KR101376850B1 - 기판 처리 장치 및 처리액 부여 방법 - Google Patents

기판 처리 장치 및 처리액 부여 방법 Download PDF

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Publication number
KR101376850B1
KR101376850B1 KR1020120079235A KR20120079235A KR101376850B1 KR 101376850 B1 KR101376850 B1 KR 101376850B1 KR 1020120079235 A KR1020120079235 A KR 1020120079235A KR 20120079235 A KR20120079235 A KR 20120079235A KR 101376850 B1 KR101376850 B1 KR 101376850B1
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KR
South Korea
Prior art keywords
substrate
slider
auxiliary
coating liquid
piping
Prior art date
Application number
KR1020120079235A
Other languages
English (en)
Korean (ko)
Other versions
KR20130028852A (ko
Inventor
무네아키 오에
유키히로 다카무라
슈이치 사가라
류스케 이토
Original Assignee
다이니폰 스크린 세이조우 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 다이니폰 스크린 세이조우 가부시키가이샤 filed Critical 다이니폰 스크린 세이조우 가부시키가이샤
Publication of KR20130028852A publication Critical patent/KR20130028852A/ko
Application granted granted Critical
Publication of KR101376850B1 publication Critical patent/KR101376850B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02623—Liquid deposition
    • H01L21/02628—Liquid deposition using solutions

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Spray Control Apparatus (AREA)
KR1020120079235A 2011-09-12 2012-07-20 기판 처리 장치 및 처리액 부여 방법 KR101376850B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011197998A JP5844099B2 (ja) 2011-09-12 2011-09-12 基板処理装置及び処理液付与方法
JPJP-P-2011-197998 2011-09-12

Publications (2)

Publication Number Publication Date
KR20130028852A KR20130028852A (ko) 2013-03-20
KR101376850B1 true KR101376850B1 (ko) 2014-03-20

Family

ID=47921831

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120079235A KR101376850B1 (ko) 2011-09-12 2012-07-20 기판 처리 장치 및 처리액 부여 방법

Country Status (4)

Country Link
JP (1) JP5844099B2 (zh)
KR (1) KR101376850B1 (zh)
CN (1) CN102992641B (zh)
TW (1) TWI462210B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6220693B2 (ja) * 2014-02-14 2017-10-25 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置
JP6527716B2 (ja) * 2015-02-27 2019-06-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理装置の制御方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009195851A (ja) 2008-02-22 2009-09-03 Dainippon Screen Mfg Co Ltd 塗布装置
JP2011072974A (ja) 2009-10-02 2011-04-14 Dainippon Screen Mfg Co Ltd 塗布装置
JP2011072975A (ja) 2009-10-02 2011-04-14 Dainippon Screen Mfg Co Ltd 塗布装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10217496A (ja) * 1997-02-06 1998-08-18 Citizen Watch Co Ltd インクジェット記録装置
TWI234796B (en) * 2002-03-04 2005-06-21 Tokyo Electron Ltd Solution treatment method and solution treatment unit
JP4321270B2 (ja) * 2004-01-14 2009-08-26 ブラザー工業株式会社 インクジェット記録装置
JP5154991B2 (ja) * 2008-03-27 2013-02-27 大日本スクリーン製造株式会社 基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009195851A (ja) 2008-02-22 2009-09-03 Dainippon Screen Mfg Co Ltd 塗布装置
JP2011072974A (ja) 2009-10-02 2011-04-14 Dainippon Screen Mfg Co Ltd 塗布装置
JP2011072975A (ja) 2009-10-02 2011-04-14 Dainippon Screen Mfg Co Ltd 塗布装置

Also Published As

Publication number Publication date
TWI462210B (zh) 2014-11-21
CN102992641B (zh) 2016-02-10
KR20130028852A (ko) 2013-03-20
TW201312677A (zh) 2013-03-16
JP5844099B2 (ja) 2016-01-13
JP2013059706A (ja) 2013-04-04
CN102992641A (zh) 2013-03-27

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