2011-04-19 | Gumming device and method |
JP2013505322A JP5930477B2 (ja) | 2010-04-19 | 2011-04-19 | 接着剤塗布設備及び接着剤塗布方法 |
KR1020127009736A KR101458110B1 (ko) | 2010-04-19 | 2011-04-19 | 접착물 도포장치 및 접착물 도포방법 |
PCT/CN2011/073010 WO2011131121A1 (zh) | 2010-04-19 | 2011-04-19 | 胶涂覆设备及胶涂覆方法 |
US13/499,951 US20120201964A1 (en) | 2010-04-19 | 2011-04-19 | Resist coating device and method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010101541270A CN102221784B (zh) | 2010-04-19 | 2010-04-19 | 胶涂覆设备及胶涂覆方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102221784A true CN102221784A (zh) | 2011-10-19 |
CN102221784B CN102221784B (zh) | 2013-07-24 |
Family
ID=44778369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010101541270A Active CN102221784B (zh) | 2010-04-19 | 2010-04-19 | 胶涂覆设备及胶涂覆方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20120201964A1 (zh) |
EP (1) | EP2472331B1 (zh) |
JP (1) | JP5930477B2 (zh) |
KR (1) | KR101458110B1 (zh) |
CN (1) | CN102221784B (zh) |
WO (1) | WO2011131121A1 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104391430A (zh) * | 2014-12-15 | 2015-03-04 | 京东方科技集团股份有限公司 | 涂胶设备和涂胶方法 |
CN104437979A (zh) * | 2014-12-19 | 2015-03-25 | 深圳市轴心自控技术有限公司 | 双组份涂覆头及使用该双组份涂覆头的双组份涂胶系统 |
CN104801463A (zh) * | 2015-05-05 | 2015-07-29 | 深圳市华星光电技术有限公司 | 点胶装置及点胶方法 |
CN104808446A (zh) * | 2015-05-07 | 2015-07-29 | 合肥京东方光电科技有限公司 | 一种涂布机 |
CN114379233A (zh) * | 2020-10-06 | 2022-04-22 | 船井电机株式会社 | 喷嘴板、流体喷射头、及制造流体喷射头的方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6049560B2 (ja) * | 2013-07-09 | 2016-12-21 | 東京エレクトロン株式会社 | 塗布装置およびスリットノズル |
BR112016015347B8 (pt) * | 2013-12-31 | 2022-07-19 | Johnson & Johnson Consumer Inc | Processo para a formação de um produto de filme dotado de um formato em camadas múltiplas, produto de filme dotado de um formato em camadas múltiplas e aparelho para formar um produto de filme dotado de um formato em camadas múltiplas |
EP3091969B1 (en) | 2013-12-31 | 2024-01-24 | Johnson & Johnson Consumer Inc. | Process for forming a shaped film product |
US20150182992A1 (en) | 2013-12-31 | 2015-07-02 | Johnson & Johnson Consumer Companies, Inc. | Process for forming a multilayered shaped film product |
USD1000493S1 (en) * | 2021-05-06 | 2023-10-03 | Alexander Binzel Schweisstechnik Gmbh & Co. Kg | Nozzle for welding torch |
CN115903390B (zh) * | 2022-11-23 | 2023-12-08 | 上海图双精密装备有限公司 | 一种上胶机构以及涂胶设备 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000189877A (ja) * | 1998-12-25 | 2000-07-11 | Canon Inc | スリットダイコ―タ口金およびそれを用いた塗膜製造方法 |
US20020110640A1 (en) * | 1996-08-30 | 2002-08-15 | Kiyohisa Tateyama | Coating method and apparatus for semiconductor process |
CN1710489A (zh) * | 2004-06-18 | 2005-12-21 | 松下电器产业株式会社 | 药液涂敷装置及药液涂敷方法 |
CN1824392A (zh) * | 2005-02-22 | 2006-08-30 | 展茂光电股份有限公司 | 一种细缝式涂布装置 |
CN1963671A (zh) * | 2006-11-17 | 2007-05-16 | 京东方科技集团股份有限公司 | 光刻胶涂覆设备及光刻胶涂覆方法 |
CN101142032A (zh) * | 2005-03-14 | 2008-03-12 | 沃依特专利有限责任公司 | 涂布设备 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4938994A (en) * | 1987-11-23 | 1990-07-03 | Epicor Technology, Inc. | Method and apparatus for patch coating printed circuit boards |
US5136970A (en) * | 1989-10-06 | 1992-08-11 | Fuji Photo Film Co., Ltd. | Coating apparatus with vertically movable solution receiver |
JP3429849B2 (ja) * | 1994-05-20 | 2003-07-28 | ワイエイシイ株式会社 | レジスト塗布装置 |
US5700325A (en) * | 1994-08-03 | 1997-12-23 | Matsushita Electric Industrial Co., Ltd. | Coating device and a method of coating |
JPH0977099A (ja) * | 1995-09-18 | 1997-03-25 | Cemedine Co Ltd | 2液型接着剤用吐出ノズル |
JP2934186B2 (ja) * | 1996-04-12 | 1999-08-16 | 花王株式会社 | 塗布方法 |
JP2000102759A (ja) * | 1998-07-31 | 2000-04-11 | Toray Ind Inc | 塗布方法および塗布装置並びにプラズマディスプレイおよびディスプレイ用部材の製造方法および製造装置 |
CN101824392B (zh) * | 2000-01-21 | 2014-09-24 | 味之素株式会社 | 生产l-赖氨酸的方法 |
JP4529060B2 (ja) * | 2000-10-20 | 2010-08-25 | ノードソン株式会社 | シート状等の被塗物に液体を塗布する装置及び方法 |
JP3823820B2 (ja) * | 2001-08-24 | 2006-09-20 | 三菱マテリアル株式会社 | 塗布装置 |
US6796054B2 (en) * | 2002-03-12 | 2004-09-28 | Tokyo Electron Limited | Low-pressure dryer and low-pressure drying method |
JP4304954B2 (ja) * | 2002-10-15 | 2009-07-29 | パナソニック株式会社 | 薄膜形成装置、薄膜形成方法および表示パネルの製造方法 |
SE0300454D0 (sv) * | 2003-02-19 | 2003-02-19 | Aamic Ab | Nozzles for electrospray ionization and methods of fabricating them |
JP4071183B2 (ja) * | 2003-09-12 | 2008-04-02 | 東京エレクトロン株式会社 | 塗布方法及び塗布装置 |
JP2005087884A (ja) * | 2003-09-17 | 2005-04-07 | Fuji Photo Film Co Ltd | 塗布方法 |
JP2005161153A (ja) * | 2003-12-01 | 2005-06-23 | Voith Paper Patent Gmbh | ダブル塗工装置 |
JP2006032905A (ja) * | 2004-06-18 | 2006-02-02 | Matsushita Electric Ind Co Ltd | 薬液塗布装置及び薬液塗布方法 |
JP4760265B2 (ja) * | 2005-09-28 | 2011-08-31 | パナソニック株式会社 | 塗布方法 |
JP2007240859A (ja) * | 2006-03-08 | 2007-09-20 | Toppan Printing Co Ltd | 塗布装置及び塗布方法 |
JP4884871B2 (ja) * | 2006-07-27 | 2012-02-29 | 東京エレクトロン株式会社 | 塗布方法及び塗布装置 |
JP2008073647A (ja) * | 2006-09-22 | 2008-04-03 | Fujifilm Corp | 液体吐出装置及びレジストパターン形成方法 |
JP4318714B2 (ja) * | 2006-11-28 | 2009-08-26 | 東京エレクトロン株式会社 | 塗布装置 |
JP2010040323A (ja) * | 2008-08-05 | 2010-02-18 | Panasonic Corp | 液滴吐出装置および液滴吐出方法ならびに有機el素子の製造方法 |
EP2432641A4 (en) * | 2009-05-17 | 2012-10-10 | Hewlett Packard Development Co | FLUID EXHAUST PRESSURE HEAD WITH MIXING LOCK |
JP5495690B2 (ja) * | 2009-09-18 | 2014-05-21 | 株式会社ニトムズ | 清掃用粘着テープロールおよび粘着テープの製造装置並びにその製造方法 |
-
2010
- 2010-04-19 CN CN2010101541270A patent/CN102221784B/zh active Active
-
2011
- 2011-04-19 EP EP11771574.8A patent/EP2472331B1/en not_active Not-in-force
- 2011-04-19 KR KR1020127009736A patent/KR101458110B1/ko active IP Right Grant
- 2011-04-19 JP JP2013505322A patent/JP5930477B2/ja not_active Expired - Fee Related
- 2011-04-19 WO PCT/CN2011/073010 patent/WO2011131121A1/zh active Application Filing
- 2011-04-19 US US13/499,951 patent/US20120201964A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020110640A1 (en) * | 1996-08-30 | 2002-08-15 | Kiyohisa Tateyama | Coating method and apparatus for semiconductor process |
JP2000189877A (ja) * | 1998-12-25 | 2000-07-11 | Canon Inc | スリットダイコ―タ口金およびそれを用いた塗膜製造方法 |
CN1710489A (zh) * | 2004-06-18 | 2005-12-21 | 松下电器产业株式会社 | 药液涂敷装置及药液涂敷方法 |
CN1824392A (zh) * | 2005-02-22 | 2006-08-30 | 展茂光电股份有限公司 | 一种细缝式涂布装置 |
CN101142032A (zh) * | 2005-03-14 | 2008-03-12 | 沃依特专利有限责任公司 | 涂布设备 |
CN1963671A (zh) * | 2006-11-17 | 2007-05-16 | 京东方科技集团股份有限公司 | 光刻胶涂覆设备及光刻胶涂覆方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104391430A (zh) * | 2014-12-15 | 2015-03-04 | 京东方科技集团股份有限公司 | 涂胶设备和涂胶方法 |
CN104437979A (zh) * | 2014-12-19 | 2015-03-25 | 深圳市轴心自控技术有限公司 | 双组份涂覆头及使用该双组份涂覆头的双组份涂胶系统 |
CN104437979B (zh) * | 2014-12-19 | 2017-07-25 | 深圳市轴心自控技术有限公司 | 双组份涂覆头及使用该双组份涂覆头的双组份涂胶系统 |
CN104801463A (zh) * | 2015-05-05 | 2015-07-29 | 深圳市华星光电技术有限公司 | 点胶装置及点胶方法 |
CN104808446A (zh) * | 2015-05-07 | 2015-07-29 | 合肥京东方光电科技有限公司 | 一种涂布机 |
US10207284B2 (en) | 2015-05-07 | 2019-02-19 | Boe Technology Group Co., Ltd. | Coating machine for applying coating agent |
CN114379233A (zh) * | 2020-10-06 | 2022-04-22 | 船井电机株式会社 | 喷嘴板、流体喷射头、及制造流体喷射头的方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101458110B1 (ko) | 2014-11-04 |
US20120201964A1 (en) | 2012-08-09 |
JP5930477B2 (ja) | 2016-06-08 |
EP2472331A4 (en) | 2014-05-28 |
JP2013530812A (ja) | 2013-08-01 |
EP2472331A1 (en) | 2012-07-04 |
CN102221784B (zh) | 2013-07-24 |
KR20120089855A (ko) | 2012-08-14 |
EP2472331B1 (en) | 2018-06-06 |
WO2011131121A1 (zh) | 2011-10-27 |
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ASS | Succession or assignment of patent right |
Owner name: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY Effective date: 20150713 Owner name: JINGDONGFANG SCIENCE AND TECHNOLOGY GROUP CO., LTD Free format text: FORMER OWNER: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20150713 |
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Effective date of registration: 20150713 Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee after: BOE Technology Group Co., Ltd. Patentee after: Beijing BOE Photoelectricity Science & Technology Co., Ltd. Address before: 100176 Beijing economic and Technological Development Zone, West Central Road, No. 8 Patentee before: Beijing BOE Photoelectricity Science & Technology Co., Ltd. |