KR101299763B1 - 기판 냉각 장치 및 기판 냉각 방법 - Google Patents

기판 냉각 장치 및 기판 냉각 방법 Download PDF

Info

Publication number
KR101299763B1
KR101299763B1 KR1020070007599A KR20070007599A KR101299763B1 KR 101299763 B1 KR101299763 B1 KR 101299763B1 KR 1020070007599 A KR1020070007599 A KR 1020070007599A KR 20070007599 A KR20070007599 A KR 20070007599A KR 101299763 B1 KR101299763 B1 KR 101299763B1
Authority
KR
South Korea
Prior art keywords
substrate
cooling
board
heating
cooled
Prior art date
Application number
KR1020070007599A
Other languages
English (en)
Korean (ko)
Other versions
KR20070077793A (ko
Inventor
야스타카 소우마
미츠히로 사카이
노리오 와다
?이치 야히로
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20070077793A publication Critical patent/KR20070077793A/ko
Application granted granted Critical
Publication of KR101299763B1 publication Critical patent/KR101299763B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Tunnel Furnaces (AREA)
KR1020070007599A 2006-01-24 2007-01-24 기판 냉각 장치 및 기판 냉각 방법 KR101299763B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006015251A JP4537324B2 (ja) 2006-01-24 2006-01-24 基板冷却装置、基板冷却方法、制御プログラム、コンピュータ読取可能な記憶媒体
JPJP-P-2006-00015251 2006-01-24

Publications (2)

Publication Number Publication Date
KR20070077793A KR20070077793A (ko) 2007-07-27
KR101299763B1 true KR101299763B1 (ko) 2013-08-23

Family

ID=38455307

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070007599A KR101299763B1 (ko) 2006-01-24 2007-01-24 기판 냉각 장치 및 기판 냉각 방법

Country Status (4)

Country Link
JP (1) JP4537324B2 (ja)
KR (1) KR101299763B1 (ja)
CN (1) CN100521078C (ja)
TW (1) TW200739843A (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4542577B2 (ja) * 2007-09-19 2010-09-15 東京エレクトロン株式会社 常圧乾燥装置及び基板処理装置及び基板処理方法
JP2009158792A (ja) * 2007-12-27 2009-07-16 Dainippon Screen Mfg Co Ltd 基板処理装置
KR100921523B1 (ko) * 2008-05-30 2009-10-12 세메스 주식회사 평판 디스플레이 제조에 사용되는 기판 처리 장치 및 방법
JP4675401B2 (ja) * 2008-08-29 2011-04-20 東京エレクトロン株式会社 基板搬送装置
JP5635378B2 (ja) * 2010-11-30 2014-12-03 日東電工株式会社 半導体ウエハ搬送方法および半導体ウエハ搬送装置
KR101105387B1 (ko) * 2010-12-13 2012-01-16 주식회사 에스아이이 기판 건조장치
CN102651303B (zh) * 2011-05-09 2014-12-10 京东方科技集团股份有限公司 基板温度管控系统及方法
JP2013098300A (ja) * 2011-10-31 2013-05-20 Tokyo Electron Ltd 熱処理装置および熱処理方法
JP6964005B2 (ja) * 2018-01-09 2021-11-10 東京エレクトロン株式会社 熱処理装置、熱板の冷却方法及びコンピュータ読み取り可能な記録媒体
CN108842143A (zh) * 2018-07-09 2018-11-20 上海新昇半导体科技有限公司 外延炉冷却系统及冷却方法
WO2020148877A1 (ja) * 2019-01-17 2020-07-23 住友電工ウインテック株式会社 導体軟化処理装置及び導体軟化処理方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010020972A (ko) * 1999-06-09 2001-03-15 히가시 데쓰로 기판처리장치
KR20010029969A (ko) * 1999-07-19 2001-04-16 히가시 데쓰로 기판처리장치 및 기판처리방법
KR20010112463A (ko) * 1999-04-27 2001-12-20 다니구찌 이찌로오, 기타오카 다카시 레이저가공기의 가공조건 제어방법 및 이를 위한프로그램을 기록한 컴퓨터 판독가능한 기록매체
JP2004299850A (ja) * 2003-03-31 2004-10-28 Dainippon Printing Co Ltd 処理方法及び処理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0715873B2 (ja) * 1983-11-30 1995-02-22 株式会社東芝 レジストパターン形成方法
JPS6119131A (ja) * 1984-07-06 1986-01-28 Toshiba Corp レジスト処理装置
JPS6428918A (en) * 1987-07-24 1989-01-31 Mitsubishi Electric Corp Resist baking device
JP3872535B2 (ja) * 1996-03-14 2007-01-24 株式会社オーク製作所 ワークの電荷の消去中和装置
JP4380966B2 (ja) * 2002-05-20 2009-12-09 富士フイルム株式会社 感光層転写方法および装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010112463A (ko) * 1999-04-27 2001-12-20 다니구찌 이찌로오, 기타오카 다카시 레이저가공기의 가공조건 제어방법 및 이를 위한프로그램을 기록한 컴퓨터 판독가능한 기록매체
KR20010020972A (ko) * 1999-06-09 2001-03-15 히가시 데쓰로 기판처리장치
KR20010029969A (ko) * 1999-07-19 2001-04-16 히가시 데쓰로 기판처리장치 및 기판처리방법
JP2004299850A (ja) * 2003-03-31 2004-10-28 Dainippon Printing Co Ltd 処理方法及び処理装置

Also Published As

Publication number Publication date
CN100521078C (zh) 2009-07-29
CN101009210A (zh) 2007-08-01
JP2007200994A (ja) 2007-08-09
TWI325168B (ja) 2010-05-21
JP4537324B2 (ja) 2010-09-01
KR20070077793A (ko) 2007-07-27
TW200739843A (en) 2007-10-16

Similar Documents

Publication Publication Date Title
KR101299763B1 (ko) 기판 냉각 장치 및 기판 냉각 방법
KR101269748B1 (ko) 가열 처리 장치
KR101299898B1 (ko) 기판 냉각 장치
JP4672538B2 (ja) 加熱処理装置
JP4592787B2 (ja) 基板処理装置
JP4372182B2 (ja) 基板支持機構及び減圧乾燥装置及び基板処理装置
KR100274859B1 (ko) 열처리장치 및 기판처리장치
KR101069494B1 (ko) 도포막형성장치
JP2010056104A (ja) 基板処理装置
JP2008160011A (ja) 基板処理装置
JP4813583B2 (ja) 基板処理装置
JP4620536B2 (ja) 基板処理装置
KR101300892B1 (ko) 기판의 처리 방법 및 컴퓨터 독취 가능한 기억 매체
TWI797325B (zh) 基板處理裝置及基板處理方法
JP5400751B2 (ja) 加熱処理装置、およびこれを備える塗布現像装置
JP7405889B2 (ja) 基板処理装置および基板処理方法
JP5065121B2 (ja) レジスト液供給装置、レジスト液供給方法、プログラム及びコンピュータ記憶媒体
JP2005270932A (ja) 塗布膜形成装置
JP2011035186A (ja) 塗布処理装置、塗布処理方法、プログラム及びコンピュータ記憶媒体
JP2009158792A (ja) 基板処理装置
JP2001023892A (ja) 基板処理装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20160721

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20170720

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20180801

Year of fee payment: 6