JP2008147669A - 積み重ねられた集積回路パッケージインパッケージシステム - Google Patents
積み重ねられた集積回路パッケージインパッケージシステム Download PDFInfo
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- JP2008147669A JP2008147669A JP2007317306A JP2007317306A JP2008147669A JP 2008147669 A JP2008147669 A JP 2008147669A JP 2007317306 A JP2007317306 A JP 2007317306A JP 2007317306 A JP2007317306 A JP 2007317306A JP 2008147669 A JP2008147669 A JP 2008147669A
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Abstract
【解決手段】積重ねられた集積回路パッケージインパッケージシステム(1100)は、上面(204)および底面(208)を有する基板(102)を形成することと、上面(204)の上に第1の装置(112)を取付けることと、ずらされた構成で第1の装置(112)の上に第2の装置(114)を積重ねることと、第1の装置(112)と底面(208)との間に第1の内部相互接続(212)を接続することと、第2の装置(114)と底面(208)との間に第2の内部相互接続(218)を接続することと、第1の装置(112)および第2の装置(114)を封止することとを含んで与えられる。
【選択図】図2
Description
本出願は、「積重ねられた集積回路パッケージインパッケージシステム(Stacked Integrated Circuit Package-in-Package System)」と題されて、オースグ・キム(Ohsug Kim)、ジョン−ウー・ハ(Jong-Woo Ha)、およびジョン・ウォーク・ジュ(Jong Wook Ju)によって同時に出願されている米国特許出願に関連する主題を含む。この関連出願は、スタッツチップパック社(STATS ChipPAC Ltd)に譲渡され、事件整理番号27−302として特定される。
本発明は概して集積回路パッケージに関し、より特定的には積重ねられた集積回路パッケージインパッケージシステムに関する。
エレクトロニクスは、より多くの集積回路を1つの集積回路パッケージに要求する一方で、増大した集積回路内容に対してシステムに与える物理的なスペースは、逆説的にますます少なくなっている。ある技術では主に、各集積回路により多くの機能を集積化することに注力している。他の技術では、これらの集積回路を単一のパッケージに積重ねることに注力している。これらの手法により集積回路内により多くの機能が与えられる一方で、高さをより低く、スペースをより小さく、かつコストを削減するための要件に完全に対応しているわけではない。
歩留まりを減じている。これらのスペーサは高さの減少量をも制限している。さまざまな種類の電気接続のために必要なスペースによって、たとえば高さ、幅および長さといったパッケージのサイズ全体が制限されている。
本発明は積重ねられた集積回路パッケージインパッケージシステムを与え、前記システムは、上面および底面を有する基板を形成すること、上面の上に第1の装置を取付けること、第1の装置の上に第2の装置をずらされた構成で積重ねること、第1の装置と底面との間に第1の内部相互接続を接続すること、第2の装置と底面との間に第2の内部相互接続を接続すること、および第1の装置と第2の装置とを封止することを含む。
以下の実施例は、当業者がこの発明を行い、使用することを可能にするのに十分に詳細に記載される。本開示に基づいて他の実施例が明らかになること、および本発明の範囲から逸脱することなく、システム上、プロセス上、または機械的な変更が行なわれ得ることが理解される。
よび/もしくは除去を含む。本願明細書に用いられるような用語「システム」は、用語が用いられるコンテキストに従って、この発明の方法および装置を意味し、指し示す。
含む。基板102は、上面204に頂部接触部202と、底面208に底部接触部206とを含む。外部相互接続110は底部接触部206の部分に付いている。例示目的で、基板102は頂部接触部202および底部接触部206を有して示されるが、基板102が1つ以上のルート層または電気的ビアなどの他の構造を有してもよいことが理解される。
相互接続212、第2の内部相互接続218、および上面204を覆う。パッケージ封止部220は第1の開口部104をも埋めて、第1の底成型高さ224を備えた第1の底成型部222を形成する。同様に、パッケージ封止部220は第2の開口部106を埋めて、第2の底成型高さ228を備えた第2の底成型部226を形成する。パッケージ封止部220は第2の装置114を部分的に覆い、積重ねられた集積回路パッケージインパッケージシステム100に最小のパッケージ高さを与える。例示目的で、パッケージ封止部220が第2の装置114を露出するように記載されるが、パッケージ封止部220は第2の装置114を露出しなくてもよいことが理解される。
予期せず発見された原理的な局面は、本発明が、全体サイズが減少し、伝熱能力が向上し、EMI性能が向上し、信頼性性能が向上したBOCおよび積重ねられたずらされた構成をもたらす、積重ねられた集積回路パッケージインパッケージシステムをもたらすことであった。
Claims (10)
- 上面(204)および底面(208)を有する基板(102)を形成することと、
上面(204)の上に第1の装置(112)を取付けることと、
第1の装置(112)の上に第2の装置(114)をずらされた構成で積重ねることと、
第1の装置(112)と底面(208)との間に第1の内部相互接続(212)を接続することと、
第2の装置(114)と底面(208)との間に第2の内部相互接続(218)を接続することと、さらに
第1の装置(112)および第2の装置(114)を封止することとを含む、積重ねられた集積回路パッケージインパッケージシステム(1100)。 - 基板(102)を形成することは、
基板(102)において第1の開口部(104)および第2の開口部(106)を形成することを含み、
第1の装置(112)と底面(208)との間に第1の内部相互接続(212)を接続することはまた、
第1の開口部(104)を通して第1の内部相互接続(212)によって第1の装置(112)と底面(208)とを接続することを含み、
第2の装置(114)と底面(208)との間に第2の内部相互接続(218)を接続することはさらに、
第2の開口部(106)を通して第2の内部相互接続(218)によって第2の装置(114)と底面(208)とを接続することを含む、請求項1に記載のシステム(1100)。 - 基板(402)を形成することは、
基板(402)において第1の凹部(404)および第2の凹部(406)を形成することを含み、
第1の装置(412)と底面(508)との間に第1の内部相互接続(512)を接続することはまた、
第1の凹部(404)を通して第1の内部相互接続(512)によって第1の装置(412)および底面(508)を接続することを含み、
第2の装置(414)と底面(508)との間に第2の内部相互接続(518)を接続することはさらに、
第2の凹部(406)のまわりに第2の内部相互接続(518)によって第2の装置(414)および底面(508)を接続することを含む、請求項1に記載のシステム(1100)。 - 装置封止部(320)において第1の集積回路ダイ(302)を有する第1の装置(300)を形成することをさらに含む、請求項1に記載のシステム(1100)。
- 装置封止部(820)において補強材(822)を有する第1の装置(800)を形成することをさらに含む、請求項1に記載のシステム(1100)。
- 上面(204)および底面(208)を有する基板(102)と、
上面(204)の上の第1の装置(112)と、
ずらされた構成における第1の装置(112)の上の第2の装置(114)と、
底面(208)と第1の装置(112)との間の第1の内部相互接続(212)と、
底面(208)と第2の装置(114)との間の第2の内部相互接続(218)と、
第1の装置(112)および第2の装置(114)を覆うパッケージ封止部(220)とを含む、積重ねられた集積回路パッケージインパッケージシステム(100)。 - 基板(102)は第1の開口部(104)および第2の開口部(106)を有し、
第1の内部相互接続(212)は第1の開口部(104)にあり、
第2の内部相互接続(218)は第2の開口部(106)にある、請求項6に記載のシステム(100)。 - 基板(402)は第1の凹部(404)および第2の凹部(406)を有し、
第1の内部相互接続(512)は第1の凹部(404)のまわりにあり、
第2の内部相互接続(518)は第2の凹部(406)のまわりにある、請求項6に記載のシステム(400)。 - 第1の装置(300)は装置封止部(320)において第1の集積回路ダイ(302)を有する、請求項6に記載のシステム(300)。
- 第1の装置(800)は装置封止部(820)において補強材(822)を有する、請求項6に記載のシステム(1100)。
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