KR101455400B1 - 고체 촬상 장치, 촬상 기기, 전자 기기 - Google Patents

고체 촬상 장치, 촬상 기기, 전자 기기 Download PDF

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Publication number
KR101455400B1
KR101455400B1 KR1020080045364A KR20080045364A KR101455400B1 KR 101455400 B1 KR101455400 B1 KR 101455400B1 KR 1020080045364 A KR1020080045364 A KR 1020080045364A KR 20080045364 A KR20080045364 A KR 20080045364A KR 101455400 B1 KR101455400 B1 KR 101455400B1
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unit
signal
complementary
section
pixel
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Korean (ko)
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KR20080101757A (ko
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다다유끼 다우라
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소니 주식회사
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/616—Noise processing, e.g. detecting, correcting, reducing or removing noise involving a correlated sampling function, e.g. correlated double sampling [CDS] or triple sampling
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
KR1020080045364A 2007-05-18 2008-05-16 고체 촬상 장치, 촬상 기기, 전자 기기 Expired - Fee Related KR101455400B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00132787 2007-05-18
JP2007132787A JP5067011B2 (ja) 2007-05-18 2007-05-18 固体撮像装置、撮像装置、電子機器

Publications (2)

Publication Number Publication Date
KR20080101757A KR20080101757A (ko) 2008-11-21
KR101455400B1 true KR101455400B1 (ko) 2014-10-27

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KR1020080045364A Expired - Fee Related KR101455400B1 (ko) 2007-05-18 2008-05-16 고체 촬상 장치, 촬상 기기, 전자 기기

Country Status (5)

Country Link
US (1) US8072522B2 (enExample)
JP (1) JP5067011B2 (enExample)
KR (1) KR101455400B1 (enExample)
CN (2) CN101984653B (enExample)
TW (1) TWI381725B (enExample)

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JP5632374B2 (ja) * 2009-07-30 2014-11-26 浜松ホトニクス株式会社 固体撮像装置
JP5402373B2 (ja) * 2009-08-07 2014-01-29 ソニー株式会社 固体撮像装置、固体撮像装置の駆動方法および撮像装置
KR20110105153A (ko) * 2010-03-18 2011-09-26 삼성전자주식회사 플립플롭 회로 및 스캔 플립 플롭 회로
JP5814613B2 (ja) 2010-05-21 2015-11-17 キヤノン株式会社 固体撮像装置
JP2012049597A (ja) * 2010-08-24 2012-03-08 Nikon Corp 撮像装置
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JP5784377B2 (ja) * 2011-06-14 2015-09-24 オリンパス株式会社 Ａｄ変換回路および撮像装置
JP2013162148A (ja) * 2012-02-01 2013-08-19 Sony Corp 個体撮像装置および駆動方法、並びに電子機器
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KR102275523B1 (ko) * 2013-12-05 2021-07-09 삼성전자주식회사 데이터 전송 회로, 이를 포함하는 이미지 센서
US9521345B2 (en) 2013-12-05 2016-12-13 Samsung Electronics Co., Ltd. Data transmission circuit, image sensor including the same
CN104866803B (zh) * 2014-02-20 2018-06-05 上海思立微电子科技有限公司 一种指纹信息检测电路
JP6351105B2 (ja) * 2014-09-29 2018-07-04 オリンパス株式会社 画像処理装置、撮像装置および画像処理方法
TWI526946B (zh) * 2014-12-17 2016-03-21 義隆電子股份有限公司 指紋感測裝置
JP6578658B2 (ja) * 2015-01-05 2019-09-25 株式会社リコー 光電変換装置及び画像生成装置並びに光電変換装置の出力の補正方法
US9716510B2 (en) * 2015-05-12 2017-07-25 Teledyne Scientific & Imaging, Llc Comparator circuits with constant input capacitance for a column-parallel single-slope ADC
JPWO2017030007A1 (ja) * 2015-08-20 2018-05-31 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置、固体撮像装置の駆動方法、及び、電子機器
US10334198B2 (en) 2015-12-22 2019-06-25 Sony Corporation Image sensor, electronic device, control device, control method, and program
US20190110009A1 (en) * 2016-03-30 2019-04-11 Nikon Corporation Image sensor, image-capturing apparatus, and semiconductor memory
CN110463189B (zh) * 2017-03-29 2022-11-01 株式会社尼康 摄像元件及电子相机
KR102324541B1 (ko) * 2017-06-09 2021-11-10 삼성전자주식회사 신호 전송 회로 및 이를 포함하는 이미지 센서
JP7113368B2 (ja) 2017-07-03 2022-08-05 パナソニックＩｐマネジメント株式会社 撮像装置及びカメラシステム
CN108134595B (zh) * 2018-01-09 2021-08-27 京东方科技集团股份有限公司 一种噪声检测电路、噪声检测方法及纹路识别装置
CN112119500B (zh) * 2018-05-21 2025-06-17 索尼公司 固态摄像元件及其制造方法
JP7336199B2 (ja) * 2018-06-25 2023-08-31 キヤノン株式会社 撮像装置、撮像システム及び信号処理装置
JP7336217B2 (ja) * 2019-03-12 2023-08-31 キヤノン株式会社 情報処理装置、撮像素子、撮像装置、及び情報処理方法
WO2021145256A1 (ja) * 2020-01-16 2021-07-22 ソニーセミコンダクタソリューションズ株式会社 撮像素子、測距装置および電子機器
CN111277118A (zh) * 2020-03-26 2020-06-12 杰华特微电子（杭州）有限公司 三电平降压电路及其控制方法和控制电路
JP7718952B2 (ja) * 2021-01-22 2025-08-05 キヤノン株式会社 信号処理装置
CN115708321B (zh) * 2021-08-18 2025-07-11 中国科学院微电子研究所 一种电流调制列级单斜模数转换器
WO2023150949A1 (en) * 2022-02-10 2023-08-17 Huawei Technologies Co., Ltd. High speed, low power pixel bias circuit
US12223761B2 (en) * 2022-09-05 2025-02-11 Himax Technologies Limited Display device and fingerprint sensing circuit
CN117199092B (zh) * 2023-08-21 2024-04-16 中山大学 一种宽摆幅像素结构、图像传感器

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Also Published As

Publication number Publication date
KR20080101757A (ko) 2008-11-21
JP2008288953A (ja) 2008-11-27
US8072522B2 (en) 2011-12-06
US20080284885A1 (en) 2008-11-20
TW200906184A (en) 2009-02-01
CN101309345B (zh) 2011-01-12
CN101984653A (zh) 2011-03-09
TWI381725B (zh) 2013-01-01
CN101984653B (zh) 2013-04-10
JP5067011B2 (ja) 2012-11-07
CN101309345A (zh) 2008-11-19

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