KR101380879B1 - 이중 온도 영역을 갖는 정전기 척을 구비한 기판 지지대 - Google Patents

이중 온도 영역을 갖는 정전기 척을 구비한 기판 지지대 Download PDF

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Publication number
KR101380879B1
KR101380879B1 KR1020060129234A KR20060129234A KR101380879B1 KR 101380879 B1 KR101380879 B1 KR 101380879B1 KR 1020060129234 A KR1020060129234 A KR 1020060129234A KR 20060129234 A KR20060129234 A KR 20060129234A KR 101380879 B1 KR101380879 B1 KR 101380879B1
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KR
South Korea
Prior art keywords
substrate
ceramic puck
electrostatic chuck
ceramic
receiving
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KR1020060129234A
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English (en)
Korean (ko)
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KR20070105828A (ko
Inventor
알렉산더 마츄쉬킨
데니스 쿠사우
테오도로스 파나고포우로스
존 홀랜드
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20070105828A publication Critical patent/KR20070105828A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020060129234A 2006-04-27 2006-12-18 이중 온도 영역을 갖는 정전기 척을 구비한 기판 지지대 KR101380879B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US79601306P 2006-04-27 2006-04-27
US60/796,013 2006-04-27

Publications (2)

Publication Number Publication Date
KR20070105828A KR20070105828A (ko) 2007-10-31
KR101380879B1 true KR101380879B1 (ko) 2014-04-02

Family

ID=38769279

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020060129234A KR101380879B1 (ko) 2006-04-27 2006-12-18 이중 온도 영역을 갖는 정전기 척을 구비한 기판 지지대
KR1020070041285A KR101387598B1 (ko) 2006-04-27 2007-04-27 이중 온도 영역을 갖는 정전기 척을 구비한 기판 지지대

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020070041285A KR101387598B1 (ko) 2006-04-27 2007-04-27 이중 온도 영역을 갖는 정전기 척을 구비한 기판 지지대

Country Status (4)

Country Link
JP (2) JP5069452B2 (zh)
KR (2) KR101380879B1 (zh)
CN (4) CN102593031B (zh)
TW (2) TWI357629B (zh)

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US8270141B2 (en) * 2009-11-20 2012-09-18 Applied Materials, Inc. Electrostatic chuck with reduced arcing
US8613288B2 (en) * 2009-12-18 2013-12-24 Lam Research Ag High temperature chuck and method of using same
JP5267603B2 (ja) * 2010-03-24 2013-08-21 Ｔｏｔｏ株式会社 静電チャック
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US9888528B2 (en) * 2014-12-31 2018-02-06 Applied Materials, Inc. Substrate support with multiple heating zones
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US9870934B2 (en) 2015-07-28 2018-01-16 Micron Technology, Inc. Electrostatic chuck and temperature-control method for the same
US9691645B2 (en) 2015-08-06 2017-06-27 Applied Materials, Inc. Bolted wafer chuck thermal management systems and methods for wafer processing systems
TWI808334B (zh) * 2015-08-06 2023-07-11 美商應用材料股份有限公司 工件握持器
KR20180082509A (ko) * 2015-12-07 2018-07-18 어플라이드 머티어리얼스, 인코포레이티드 병합형 커버 링
US10582570B2 (en) * 2016-01-22 2020-03-03 Applied Materials, Inc. Sensor system for multi-zone electrostatic chuck
US10079168B2 (en) * 2016-11-08 2018-09-18 Lam Research Corporation Ceramic electrostatic chuck including embedded Faraday cage for RF delivery and associated methods for operation, monitoring, and control
US10246777B2 (en) * 2017-06-12 2019-04-02 Asm Ip Holding B.V. Heater block having continuous concavity
US11387134B2 (en) * 2018-01-19 2022-07-12 Applied Materials, Inc. Process kit for a substrate support
JP6522180B1 (ja) * 2018-02-08 2019-05-29 Ｓｐｐテクノロジーズ株式会社 基板載置台及びこれを備えたプラズマ処理装置及びプラズマ処理方法
KR102423380B1 (ko) 2018-09-13 2022-07-22 엔지케이 인슐레이터 엘티디 웨이퍼 배치 장치
CN113711343A (zh) * 2019-02-05 2021-11-26 应用材料公司 用于吸附用于沉积工艺的掩模的基板支撑件
US11887878B2 (en) * 2019-06-28 2024-01-30 Applied Materials, Inc. Detachable biasable electrostatic chuck for high temperature applications
CN110331386A (zh) * 2019-07-09 2019-10-15 长江存储科技有限责任公司 在半导体晶圆上形成薄膜的方法
JP7390880B2 (ja) * 2019-12-05 2023-12-04 東京エレクトロン株式会社 エッジリング及び基板処理装置
US11551951B2 (en) 2020-05-05 2023-01-10 Applied Materials, Inc. Methods and systems for temperature control for a substrate
CN111607785A (zh) * 2020-05-26 2020-09-01 北京北方华创微电子装备有限公司 一种加热装置及半导体加工设备
TWI748774B (zh) * 2020-12-01 2021-12-01 天虹科技股份有限公司 晶圓承載盤及應用晶圓承載盤的薄膜沉積裝置
CN114959654B (zh) * 2021-02-26 2024-01-09 鑫天虹(厦门)科技有限公司 晶圆承载盘及应用晶圆承载盘的薄膜沉积装置
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Also Published As

Publication number Publication date
KR101387598B1 (ko) 2014-04-23
TW200807606A (en) 2008-02-01
CN101093811A (zh) 2007-12-26
JP2007300057A (ja) 2007-11-15
JP5183092B2 (ja) 2013-04-17
CN101093812A (zh) 2007-12-26
CN102593031A (zh) 2012-07-18
JP5069452B2 (ja) 2012-11-07
TWI463588B (zh) 2014-12-01
CN101093811B (zh) 2012-04-25
CN101887865A (zh) 2010-11-17
TWI357629B (en) 2012-02-01
TW200809999A (en) 2008-02-16
JP2007300119A (ja) 2007-11-15
CN102593031B (zh) 2015-09-16
CN101887865B (zh) 2013-06-19
KR20070105929A (ko) 2007-10-31
KR20070105828A (ko) 2007-10-31

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