KR101454883B1 - 적층된 집적회로 패키지 인 패키지 시스템 - Google Patents

적층된 집적회로 패키지 인 패키지 시스템 Download PDF

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Publication number
KR101454883B1
KR101454883B1 KR1020070127171A KR20070127171A KR101454883B1 KR 101454883 B1 KR101454883 B1 KR 101454883B1 KR 1020070127171 A KR1020070127171 A KR 1020070127171A KR 20070127171 A KR20070127171 A KR 20070127171A KR 101454883 B1 KR101454883 B1 KR 101454883B1
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South Korea
Prior art keywords
package
integrated circuit
rti
opening
internal wiring
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KR1020070127171A
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English (en)
Korean (ko)
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KR20080053233A (ko
Inventor
장기원
하종우
주종욱
Original Assignee
스태츠 칩팩 엘티디
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Assigned to 주식회사 한국씨티은행 reassignment 주식회사 한국씨티은행 근질권설정등록 Assignors: 스태츠 칩팩 피티이. 엘티디.
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/24—Configurations of stacked chips at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/288—Configurations of stacked chips characterised by arrangements for thermal management of the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020070127171A 2006-12-09 2007-12-07 적층된 집적회로 패키지 인 패키지 시스템 Active KR101454883B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/608,827 US7772683B2 (en) 2006-12-09 2006-12-09 Stacked integrated circuit package-in-package system
US11/608,827 2006-12-09

Publications (2)

Publication Number Publication Date
KR20080053233A KR20080053233A (ko) 2008-06-12
KR101454883B1 true KR101454883B1 (ko) 2014-10-28

Family

ID=39497000

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070127171A Active KR101454883B1 (ko) 2006-12-09 2007-12-07 적층된 집적회로 패키지 인 패키지 시스템

Country Status (4)

Country Link
US (1) US7772683B2 (https=)
JP (2) JP4947656B2 (https=)
KR (1) KR101454883B1 (https=)
TW (1) TWI345298B (https=)

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US7518224B2 (en) * 2005-05-16 2009-04-14 Stats Chippac Ltd. Offset integrated circuit package-on-package stacking system
US7622333B2 (en) * 2006-08-04 2009-11-24 Stats Chippac Ltd. Integrated circuit package system for package stacking and manufacturing method thereof
US7645638B2 (en) * 2006-08-04 2010-01-12 Stats Chippac Ltd. Stackable multi-chip package system with support structure
US8432026B2 (en) * 2006-08-04 2013-04-30 Stats Chippac Ltd. Stackable multi-chip package system
US8642383B2 (en) * 2006-09-28 2014-02-04 Stats Chippac Ltd. Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires
US7759783B2 (en) * 2006-12-07 2010-07-20 Stats Chippac Ltd. Integrated circuit package system employing thin profile techniques
US7635913B2 (en) * 2006-12-09 2009-12-22 Stats Chippac Ltd. Stacked integrated circuit package-in-package system
US8304874B2 (en) * 2006-12-09 2012-11-06 Stats Chippac Ltd. Stackable integrated circuit package system
US7772683B2 (en) * 2006-12-09 2010-08-10 Stats Chippac Ltd. Stacked integrated circuit package-in-package system
US8163600B2 (en) * 2006-12-28 2012-04-24 Stats Chippac Ltd. Bridge stack integrated circuit package-on-package system
US9466545B1 (en) 2007-02-21 2016-10-11 Amkor Technology, Inc. Semiconductor package in package
US7683469B2 (en) * 2008-05-30 2010-03-23 Stats Chippac Ltd. Package-on-package system with heat spreader
US8310061B2 (en) * 2008-12-17 2012-11-13 Qualcomm Incorporated Stacked die parallel plate capacitor
US7785925B2 (en) * 2008-12-19 2010-08-31 Stats Chippac Ltd. Integrated circuit packaging system with package stacking and method of manufacture thereof
KR101686553B1 (ko) 2010-07-12 2016-12-14 삼성전자 주식회사 반도체 패키지 및 패키지 온 패키지
US8553420B2 (en) 2010-10-19 2013-10-08 Tessera, Inc. Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
KR101118711B1 (ko) 2010-12-17 2012-03-12 테세라, 인코포레이티드 중앙 콘택을 구비한 적층형 마이크로전자 조립체
US8928153B2 (en) 2011-04-21 2015-01-06 Tessera, Inc. Flip-chip, face-up and face-down centerbond memory wirebond assemblies
US8970028B2 (en) 2011-12-29 2015-03-03 Invensas Corporation Embedded heat spreader for package with multiple microelectronic elements and face-down connection
US8952516B2 (en) 2011-04-21 2015-02-10 Tessera, Inc. Multiple die stacking for two or more die
US8338963B2 (en) 2011-04-21 2012-12-25 Tessera, Inc. Multiple die face-down stacking for two or more die
US8304881B1 (en) 2011-04-21 2012-11-06 Tessera, Inc. Flip-chip, face-up and face-down wirebond combination package
US8633576B2 (en) 2011-04-21 2014-01-21 Tessera, Inc. Stacked chip-on-board module with edge connector
US9013033B2 (en) 2011-04-21 2015-04-21 Tessera, Inc. Multiple die face-down stacking for two or more die
KR20150046117A (ko) * 2012-08-23 2015-04-29 피에스5 뤽스코 에스.에이.알.엘. 장치 및 그 제조 방법
WO2014167871A1 (ja) * 2013-04-10 2014-10-16 株式会社村田製作所 半導体装置
US9123555B2 (en) 2013-10-25 2015-09-01 Invensas Corporation Co-support for XFD packaging
US9871007B2 (en) * 2015-09-25 2018-01-16 Intel Corporation Packaged integrated circuit device with cantilever structure
US10083920B1 (en) * 2018-02-01 2018-09-25 Google Llc Package stiffener for protecting semiconductor die
KR102556518B1 (ko) * 2018-10-18 2023-07-18 에스케이하이닉스 주식회사 상부 칩 스택을 지지하는 서포팅 블록을 포함하는 반도체 패키지
US11495505B2 (en) 2019-06-03 2022-11-08 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor devices and related methods
US11398455B2 (en) * 2019-06-03 2022-07-26 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor devices and related methods
KR102767617B1 (ko) * 2019-08-12 2025-02-17 에스케이하이닉스 주식회사 적층 반도체 칩을 포함하는 반도체 패키지
KR20230164794A (ko) 2022-05-25 2023-12-05 삼성전자주식회사 반도체 패키지

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KR20050016540A (ko) * 2002-06-11 2005-02-21 리플렉티버티 인코퍼레이티드 웨이퍼 기판 상에 마이크로-전기기계식 장치를 적층,현출, 및 패키지하는 방법

Also Published As

Publication number Publication date
US20080136006A1 (en) 2008-06-12
JP2008147669A (ja) 2008-06-26
TWI345298B (en) 2011-07-11
JP2012064983A (ja) 2012-03-29
TW200834873A (en) 2008-08-16
US7772683B2 (en) 2010-08-10
KR20080053233A (ko) 2008-06-12
JP5397964B2 (ja) 2014-01-22
JP4947656B2 (ja) 2012-06-06

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